In-situ Void Detection Using Deposition Maps in Electrochemical Additive Manufacturing

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001]This application claims the benefit of priority to U.S. Provisional Patent Application Ser. No. 63/566,149 (filed on 2024 Mar. 15) and U.S. Provisional Patent Application Ser. 63/713,355 (filed on 2024 Oct. 29), the foregoing incorporated herein by reference in their entirety.

BACKGROUND

[0002]Additive manufacturing, also known as 3-dimensional (3D) printing, is often used to produce complex parts using a layer-by-layer deposition process on substrates. Additive manufacturing can utilize a variety of processes in which various materials (e.g., plastics, liquids, and/or powders) are deposited, joined, and/or solidified. Some examples of techniques used for additive manufacturing include vat photopolymerization, material jetting, binder jetting, powder bed fusion (e.g., using selective laser melting or electron beam melting), material extrusion, directed energy deposition, and sheet lamination. However, metal additive manufacturing has been limited due to the high cost associated with selective laser melting and electron beam melting systems. Furthermore, thermal fusing produces parts with rough surface finishes because the unmelted metal powder is often sintered to the outer edges of the finished product. Electrochemical-additive manufacturing (ECAM) provides many new options not available with conventional additive manufacturing techniques.

SUMMARY

[0003]In-situ void detection using deposition maps in ECAM processes is described. A deposition cycle forms a layer, which is mapped by applying a mapping voltage to each pixelated electrode (e.g., previously used to form the layer) while monitoring the current through each electrode. This mapping current depends on the positional relationship between the electrode and the deposited layer and is added to a deposited layer dataset together with mapping currents through other electrodes. A deposition map is then updated with this deposited layer dataset. The deposition map may reflect any undesirable voids in one or more deposited layers, which may serve as an indirect method of inspection and/or understanding of the as-built ECAM fabricated parts (e.g., replacing destructive inspection or CT scanning). The deposition map additionally may be inspected to select one or more deposition actions (e.g., The deposition action may involve continuing deposition with the same parameters, updating the parameters, mitigating potential voids (e.g., by developing a void mitigation parameter set), and/or stopping deposition (and optionally performing scrap-marking).

[0004]Clause 1. A method of operating an ECAM system comprising a build plate and a printhead with a set of pixelated electrodes, the method comprising: performing a deposition cycle using a deposition parameter set thereby forming a deposited layer on the build plate, wherein a subset of pixelated electrodes is selectively activated from the set of pixelated electrodes according to the deposition parameter set thereby causing an ionic flow through an electrolyte provided between at least the subset of pixelated electrodes and the printhead; mapping the deposited layer by applying a mapping voltage to each pixelated electrode in the subset of pixelated electrodes and monitoring a current through each pixelated electrode in the subset of pixelated electrodes, wherein the current through each pixelated electrode in the subset of pixelated electrodes depends on a positional relationship between each pixelated electrode in the subset of pixelated electrodes and the deposited layer; updating a deposition map with a deposited layer dataset representing the current through each pixelated electrode in the subset of pixelated electrodes; inspecting the deposition map in accordance with a set of inspection parameters and different portions of the deposition map to select one or more deposition actions from a set of action options, wherein the set of action options comprises: (a) continuing with an additional deposition cycle using the deposition parameter set thereby forming an additional deposited layer at least in part over the deposited layer, (b) updating the deposition parameter set thereby generating an updated deposition parameter set and continuing with the additional deposition cycle using the updated deposition parameter set thereby forming the additional deposited layer at least in part over the deposited layer, and (c) stopping any further deposition; performing the one or more deposition actions using the ECAM system thereby forming an electroplated component; and inspecting the deposition map for the electroplated component to assign a quality rating to the electroplated component, wherein the quality rating is selected from two or more quality rating options.

[0005]Clause 2. The method of clause 1, wherein: different portions of the deposition map comprise a critical portion and a non-critical portion, and the set of inspection parameters for the critical portion is different from the set of inspection parameters for the non-critical portion.

[0006]Clause 3. The method of clause 1, further comprising: performing an ex-situ inspection of the electroplated component by performing one or more selected from the group consisting of (a) cross-sectioning and visually inspecting, (b) a computed tomography (CT) scan, (c) heat-conduction testing, and (d) electric-conduction testing; and updating the set of inspection parameters based on correlations of the ex-situ inspection and values in the deposition map.

[0007]Clause 4. The method of clause 1, wherein: the set of action options further comprises (d) determining a void mitigation parameter set, performing a void mitigation cycle on the deposited layer using the void mitigation parameter set thereby converting the deposited layer into a mitigated deposited layer, and mapping the mitigated deposited layer, and the deposited layer dataset is updated based on mapping the mitigated deposited layer.

[0008]Clause 5. The method of clause 4, wherein a set of operations comprising: determining a void mitigation parameter set, performing the void mitigation cycle on the deposited layer using the void mitigation parameter set thereby converting the deposited layer into a mitigated deposited layer, and mapping the mitigated deposited layer is repeated one or more times until the deposited layer dataset is within a set threshold.

[0009]Clause 6. The method of clause 1, wherein the set of actions, from which the action is determined and performed, further comprises (e) performing a scrap-marking deposition cycle thereby forming a scrap-marking layer over the deposited layer.

