Samsung Display Co., Ltd.

Techniques and structural designs for fabricating the physical layers of an OLED display, including material deposition, patterning, and methods to protect the active organic layers from environmental degradation like moisture and oxygen.

Methods and structures for incorporating touch sensing capabilities directly into OLED display panels, typically involving conductive layers and insulating layers within or on top of the display stack.

Design and implementation of circuits and layouts for driving individual pixels or rows/columns of pixels, including gate drivers, data drivers, pixel driving circuits, and their integration onto the display substrate, often in non-display regions.

Techniques for driving electrophoretic displays, including managing remnant voltage, optimizing particle movement, and specific addressing pulse schemes to improve optical quality and update speed.

Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.

Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.

Innovations in the internal design of individual light-emitting diode chips or packages, focusing on semiconductor layer arrangements, electrode configurations, reflective elements, and light extraction features.

Development and optimization of organic chemical compounds and their structures, including guest-host systems and metal complexes, used within the emission layer to achieve specific light emission characteristics such as color, efficiency, and operational lifetime.

Components and techniques aimed at improving the visual quality of OLED displays, such as color accuracy, contrast, brightness uniformity, and reducing reflections or glare through optical layers and coatings.

Algorithms and hardware implementations within display drivers or associated components to enhance visual quality, resolution, or color reproduction, including upscaling, dithering, and compensation for display artifacts like crosstalk.

Innovations in backlight units, optical films, and light management structures to enhance display performance, uniformity, viewing experience, or specific functionalities like touch.

Techniques and circuits for optimizing power consumption, voltage stability, and energy efficiency in display panels, often involving dynamic voltage scaling, duty cycle control, or remnant voltage management.

Techniques and structural designs for assembling multiple display modules or panels to create a larger, continuous display with minimized visible seams, uniform light emission, and robust mechanical integrity.

Methods and circuits for coordinating the timing of display signals, data transmission, and control signals across various display components, ensuring proper image rendering and efficient operation.

Optical and pixel-defining materials for display panels, including black matrix compositions, color filter pigments, optical alignment films, and pixel-define layers.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Optical structures and lens designs that improve light extraction efficiency from LED dies and modules, including diffractive films, micro-lens arrays, reflectors, and color-conversion layers.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Engineering and fabrication of semiconductor structures incorporating quantum dots, often for quantum information processing (e.g., spin qubits) or advanced light-emitting applications, focusing on controlled growth and isolation.

Designing user interfaces and interaction methods specifically for mobile or wearable devices, enabling control of external systems, monitoring user states, or facilitating real-world transactions.

Mixtures of liquid crystal compounds and other additives, such as monomers or carbon black, designed to achieve specific optical, electrical, or physical properties for use in liquid crystal displays (LCDs) or other electro-optical devices.

LED devices and display systems designed to emit or utilize light across different spectral ranges, including visible and invisible light, or to create specific illumination patterns and immersive lighting experiences.

Structural innovations in individual transistors, such as fin-based field-effect transistors (FinFETs), 3D gate structures, or multi-layer active regions, aimed at improving performance or density.

Techniques for rendering, interacting with, and managing content within augmented or virtual reality environments, including spatial tracking, gaze interaction, and dynamic multi-application display management.

Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.

Techniques for efficiently supplying power to electronic devices, managing battery charge/discharge cycles, optimizing power consumption, and converting power between different voltage levels or AC/DC for improved energy efficiency and longevity.

Abrasive slurry compositions used in semiconductor manufacturing for planarizing wafer surfaces, typically containing abrasive particles and chemical additives to achieve specific material removal rates and selectivity.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Fabrication methods and material engineering for halide perovskite-based photoelectronic devices, particularly solar cells, addressing challenges such as material synthesis, nanowire formation, and lead leakage mitigation.

Specialized design and fabrication of light-emitting diodes specifically engineered to produce light in the deep ultraviolet (DUV) spectrum, often for applications like sterilization or curing.

Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.

Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.