Bystronic Laser AG

A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. According to the disclosure the cutting process is interrupted after a first partial processing step, whereupon a partial section (K 1 . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted, and the cutting process continued with the changed set of cutting parameters.

The present disclosure relates to a machining apparatus for laser machining a workpiece, such as laser cutting. The apparatus includes a machining laser source for generating a machining laser beam; an illumination laser source having a power for generating an illumination laser beam having a spectral range; an outlet opening for the machining laser beam and the illumination laser beam; and a laser beam guiding device which is designed such that the machining laser beam and the illumination laser beam emerge coaxially through the outlet opening; wherein at least one element selected from the power of the illumination laser source and the spectral range of the illumination laser beam is selected such that the illumination by the illumination laser beam is brighter than a self-emission of the workpiece in a machining region during laser machining. Additionally, a method for laser machining a workpiece is also included in the present disclosure.

A laser beam machining device ( 1 ) is provided, in which unfocused light (A) from a light exit point (B) is radiated onto a single lens ( 8 ), where in the lens ( 8 ) focuses the laser light (A) and guides it onto a machining point of a work piece ( 7 ). A distance (m a , m b ) between the lens ( 8 ) and the light exit point (B) and a distance (l a , l b ) between the lens ( 8 ) and the machining point of the workpiece ( 7 ) and a distance between the light exit point (B) and the aforementioned machining point can be varied. Moreover, a process of usage of a laser beam machining device ( 1 ) is provided.

The present invention relates to a removal system and a method for removing parts processed in a processing system ( 200 ). The removal system is designed for engagement with a transportation unit ( 110 ) which is used for intermediate storage and/or transportation of a workpiece processed with the processing system ( 200 ), the processed workpiece comprising the parts to be removed. The removal system comprises a bridge movement system ( 120 ) which extends with its central longitudinal axis transversely to the longitudinal axis of the transportation unit ( 110 ) and can be moved axially in the longitudinal axis of the transportation unit ( 110 ). In addition, the removal system comprises a first parts conveyor system, which is arranged on the bridge movement system ( 120 ) and extends substantially parallel to the central longitudinal axis of the bridge movement system. Finally, the removal system comprises control unit which communicates with the transportation unit, the bridge movement system and the first parts conveyor system and provides control commands for the transportation unit, the bridge movement system and the parts conveyor system.

The invention relates to a machining head ( 1 ) for laser machining machines, in particular for laser cutting machines, having an interface to a laser light source ( 3 ), preferably to fiber-coupled or fiber-based laser sources. Said laser sources are designed for more than 500 W of average output power in the near infrared region. The interface is preferably designed for coupling an optical waveguide ( 2 ) for the working laser beam ( 6 ). The machining head ( 1 ) also has a focusing optical unit ( 11 ) having preferably only one imaging lens. A deflecting assembly ( 9, 10 ) for at least one single deflection of the working laser beam ( 6 ) is arranged between the interface and the focusing optical unit ( 11 ). Said deflecting assembly ( 9, 10 ) is designed as a passive optical element that changes the divergence of the working laser beam ( 6 ) in dependence on power.

The present disclosure relates to a suction device configured for a laser processing machine with a laser processing head which can be moved over a workpiece holder, with a fan and several flaps which are to be opened selectively to generate an air flow and which are in communication with the fan, and with a control configured to detect the position and operating state of the laser processing head and to control the flaps as a function of the detected position and the operating state of the laser processing head.

The invention relates to a method for collision avoidance of a laser machining head ( 102 ) in a machining space ( 106 ) of a laser machining tool ( 100 ), having the steps of; Monitoring a workpiece ( 112 ) in the machining space ( 106 ) with at least one optical sensor; Capturing images of the workpiece ( 112 ); Detecting a change in an image of the workpiece ( 112 ); Recognising whether the change comprises an object standing upright relative to the workpiece ( 112 ); Checking for a collision between the upright object and the laser machining head ( 102 ) based on a predetermined cutting plan and/or the current position (1016) of the laser machining head; Controlling the drives for moving the laser machining head ( 102 ) for collision avoidance in case of recognised risk of collision.

The invention relates to a method for controlling a jet cutting device ( 15 ) having a cutting tool ( 21 ), by means of which at least one workpiece part ( 18 ) can be cut out of a workpiece ( 16 ) along a cutting contour ( 17 ). At least one cutting plan ( 48 ) for the workpiece ( 16 ) having at least one cutting contour ( 17 ) for at least one workpiece part ( 18 ) to be cut out of the workpiece ( 16 ) is specified (step a)). Subsequently, the relative position of the workpiece ( 16 ) and/or of the cutting plan ( 48 ) and/or of the workpiece part ( 18 ) to be cut out is determined (step b)). Then, the relative position of the at least one support point ( 32 ) of the workpiece support ( 30; 130 ) is determined (step c)). Subsequently, at least one risk region ( 28 ) on the cutting contour ( 17 ) of the workpiece part ( 18 ) to be cut out is determined (step d)), followed by the defining of at least one starting-cut point ( 29 ) and/or one cut-away point ( 129 ) for the cutting tool ( 21 ) on the cutting contour ( 17 ) of the workpiece part ( 18 ) to be cut out. The invention further relates to a computer-implemented method and to a jet cutting device ( 15 ).

A device and a method for monitoring beam treatment of a workpiece are provided. The device includes at least one illuminating device ( 12 ) for illuminating a treatment region of the workpiece during first time intervals; a detecting device ( 15 ) for detecting an electromagnetic radiation emanating from the treatment region; and a processing device ( 19 ) for separate processing of the electromagnetic radiation detected within the first and within second time intervals. Moreover, a device and a method for laser beam treatment of a workpiece are provided.