[0010]Clause 7. The method of clause 1, wherein the deposition map is a three-dimensional array of values comprising one layer formed by the deposited layer dataset.

[0011]Clause 8. The method of clause 1, wherein the deposited layer dataset represents a level of direct contact between the deposited layer and the subset of pixelated electrodes by dividing a total charge through the subset of pixelated electrodes, obtained while mapping the deposited layer, to a total current through the subset of pixelated electrodes.

[0012]Clause 9. The method of clause 1, wherein the deposited layer dataset comprises multiple values such that each of the multiple values represents the current through a corresponding pixelated electrode in the subset of pixelated electrodes.

[0013]Clause 10. The method of clause 9, wherein the multiple values in the deposited layer dataset are binary values representing the current through each pixelated electrode in the subset of pixelated electrodes being (a) lower than or equal to a set current threshold or (b) greater than the set current threshold.

[0014]Clause 11. The method of clause 10, wherein the set current threshold corresponds to an electrode in the set of pixelated electrodes contacting the deposited layer.

[0015]Clause 12. The method of clause 9, wherein each of the multiple values in the deposited layer dataset is proportional to a corresponding gap between the deposited layer and a corresponding electrode in the subset of pixelated electrodes.

[0016]Clause 13. The method of clause 9, wherein each of the multiple values in the deposited layer dataset is proportional to a contact area between the deposited layer and a corresponding electrode in the subset of pixelated electrodes.

[0017]Clause 14. The method of clause 10, wherein: any subset of the deposited layer dataset, representing each pixelated electrode in the subset of pixelated electrodes with the current greater than the set current threshold, defines a part of a filled portion subset corresponding to the deposited layer dataset, any additional subset of the deposited layer dataset, representing each pixelated electrode in the subset of pixelated electrodes with the current that is lower than/equal to the set current threshold, defines a part of a void portion subset corresponding to the deposited layer dataset, the part of the filled portion subset and the part of the void portion subset collectively form the deposited layer dataset, and the void portion subset represents any unplanned voids in the deposited layer.

[0018]Clause 15. The method of clause 14, wherein: the deposition map comprises a previous layer dataset representing a previously deposited layer, formed on the build plate before the deposited layer such that the previously deposited layer is positioned between the build plate and the deposited layer, and the previous layer dataset forms at least a part of the filled portion subset.

[0019]Clause 16. The method of clause 14, wherein: different portions of the deposition map comprise a critical portion and a non-critical portion, and the set of inspection parameters comprises determining one or more of: (a) a combined size of the void portion subset, (b) an individual size of each void portion in the void portion subset, and (c) an overlap of the void portion subset with the critical portion of the deposition map.

[0020]Clause 17. The method of clause 16, wherein the individual size of each void portion is determined based on a number of adjacent values within the void portion subset.

[0021]Clause 18. The method of clause 1, wherein: the deposited layer is one of multiple layers forming an electroplated component, and the method further comprises performing an ex-situ inspection of the electroplated component by performing one or more selected from the group consisting of (a) cross-sectioning and visually inspecting, (b) a computed tomography (CT) scan, (c) heat-conduction testing, and (d) electric-conduction testing.

[0022]Clause 19. The method of clause 18, further comprising updating the set of inspection parameters based on results of the ex-situ inspection.

[0023]Clause 20. The method of clause 19, wherein the set of inspection parameters is updated based on correlations of the results of the ex-situ inspection and values in the deposition map.

[0024]These and other embodiments are described further below with reference to the figures.

BRIEF DESCRIPTION OF THE DRAWINGS

[0025]FIG. 1A is a schematic illustration of an ECAM system comprising a build plate and a printhead comprising a set of pixelated electrodes as well as electrolyte provided between the build plate and printhead, in accordance with some examples.

[0026]FIG. 1B is a schematic planar view of a printhead comprising a set of pixelated electrodes arranged into a two-dimensional array, in accordance with some examples.

[0027]FIG. 1C is a schematic cross-sectional view of an ECAM system illustrating the electrolytic deposition of material from the electrolyte onto a build plate by controlling the current through each pixelated electrode, in accordance with some examples.

[0028]FIG. 1D is a block diagram illustrating various components of an electrolytic solution used for electrolytic deposition, in accordance with some examples.

[0029]FIGS. 2A-2D are schematic cross-sectional views of an electroplated component during different stages of its deposition without forming any voids.

[0030]FIGS. 2E-2K are schematic cross-sectional views of an electroplated component during different stages of its deposition with a void formed in the initial deposited layer, in accordance with some examples.

[0031]FIGS. 3A-3F are schematic cross-sectional views of different examples of an electroplated component having no voids (FIG. 3A), a major void (FIG. 3C), and a minor void (FIG. 3E) and corresponding deposition maps.

[0032]FIG. 4 is a process flowchart corresponding to a method of in-situ void detection using deposition maps in ECAM processes, in accordance with some examples.

[0033]FIG. 5 is a block diagram illustrating various components of the in-situ void detection process, in accordance with some examples.

[0034]FIGS. 6A-6E are schematic cross-sectional views of an electroplated component and a corresponding deposition map during different stages of its deposition and without forming any voids, in accordance with some examples.

[0035]FIGS. 7A-7F are schematic cross-sectional views of an electroplated component and a corresponding deposition map during different stages of its deposition and forming a minor void that is fully or partially cured without any changes to the deposition sequence, in accordance with some examples.

