Lam Research Corporation

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.

Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Specialized cleaning techniques and apparatus designed for removing microscopic contaminants, residues, or films from sensitive substrates, such as semiconductor wafers or flat panel displays, often involving chemical, mechanical, or plasma-based methods.

Methods and systems for real-time monitoring and control of coating processes or chamber cleaning, utilizing sensor data (e.g., thermal, pressure, optical) and predictive models to ensure quality and optimize efficiency.

Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.

Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Development of novel chemical compositions for photoresists, including polymers, sensitizers, and crosslinking agents, to achieve improved lithographic performance such as resolution, sensitivity, line edge roughness, and etch resistance.

Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.

Techniques and systems for real-time or near-real-time measurement and adjustment of semiconductor manufacturing parameters (e.g., temperature, etch rate, ion beam uniformity) to ensure process quality and consistency.

Techniques and apparatus for achieving and maintaining vacuum conditions within charged particle and plasma processing chambers, including pump control, vacuum degree monitoring, and chamber sealing.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.

Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.

Focuses on the physical design, materials, and manufacturing processes for individual memory cells, including transistor structures, interconnects, and multi-layered (3D) architectures to enhance density and performance.

Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.

Processes involving chemical and mechanical forces to planarize surfaces (CMP) or wet chemical treatments for cleaning, etching, or material removal, often utilizing specialized compositions, nozzles, or fluid management systems.

Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.

Circuits designed to transform the impedance of a source to match the impedance of a load, maximizing power transfer or minimizing signal reflections, often involving inductors, capacitors, and transformers.

Methods and structures for encapsulating, interconnecting, and integrating impedance network components, particularly acoustic filters, into larger modules or systems.

Techniques and apparatus for measuring critical dimensions, overlay accuracy, defect detection, and surface topography in lithographic processes, often involving optical, laser, or charged particle beams.

Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Utilizing optical systems, cameras, and image processing algorithms for precise measurement of physical dimensions, alignment, defects, and features on semiconductor wafers or packages.

Techniques and devices for generating, shaping, focusing, and deflecting electron or ion beams, often involving multi-pole lenses, deflectors, and aberration correction for applications like microscopy or processing.

Methods and systems for identifying anomalies, failures, or impending issues within electric motors or their associated drive and power management circuits, often by monitoring electrical or operational parameters.

Application of protective layers to improve the durability and longevity of components by enhancing resistance to wear, oxidation, or chemical degradation in demanding operational environments.

Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.

Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.

Devices utilizing piezoelectric materials to generate and filter acoustic waves, often for radio frequency applications, including surface acoustic wave (SAW) and bulk acoustic wave (BAW) structures.

Creating virtual representations (digital twins) of physical industrial assets or processes for simulation and analysis, often combined with blockchain technology for secure data traceability and distributed control.

Utilizing sensor data, historical performance, and analytical models to anticipate equipment failures, diagnose faults, and estimate remaining useful life, thereby enabling proactive maintenance and reducing downtime.

Technologies for removing contaminants from critical surfaces of sensors, vehicle parts, or industrial components, often involving automated or semi-automated processes. This can include physical, acoustic, or fluid-based methods to maintain functionality.