Kateeva, Inc.

Techniques and structural designs for fabricating the physical layers of an OLED display, including material deposition, patterning, and methods to protect the active organic layers from environmental degradation like moisture and oxygen.

Systems and components for storing, delivering, circulating, and managing printing liquids (e.g., ink) to the printhead, often including features for pressure regulation, filtration, degassing, and balancing liquid levels.

Mechanisms and methods for preventing or removing clogs, ink residue, or contaminants from printhead nozzles and surfaces to ensure consistent print quality and extend printhead lifespan.

Technologies for precisely controlling the timing and volume of liquid droplet ejection, and for real-time or post-ejection monitoring of droplet trajectory, velocity, and nozzle health to maintain print accuracy and quality.

Innovations in the design and arrangement of piezoelectric or thermal actuators, drive electronics, and fluidic structures within the printhead to achieve precise and efficient liquid ejection.

Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.

Novel formulations and mechanisms for initiating or controlling the polymerization and cross-linking of adhesives, including dual-curing systems, radical polymerization, and partial curing for tailored material properties.

Components and techniques aimed at improving the visual quality of OLED displays, such as color accuracy, contrast, brightness uniformity, and reducing reflections or glare through optical layers and coatings.

Engineering and fabrication of semiconductor structures incorporating quantum dots, often for quantum information processing (e.g., spin qubits) or advanced light-emitting applications, focusing on controlled growth and isolation.

Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.

Design aspects of user-replaceable cartridges or containers for printing consumables (e.g., ink, tape, labels) that facilitate easy installation, proper positioning, type identification, and reliable supply to the printer.

Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Involves the design and synthesis of semiconductor or perovskite nanocrystals and other nanostructures with tailored optical and electronic properties for advanced applications in light-emitting devices, displays, or quantum technologies.

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Development and optimization of organic chemical compounds and their structures, including guest-host systems and metal complexes, used within the emission layer to achieve specific light emission characteristics such as color, efficiency, and operational lifetime.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Mixtures of liquid crystal compounds and other additives, such as monomers or carbon black, designed to achieve specific optical, electrical, or physical properties for use in liquid crystal displays (LCDs) or other electro-optical devices.

Mechanisms and sensors for accurately conveying, positioning, loading, and managing various types of recording media (e.g., paper, fabric, labels) through a printing apparatus, and detecting their presence, type, or potential collision.

Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.