[0036]FIGS. 8A-8F are schematic cross-sectional views of an electroplated component and a corresponding deposition map during different stages of its deposition and forming a major void that is cured using at least one curing cycle, separate from the deposition sequence, in accordance with some examples.

[0037]FIGS. 9A-9E are schematic cross-sectional views of an electroplated component and a corresponding deposition map during different stages of its deposition and forming a major void that triggers stopping any further deposition.

[0038]FIG. 10A is a schematic illustration of a three-dimensional deposition map, in accordance with some examples.

[0039]FIGS. 10B-10F are different examples of inspecting deposition maps to determine acceptance and quality of the electroplated component, in accordance with some examples.

[0040]FIGS. 11A-11F are schematic cross-sectional views of an electroplated component and a corresponding deposition map while being cross-sectioned and visually inspected to validate the corresponding deposition map, in accordance with some examples.

DETAILED DESCRIPTION

[0041]In the following description, numerous specific details are outlined to provide a thorough understanding of the presented concepts. The presented concepts may be practiced without some or all of these specific details. In other instances, well-known process operations have not been described in detail to not unnecessarily obscure the described concepts. While some concepts will be described in conjunction with the specific embodiments, it will be understood that these embodiments are not intended to be limiting.

Introduction

[0042]ECAM systems may utilize pixelated electrode arrays, arranged into an ECAM printhead. An electrode array arranged into a printhead can be used (e.g., as a set of independently controlled anodes) for electrochemical material deposition on a build plate (e.g., as a cathode) with ionic-containing electrolyte therebetween. Specifically, an ECAM printhead includes a micro-electrode array with millions of individual pixels on the scale of 10 s of microns. During an ECAM process that may be also referred to as a printing process, individual pixels can be activated to form localized electric currents that drive metal deposition from a water-based electrolyte containing metal cations. In addition to driving metal deposition, each pixel acts as a sensor to precisely measure metal growth thereby enabling real-time monitoring and adjustment of process parameters within each layer of the build. For example, each deposition cycle may be followed by a mapping process to determine the profile of the deposited layer relative to the electrode array.

[0043]This pixel-level sensing/mapping process facilitates early defect detection and/or mitigation of various potential defects (e.g., voids) thereby enhancing overall part quality. By correlating the process data (e.g., in the form of multiple sets of deposition layer parameters) with the mapping results, various predictive modeling (e.g., of the part quality) and defect prevention strategies can be established and reduce the need for downstream inspection. The closed-loop monitoring system ensures adaptability to changing conditions and consistent quality throughout fabrication.

[0044]For example, a deposition map may be generated and updated as the electroplated component is being formed. Specifically, each deposition cycle forms a newly deposited layer. Mapping of each layer (e.g., performed immediately after the deposition cycle) generates a deposited layer dataset, which may be inspected separately and/or together with other deposited layer datasets (corresponding to the previously deposited layers). An aggregation of one or more such deposited layer datasets forms a deposition map.

[0045]Experimental validation has demonstrated effectiveness across various defect types, highlighting the broad applicability of this methodology to meet a range of product requirements. This process introduces a transformative 3D metal printing capability with in-situ inspection, providing unprecedented levels of quality control for mass manufacturing.

ECAM System Examples

[0046]FIG. 1A is a schematic illustration of an ECAM system 100 used for depositing or, more specifically, electroplating material (e.g., copper deposit), in accordance with some examples. An ECAM system 100 may comprise a position actuator 102, a system controller 106, a deposition power supply 104, a printhead 110, and a build plate 150. In some examples, a build plate 150 is connected to the deposition power supply 104 and controllably supported relative to the ECAM printhead 110 (e.g., by position actuator 102).

[0047]An ECAM printhead 110 or simply a printhead 110 comprises a set of pixelated electrodes 120 and electrode-array drivers 116. Each of the electrode-array drivers 116 controls the current flow through a corresponding electrode in the set of pixelated electrodes 120 as well as the corresponding portion of the electrolyte 180 thereby causing the deposition on the corresponding surface of material (e.g., copper deposit) on build plate 150.

[0048]A position actuator 102 can be mechanically coupled to the build plate 150 and used to change the positional relationship of the printhead 110 and build plate 150 (e.g., changing the gap between the printhead 110 and build plate 150 or, more specifically, the gap between the set of pixelated electrodes 120 and build plate 150, linearly moving and/or rotating one or both printhead 110 and build plate 150 within a plane parallel to the set of pixelated electrodes 120). While FIG. 1A illustrates the position actuator 102 that is coupled to the build plate 150, other examples are also within the scope.

[0049]A system controller 106 is used for controlling the operations of various components. For example, FIG. 1A illustrates the system controller 106 that is communicatively coupled with the position actuator 102, deposition power supply 104, and electrode-array drivers 116. The system controller 106 can instruct the position actuator 102 to change the relative position of the printhead 110 and build plate 150. In the same or other examples, the system controller 106 can selectively instruct some electrode-array drivers 116 to provide current through a subset of pixelated electrodes 121 selected the set of pixelated electrodes 120 (e.g., based on the required deposition location).

