Company patents
Eagle Technology, LLC
Eagle Technology, LLC's patent strategy reveals a surprising shift away from core semiconductor and manufacturing areas, with significant declines in "Printed Circuits & Electronic Assemblies" (down 68.8% in 2025) and "Plastics Shaping & Molding" (down 66.7% in 2025). Concurrently, the company is demonstrating an emerging focus on "Electrical Measurement," which saw a remarkable 300.0% year-over-year growth in 2026 so far, and a strong resurgence in "Optical Elements & Systems," growing 100.0% in 2026, indicating a pivot towards specialized electronics hardware.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
288 US filings (since 2023) · 12 categories · 29 themes
Systems and methods for electronically steering or shaping antenna beams by controlling the phase and amplitude of signals fed to individual elements in an array, including calibration techniques and multi-antenna configurations.
Design and manufacturing techniques for incorporating antenna structures directly into electronic devices, product housings, or materials, often under constraints of space, aesthetics, or environmental factors.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Antennas engineered to operate effectively across a wide continuous range of frequencies (broadband) or multiple distinct frequency bands, often requiring specific radiating element geometries or impedance matching circuits.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Techniques and hardware architectures for optimizing the radio frequency (RF) front-end, antenna systems, and beamforming strategies in wireless networks to improve signal quality, capacity, and interference mitigation.
Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.
Methods and apparatus for measuring magnetic fields or utilizing magnetic resonance principles for medical diagnostics, material analysis, or precise localization, including gradient field measurement in MRI.
Developing and applying machine learning algorithms that leverage quantum computing principles, such as quantum circuits or autoencoders, for tasks like simulation or data processing.
Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.
Techniques and structures used to reduce unwanted electromagnetic coupling, scattering, or interference between multiple antennas, different frequency bands, or sensitive electronic components within a device.
Innovations in the physical components and architectures of radar, lidar, and sonar systems, including antenna design, RF signal generation, beam steering mechanisms, and optical elements for improved performance.
Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Technologies for transmitting critical alerts and information during emergencies, often involving wireless networks, specialized devices, and protocols to ensure timely and targeted communication to users or emergency services.
The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.
Methods and systems for accurately determining the absolute or relative position of an object or device, often integrating satellite navigation (GNSS), inertial measurement units (IMU), and local ranging or wireless communication technologies.
Methods and systems for generating, distributing, updating, rotating, and securely destroying cryptographic keys to maintain data confidentiality and integrity over time, including quantum key distribution.
Advanced sensing techniques leveraging quantum phenomena or highly sensitive optical methods, often involving interferometry, squeezed states, or exceptional points, to achieve enhanced measurement sensitivity for physical parameters.
Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.
Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.
Technologies enabling dynamic control over electromagnetic wave propagation using arrays of passive or active elements (unit cells) to reflect, refract, or absorb signals, often for channel optimization or energy efficiency.
Techniques utilizing deep learning models like Generative Adversarial Networks (GANs) or diffusion models to create new images, modify existing ones, or generate synthetic data based on various inputs or conditions.
Design and implementation of capacitive sensors, including methods for improving accuracy, reducing power consumption, compensating for environmental variations (like temperature), and analyzing complex displacement interactions.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Techniques for building three-dimensional metal objects layer-by-layer using metal powders, including powder bed fusion, binder jetting, and directed energy deposition. This theme encompasses process mechanics, equipment design, and operational control for AM systems.
Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.
Systems and methods for encrypting data at a fine-grained level (e.g., per data unit or based on sensitivity) and controlling access to it, often involving delegated authorization, contextual policies, or secure data sharing.
Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.
Patents
Showing 11-20 of 23
Device Enclosure & Material Engineering