Company patents

GRAPHCORE LIMITED

GRAPHCORE LIMITED's patent strategy reveals a significant shift, with its core areas like Operating Systems & Program Control (43.6% of portfolio) and Computer Hardware Architecture (36.5% of portfolio) experiencing sharp declines in patenting activity, down 78.3% and 50.0% respectively in 2025. This broad decline across most categories, including a 100.0% drop in System Reliability & Diagnostics in 2026 so far, suggests a strategic pivot away from broad foundational IP protection, though a notable emerging focus is seen in Physical Transmission & Modulation, which grew by 100.0% in 2026.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

156 US filings (since 2023) · 12 categories · 10 themes

Specialized Compute Architectures

Novel hardware designs and processing pipelines tailored for specific computational tasks, such as graphics rendering, neural network operations, or matrix transformations, often involving custom circuits, memory arrays, or data flow mechanisms.

Computer Hardware Architecture
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84since 2023
-59.1%YoY
AI/ML Hardware Acceleration

Specialized hardware, architectural designs, and computational methods to improve the speed, efficiency, and security of artificial intelligence and machine learning model execution, particularly for inference and data processing.

Computer Hardware ArchitectureMachine Learning & AIHardware Platform (Cooling, Power, Packaging)
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34since 2023
-60.0%YoY
Heterogeneous Chiplet Integration

Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.

Multi-Chip & 3D Assemblies
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23since 2023
+150.0%YoY
Memory System Performance & Reliability

Hardware and control techniques for optimizing memory access latency, ensuring data integrity, and managing storage resources efficiently. This includes error correction, read/write voltage control, and intelligent data placement or in-memory computation.

Computer Hardware Architecture
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19since 2023
0.0%YoY
High-Speed Data Interconnects

Technologies for establishing and managing high-bandwidth, low-latency communication pathways between computing components, peripherals, or systems, focusing on signal integrity, synchronization, and interface standards.

Computer Hardware ArchitectureMulti-Chip & 3D Assemblies
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14since 2023
-50.0%YoY
3D Die Stacking & Vertical Interconnects

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Multi-Chip & 3D AssembliesChip-to-Chip Interconnect (Bonding, Bumps)Semiconductor Packaging & Encapsulation
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6since 2023
new
Semiconductor Electrical Test

Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.

Electrical Measurement
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6since 2023
n/a
Flexible Frame Structures & Resource Grouping

Design and configuration of adaptable frame structures, resource block groupings, and subcarrier spacings to optimize data transmission across diverse wireless environments and services, including considerations for fronthaul interfaces.

Physical Transmission & Modulation
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5since 2023
new
Physical Layer & Interface Optimization

Enhancements to the physical and data link layers of network communication, focusing on hardware components, signal integrity, power efficiency, and efficient data transfer mechanisms for specific interfaces and buses.

Routing, Switching & QoS
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3since 2023
+100.0%YoY
Package Thermal Management

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Multi-Chip & 3D AssembliesSemiconductor Packaging & Encapsulation
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2since 2023
new

Patents

Showing 201-210 of 285

Page 21 of 29
US 11269806 B2GRANTED
G06F15/80

Data exchange pathways between pairs of processing units in columns in a computer

Filed:2019-05-22Pub:2022-03-08
Applicant:Graphcore Limited

A time deterministic computer is architected so that exchange code compiled for one set of tiles, e.g., a column, can be reused on other sets. The computer comprises: a plurality of processing units each having an input interface with a set of input wires, and an output interface with a set of output wires; a switching fabric connected to each of the processing units by the respective set of output wires and connectable to each of the processing units by the respective set of output wires and connectable to each of the processing units by the respective input wires via switching circuitry controllable by its associated processing unit; the processing units arranged in columns, each column having a base processing unit proximate the switching fabric and multiple processing units one adjacent the other in respective positions in the direction of the column, wherein to implement exchange of data between the processing units at least one processing unit is configured to transmit at a transmit time a data packet intended for a recipient processing unit onto its output set of connection wires, the data packet having no destination identifier of the recipient processing unit but destined for receipt at the recipient processing unit with a predetermined delay relative to the transmit time, wherein the predetermined delay is dependent on an exchange pathway between the transmitting and recipient processing units, wherein the exchange pathway between any pair of transmitting and recipient processing unit at respective positions in one column has the same delay as the exchange pathway between each pair of transmitting and recipient processing units at corresponding respective positions in the other columns.

US 11262787 B2GRANTED
G06F1/12

Compiler method

Filed:2020-01-16Pub:2022-03-01
Applicant:Graphcore Limited

The invention relates to a computer implemented method of generating multiple programs to deliver a computerised function, each program to be executed in a processing unit of a computer comprising a plurality of processing units each having instruction storage for holding a local program, an execution unit for executing the local program and data storage for holding data, a switching fabric connected to an output interface of each processing unit and connectable to an input interface of each processing unit by switching circuitry controllable by each processing unit, and a synchronisation module operable to generate a synchronisation signal, the method comprising: generating a local program for each processing unit comprising a sequence of executable instructions; determining for each processing unit a relative time of execution of instructions of each local program whereby a local program allocated to one processing unit is scheduled to execute with a predetermined delay relative to a synchronisation signal a send instruction to transmit at least one data packet at a predetermined transmit time, relative to the synchronisation signal, destined for a recipient processing unit but having no destination identifier, and a local program allocated to the recipient processing unit is scheduled to execute at a predetermined switch time a switch control instruction to control the switching circuitry to connect its processing unit wire to the switching fabric to receive the data packet at a receive time.

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