[0050]During the operation, the ECAM system 100 also comprises electrolyte 180 comprising a source of cations (e.g., metal cations) that are reduced on build plate 150 (operable as a cathode during this operation) and form the material (e.g., copper deposit). More specifically, material (e.g., copper deposit) is deposited onto build plate 150 from the electrolyte 180 by flowing the electrical current between selected electrodes in the set of pixelated electrodes 120 and the build plate 150 as noted above. In some examples, further granularity is provided by controlling the current levels through each one of the electrode-array drivers 116. In other words, not only the current can be shut off through one or more electrode-array drivers 116 but different levels of current can flow through different electrode-array drivers 116 (and as a result through the corresponding electrodes in the set of pixelated electrodes 120).

[0051]Referring to FIG. 1B, a printhead 110 comprises a set of pixelated electrodes 120. These electrodes may be also referred to as microelectrodes (or micro-anodes), and/or pixels. This individually-addressable feature of the set of pixelated electrodes 120 allows the achievement of different deposition rates at different locations on build plate 150. The electrodes form a deposition grid, in which these electrodes may be offset relative to each other along the X-axis and Y-axis, each within a grid footprint. Rectangular grids may be characterized by a grid X-axis pitch (corresponding to the length of each grid region along the X-axis), grid Y-axis pitch (corresponding to the length of a grid region along the Y-axis), overall grid pitch (corresponding to the minimum of the grid X-axis pitch and the grid Y-axis pitch), and grid region area. In the same or other examples, one or both of the grid's X-axis pitch and the Y-axis pitch are 100 micrometers or less, 50 micrometers or less, or even 35 micrometers or less. Other example grids include triangular, hexagonal, or other patterns that partially or completely tessellate a surface. In some examples, the electrodes are formed/deposited from an insoluble conductive material, such as platinum group metals and their associated oxides, doped semiconducting materials, and carbon nanotubes. The shape of the electrodes can be round, rectangular, or other shapes. The area of the electrodes (the pixel size) is smaller (e.g., at least 1% smaller, at least 10% smaller, at least 20% smaller) than the grid footprint, thereby providing space between the electrodes. In some examples, the pitch is between 25 micrometers and 35 micrometers, while the pixel size is between 15 micrometers and 20 micrometers.

[0052]FIG. 1C is a schematic expanded view of a portion of ECAM system 100 illustrating electrolyte 180 between the printhead 110 and build plate 150, in accordance with some examples. FIG. 1D is a schematic block diagram illustrating different components of electrolyte 180. For example, electrolyte 180 may comprise salt 182, electrolyte solution solvent 186, and conductive agent 188. Salt comprises cations 183 and anions 184. Cations 183 can be in the form of metal ions, metal complexes, and the like. Some examples of cations 183 include metal cations (e.g., copper ions, nickel ions, tungsten ions, gold ions, silver ions, cobalt ions, chrome ions, iron ions, or tin ions), and other types of cations are within the scope. Some specific examples of salt 182 (feedstock ion sources) include but are not limited to copper sulfate, copper chloride, copper fluoroborate, copper pyrophosphate, nickel sulfate, nickel ammonium sulfate, nickel chloride, nickel fluoroborate, zinc sulfate, sodium thiocyanate, zinc chloride, ammonium chloride, sodium tungstate, cobalt chloride, cobalt sulfate, hydroxy acids, and aqua ammonia. In some examples, feedstock ion sources, or other sources of cations (e.g., salts) are referred to as material concentrates. Electrolyte solution solvent 186 can be water, which dissociates (2H₂O(I)=>O₂(g)+4H⁺(aq.)+4e⁻) on the electrodes that are activated during this operation. Specifically, the activated electrodes are connected to the deposition power supply. In some examples, electrolyte 180 comprises catholyte conductive agent 188, such as an acid (e.g., sulfuric acid, acetic acid, hydrochloric acid, nitric acid, hydrofluoric acid, boric acid, citric acid, and phosphoric acid). In some examples, electrolyte 180 comprises one or more additives, such as a leveler, a suppressor, and an accelerator, particulates for co-deposition (e.g., nanoparticles and microparticles such as diamond particles, tungsten-carbide particles, chromium-carbide particles, and silicon-carbide particles).

[0053]Returning to the example shown in FIG. 1D, cations (e.g., metal cations are combined with electrons, which are supplied to build plate 150 thereby forming the material (e.g., copper deposit). As noted above, the charge balance within electrolyte 180 is maintained by protons generated at the printhead 110. It should be noted that only a set of activated electrodes (illustrated in black color) can be activated during this ECAM process resulting in electrolytic deposit/material formed on a corresponding portion of build plate 150. This corresponding portion is aligned with the activated electrode while the remaining portion of electrodes (inactive electrodes) remains free of electrolytic deposit. This selective deposition is a core ECAM feature provided by selective control of the current passing through the activated electrodes.

[0054]Specifically, in some examples, an ECAM system 100 comprises a build plate 150 and a printhead 110 comprising a set of pixelated electrodes 120 and electrode-array drivers 116, such that each of the electrode-array drivers 116 is configured to control a current flow through a corresponding electrode in the set of pixelated electrodes 120. The ECAM system 100 also comprises a position actuator 102 for controlling the position of the build plate 150 relative to the printhead 110 and a power supply 104 connected to the build plate 150 and each of the electrode-array drivers 116. Furthermore, the ECAM system 100 comprises a system controller 106 communicatively coupled to each of the electrode-array drivers 116, the position actuator 102, and the power supply 104. The system controller 106 is configured to (a) store a deposition parameter set 502, a deposition map 530 comprising a deposited layer dataset 532, and a set of inspection parameters 520. For example, the system controller 106 is equipped with one or more types of memory (e.g., physical memory). The system controller 106 is also configured to (b) instruct the power supply 104 and the electrode-array drivers 116 to perform a deposition cycle using the deposition parameter set 502 thereby forming a deposited layer 155 on the build plate 150. During this operation, a subset of pixelated electrodes 121 is selectively activated from the set of pixelated electrodes 120 according to the deposition parameter set 502 thereby causing an ionic flow through an electrolyte 180 provided between at least the subset of pixelated electrodes 121 and the printhead 110. Furthermore, the system controller 106 is configured to (c) instruct the power supply 104 and the electrode-array drivers 116 to map the deposited layer 155 by applying a mapping voltage to each pixelated electrode in the subset of pixelated electrodes 121 and monitoring a current through each pixelated electrode in the subset of pixelated electrodes 121. As noted elsewhere, the current through each pixelated electrode in the subset of pixelated electrodes 121 depends on a positional relationship (e.g., the gap) between each pixelated electrode in the subset of pixelated electrodes 121 and the deposited layer 155. The system controller 106 is also configured (d) to update the deposition map 530 with the deposited layer dataset 532 representing the current through each pixelated electrode in the subset of pixelated electrodes 121. For example, the system controller 106 may be equipped with a processor for processing the current values received from the subset of pixelated electrodes 121 and generating the corresponding entries to the deposition map 530. The system controller 106 may be also configured to (e) inspect the deposition map 530 (e.g., using its processor) in accordance with a set of inspection parameters 520 and different portions of the deposition map 530 to select one or more deposition actions from a set of action options 540.

Examples of Potential Voids in Electroplated Components

[0055]FIGS. 2A-2D are schematic cross-sectional views of an electroplated component 151 during different stages of its deposition (without forming any voids) and mapping. Specifically, FIG. 2A illustrates the deposition of the initial deposited layer 155 by passing the current through the set of pixelated electrodes 120 and electrolyte 180. The deposition may continue until the deposited layer 155 reaches the set of pixelated electrodes 120 (e.g., as shown in FIG. 2B), which may correspond to a spike in the current through the electrodes that come in contact with the deposited layer 155. Specifically, FIG. 2B illustrates all electrodes in contact with the deposited layer 155, meaning that the deposited layer 155 is free of undesirable voids. This contact may be confirmed by the mapping process during which a mapping voltage may be applied to each electrode and the corresponding current (through each electrode is measured). Once the deposited layer 155 is mapped, the build plate 150 is lifted relative to the set of pixelated electrodes 120, e.g., as shown in FIG. 2C to provide fresh electrolyte 180 into the gap between the deposited layer 155 and the set of pixelated electrodes 120. The set of pixelated electrodes 120 is activated and the deposition cycle is repeated producing an additional deposited layer 157. FIG. 2D illustrates all electrodes in contact with the additional deposited layer 157, meaning that the additional deposited layer 157 is also free of undesirable voids. The additional deposited layer 157 may be mapped in a similar manner and the process of lifting/deposition/mapping may be repeated multiple times to form the entire electroplated component 151.

[0056]FIGS. 2E-2K are schematic cross-sectional views of an electroplated component 151 during different stages of its deposition with a void formed in the initial deposited layer 155, in accordance with some examples. Specifically, FIGS. 2E and 2F illustrate two examples of void causes, e.g., trapped bubbles 189 (as in FIG. 2E) and unintentionally deactivated electrodes 123 (as in FIG. 2F). It should be noted that unintentionally deactivated electrodes 123 are still a part of the subset of pixelated electrodes 121, i.e., these electrodes should have been activated based on the deposition parameter set 502. In both instances, a portion of the deposited layer 155 is not formed resulting in an unplanned void 159 (FIG. 2G). The void 159 can be detected during mapping as the current through the electrodes aligned with this void 159 will be less than through the electrodes that contact the deposited layer 155. When this deposited layer 155 is lifted (as shown in FIG. 2H), the gap corresponding to the void 159 (i.e., “Gap 2”) may be greater than the gap corresponding to the portions of the deposited layer 155 that previously extended to and contacted the electrodes (i.e., “Gap 1”). Depending on the difference in these gaps and subsequent deposition conditions, the additional deposited layer 157 may be able to fill the gap (in the deposited layer 155) and not form any additional gaps (e.g., as shown in FIG. 2I). In another example, the additional deposited layer 157 may be able to fill the gap (in the deposited layer 155) but form its own void (e.g., as shown in FIG. 2J). In yet another example, the additional deposited layer 157 may not be able to fill the gap (in the deposited layer 155) and may maintain/increase the gap (e.g., as shown in FIG. 2K). Other examples (e.g., the additional deposited layer 157 may not be able to fill the gap (in the deposited layer 155) but may contact all electrodes, which is not shown, is within the scope).

[0057]FIGS. 3A-3F are schematic cross-sectional views of different examples of an electroplated component having no voids (FIG. 3A), a major void (FIG. 3C), and a minor void (FIG. 3E) and corresponding deposition maps. Specifically, in the example of FIG. 3A, as deposited layers are formed and each layer is mapped, there are no voids detected. The lack of voids is identified with “1” (representing each filled portion) in deposition map 530 in FIG. 3B. As further described below, the deposition map 530 comprises one or more deposited layer datasets 532, each corresponding to a different deposited layer 155 and represented as rows in the deposition map 530 in FIG. 3B (identified as 155a, 155b, 155c, 155d, and 155e). Each electrode defines the X-Y location in the electroplated component 151 (with only the X-axis component shown in FIGS. 3A-3F) and is represented as columns in the deposition map 530 (identified as 120a, 120b, 120c, 120d, and 120e).

[0058]In the example of FIG. 3B, a void 159 is initially detected/mapped in the second deposited layer 155b (identified with a single “0” in the corresponding row/deposited layer dataset 532 in the deposition map 530 in FIG. 3D). This void 159 is again detected/mapped in the third deposited layer 155c (identified with two 0's in the corresponding row/deposited layer dataset 532 in the deposition map 530 in FIG. 3D). Furthermore, the void 159 is still detected in the third deposited layer 155b (identified with three 0's in the corresponding row/deposited layer dataset 532 in the deposition map 530 in FIG. 3D). A collection of these 0's (across the three rows in the deposition map 530 in FIG. 3D and in the same cluster (adjacent rows and same columns) may indicate the size and continuity of the void, e.g., this particular example may be characterized as a “major void.”

[0059]In the example of FIG. 3C, a void 159 is also initially detected/mapped in the second deposited layer 155b (identified with a single “0” in the corresponding row/deposited layer dataset 532 in the deposition map 530 in FIG. 3F). This void 159 is again detected/mapped in the third deposited layer 155c (identified with one 0 in the corresponding row/deposited layer dataset 532 in the deposition map 530 in FIG. 3F). However, the void 159 is not detected in the third deposited layer 155b, which may mean that the void is sealed or filled. The difference between sealed and filled voids may be determined when void curing/remapping operations are used as described below. A collection of the two 0s (across the two rows in the deposition map 530 and in the same column) may also indicate the size and continuity of the void, e.g., this particular example may be characterized as a “minor void.”

Examples of ECAM Methods

[0060]FIG. 4 is a process flowchart corresponding to method 400 of operating an ECAM system 100, which involves in-situ void detection using deposition maps, in accordance with some examples. Some aspects of the ECAM systems and deposition maps are described above.

[0061]Method 400 may comprise performing (block 410) a deposition cycle using a deposition parameter set 502 thereby forming a deposited layer 155 on the build plate 150. The deposited layer 155 may be the first layer on the build plate 150 or formed over one or more other layers (previously formed on the build plate 150). In general, each deposition cycle may form one deposition layer.

[0062]During the deposition cycle, a subset of pixelated electrodes 121 is selectively activated from the set of pixelated electrodes 120 according to the deposition parameter set 502. This selective activation causes an ionic flow through an electrolyte 180 provided between at least the subset of pixelated electrodes 121 and the printhead 110. The ions are converted into the deposited layer 155 such that the footprint of the deposited layer 155 corresponds to the subset of pixelated electrodes 121. The subset of pixelated electrodes 121 or, more generally, the deposition parameter set 502 are selected based on a target design (e.g., the shape) of the final part. For example, the deposition parameter set 502 for each deposition cycle may be selected based on the desired footprint of the corresponding deposited layer such that a combination of all deposited layers forms the shape of the final part. The deposition parameter set 502 may include other parameters (in addition to the identification of the subset of pixelated electrodes 121) such as the deposition cycle duration (e.g., time, cutoff voltage, cutoff current), deposition voltage, the position of the build plate 150 relative to the printhead 110, the electrolyte flow rate, and the like.

[0063]Referring to FIG. 5, the deposition parameter set 502 may be generated from an ECAM deposition design 500 (e.g., a computer-aided design (CAD) of the electroplated component 151). The deposition parameter set 502 may also reflect various capabilities of the ECAM system 100 and processing conditions (e.g., the electrolyte composition, temperatures, etc.).

[0064]Method 400 may proceed with mapping (block 420) the deposited layer 155 by applying a mapping voltage to each pixelated electrode in the subset of pixelated electrodes 121 and monitoring a current through each pixelated electrode in the subset of pixelated electrodes 121. The current through each pixelated electrode may be referred to as mapping data 510 (referring to FIG. 5). In some examples, mapping data 510 may be different from the values presented in the deposited layer dataset 532. For example, the actual current values may be processed (e.g., by comparing to a threshold and converting into binary values “0” and “1”). Alternatively, the current values (i.e., the mapping data 510) may be used as a deposited layer dataset 532.

[0065]The current through each pixelated electrode in the subset of pixelated electrodes 121 depends on the gap between each pixelated electrode in the subset of pixelated electrodes 121 and the deposited layer 155. For example, when a pixelated electrode contacts the deposited layer 155, the current through this pixelated electrode may be high (due to the direct electronic conduction path). However, when a pixelated electrode is spaced away from the deposited layer 155, the current through this pixelated electrode may be low (due to the gap between the two). It should be noted that some current may still flow through the gap between the pixelated electrode and the deposited layer 155 (e.g., through the electrolyte 180 provided in the gap due to the ionic mobility) but this current may be much smaller than through the direct contact/direct electronic conduction path.

[0066]Method 400 may proceed with updating (block 430) a deposition map 530 with a deposited layer dataset 532 representing the current through each pixelated electrode in the subset of pixelated electrodes 121. The deposited layer dataset 532 is effectively added to any other datasets in the deposition map 530 with each dataset representing a different deposited layer. Specifically, the number of values in the deposited layer dataset 532 may be the same as the number of electrodes in the subset of pixelated electrodes 121 or, more specifically, the number of electrodes used for mapping the deposited layer 155 (which may be smaller or greater than the number of electrodes in the subset of pixelated electrodes 121 used to form the deposited layer 155).

[0067]Furthermore, the deposited layer dataset 532 is a two-dimensional array of values as, e.g., schematically shown in FIG. 10A. This two-dimensional array aspect comes from the two-dimensional aspect of the set of pixelated electrodes 120. Specifically, the position of each electrode in the set of pixelated electrodes 120 (or, more specifically, in the subset of pixelated electrodes 121) corresponds to the position of the corresponding value of the deposited layer dataset 532. Therefore, the deposited layer dataset 532 represents the physical aspects of the deposited layer 155 (e.g., the presence/absence of the material in the deposited layer 155 at each location corresponding to each electrode in the subset of pixelated electrodes 121). This aspect allows using the deposited layer dataset 532 or, more generally, the deposition map 530 to determine the presence of any voids in the deposited layer 155 or, more generally, in the electroplated component 151 (which the deposited layer 155 is a part of).

[0068]Referring to FIG. 10A, the deposition map 530 may be a three-dimensional array of values comprising one or more deposited layer datasets 532. Each deposited layer dataset 532 represents a corresponding deposited layer (e.g., deposited layers 155a-155e). These deposited layer datasets 532 are arranged in the same order as the deposited layers 155a-155e in the electroplated component 151. In addition to the analysis of each deposited layer 155 (e.g., to determine any undesirable void portions in each deposited layer 155), multiple deposited layer datasets 532 (e.g., multiple adjacent deposited layer datasets 532) may be analyzed collectively (e.g., to determine any undesirable void portions extending across multiple layers.)

[0069]In other words, the deposition map 530 may comprise a previous layer dataset representing a previously deposited layer, formed on the build plate 150 before the deposited layer 155 such that the previously deposited layer is positioned between the build plate 150 and the deposited layer 155. The previous layer dataset forms at least a part of the filled portion subset.

[0070]As noted above, the deposited layer dataset 532 comprises multiple values such that each of the multiple values represents the current through a corresponding pixelated electrode in the subset of pixelated electrodes 121. In some examples, the multiple values in the deposited layer dataset 532 are binary values representing the current through each pixelated electrode in the subset of pixelated electrodes 121 being (a) lower than or equal to a set current threshold or (b) greater than the set current threshold. For example, when an electrode in the subset of pixelated electrodes 121 directly contacts the deposited layer 155, the current through this electrode is greater than the set current threshold.

[0071]Alternatively, when an electrode in the subset of pixelated electrodes 121 is spaced away from the deposited layer 155 (e.g., by a gap filled with the electrolyte 180 or a gas pocket/bubble), the current through this electrode is lower than or equal to the set current threshold. Referring to FIG. 10A, the “0” value represents the current through this electrode being lower than or equal to the set current threshold, while the “1” value represents the current through this electrode being greater than the set current threshold. The portions/zones of the deposited layer dataset 532 or, more generally, of the deposition map 530 with the “0” values may be referred to as void portions, collectively forming a void portion subset 536. The portions/zones of the deposited layer dataset 532 or, more generally, of the deposition map 530 with the “1” values may be referred to as filled portions, collectively forming a filled portion subset 534.

[0072]Overall, in this example, any subset of the deposited layer dataset 532, representing each pixelated electrode in the subset of pixelated electrodes 121 with the current greater than the set current threshold, defines a part of a filled portion subset 534 corresponding to the deposited layer dataset 532. Furthermore, any additional subset of the deposited layer dataset 532, representing each pixelated electrode in the subset of pixelated electrodes 121 with the current lower than/equal to the set current threshold, defines a part of a void portion subset 536 corresponding to the deposited layer dataset 532. The part of the filled portion subset 534 and the part of the void portion subset 536 collectively form the deposited layer dataset 532. The void portion subset 536 represents any unplanned voids 159 in the deposited layer 155.

[0073]It should be noted that the set current threshold may be also used to determine the level of direct contact between an electrode and the deposited layer 155, e.g., a ratio of the electrode surface that is in contact with the deposited layer 155 (e.g., (a) a number of pixelated electrodes that are shorted (i.e., in contact with the deposited layer 155) relative to the total number of the pixelated electrodes in the subset of pixelated electrodes 121, (b) the area fraction of all individual pixelated electrode which is shorted, based off of current reading and R=pL/A (i.e., a microscale subpixel resolution deposit fraction)—these options depend on the measuring capabilities of current sensors). Specifically, the level of direct contact may, for example, be measured by dividing the number of pixels that are shorted by the number of active pixels (i.e., macroscale deposit fraction of a layer). The level of direct contact can also be determined as the area fraction of an individual pixel electrode which is shorted, based on an accurate current reading to find the microscale subpixel resolution deposit fraction.

[0074]In some examples, each value in the deposited layer dataset 532 may have more than two values, e.g., with different values characterizing the positional relationship (e.g., the height of the gap) between the corresponding electrode and deposited layer 155. For example, a technique may be used to characterize the actual gap height (e.g., the distance between the electrode and deposited layer 155 when the electrode is not contacting the deposited layer 155), rather than the binary determination of the gap being present and absent. For example, a measuring voltage is applied between each pixelated electrode and deposited layer 155 while obtaining one or more current values over time. In other words, multiple current values are obtained over a period of time to determine specific current profiles. Different profiles may be representative of different positional relationships (e.g., gaps), e.g., a rapid current increase may indicate a small gap while a slower current increase may indicate a large gap. The reference profiles may be obtained during the calibration of similar deposit materials and electrolytes. Specifically, these current values are then compared to the calibration data set to determine the distances between this electrode and the build plate or, more specifically, the deposit on the build plate.

[0075]In some examples, each of the multiple values in the deposited layer dataset 532 is proportional to a contact area between the deposited layer 155 and a corresponding electrode in the subset of pixelated electrodes 121. In other words, even though the deposited layer 155 may directly contact two electrodes, the levels of contact (the contact areas) may be different and detected during mapping. This level of individual electrode contact may be used to detect the potential presence of a void adjacent to an electrode (i.e., with poor contact). For example, if two adjacent electrodes have poor contacts (relative to another pair of two adjacent electrodes), then a void may be suspected between these adjacent electrodes with poor contacts.

[0076]Furthermore, in some examples, the deposited layer dataset 532 represents a level of direct contact between the subset of pixelated electrodes 121 and the deposited layer 155 by dividing a total charge that has passed through the subset of pixelated electrodes 121, obtained while mapping the deposited layer 155, to a total expected charge through the subset of pixelated electrodes 121 (during which the entire subset of pixelated electrodes 121 is in contact with the deposited layer 155—i.e., a calibration value). This level of direct contact, rather than a pixel-by-pixel analysis, may be used for analyzing the deposited layer or, more specifically, the corresponding deposited layer dataset 532.

[0077]In some examples, a predictive algorithm can be used for determining gaps between pixelated electrodes (in the subset of pixelated electrodes 121) and deposited layer 155 based on Coulomb counting. Specifically, the deposited amount/thickness is proportional to the total charge passed through the subset of pixelated electrodes 121. When the initial gap and this deposition thickness are known, the remaining gap can be predicted. In other words, a time to fill the gap (aka “time to short”) may be predicted with this algorithm. Furthermore, printed geometry feature sizes, plating current density, and other factors may be considered. In more specific examples, this predictive algorithm is supplemented by mapping techniques such as those described herein (e.g., the gap prediction is further refined using a deposited layer dataset 532. For example, if the gap is detected to be filled too quickly (e.g., from a map-detected short), an inference can be made that the void is still there.

[0078]Method 400 may proceed with inspecting (block 440) the deposition map 530 in accordance with a set of inspection parameters 520 to select one or more deposition actions from a set of action options 540. In some examples, the set of inspection parameters 520 comprises determining one or more of (a) a combined size of the void portion subset 536, (b) an individual size of each void portion in the void portion subset 536, and (c) an overlap of the void portion subset 536 with one or more critical portions the deposition map 530. In some examples, a combined size to the total size corresponding to the subset of pixelated electrodes 121 (e.g., a number of adjacent “void” pixels is squared and compared to the total number of pixels in the subset of pixelated electrodes 121, which may be referred to a “weighted void size”). In some examples, voids caused by bubbles may be distinguished from voids caused by inactive (“dead”) pixelated electrodes. Specifically, “bubble” voids can be cured by flashing electrolyte 180 through the gap, while “dead pixel” voids remain.

[0079]In some examples, the deposited layer dataset 532 may be inspected on its own before inspecting the entire deposition map 530 (i.e., inspecting the deposited layer dataset 532 together with other datasets representing previously deposited layers). For example, the set of inspection parameters 520 may be applied to the deposited layer dataset 532 and the electroplated component 151 may be immediately scrapped in the current form (or some other actions may be determined) based on the deposited layer dataset 532 alone thereby simplifying the inspection operation.

[0080]The set of action options 540 may comprise (a) continuing with an additional deposition cycle (“YES” option from the decision block 450) using the deposition parameter set 502 thereby forming an additional deposited layer 157 at least in part over the deposited layer 155. The additional deposited layer 157 may be deposited without any curing of the deposited layer 155 (“NO” option from decision block 460). The deposition parameter set 502 used to form the additional deposited layer 157 may be the same or different (e.g., adjusted based on the inspection of deposition map 530). For example, a different deposition parameter set may be used for a hybrid approach that involves simultaneous “curing” and “depositing.” In other words, the set of action options 540 may comprise (b) updating the deposition parameter set 502 thereby generating an updated deposition parameter set 503, and continuing with the additional deposition cycle using the updated deposition parameter set 503 thereby forming the additional deposited layer 157 at least in part over the deposited layer 155.

[0081]FIGS. 6A-6E are schematic cross-sectional views of forming an electroplated component and a corresponding deposition map during different stages of its deposition and without forming any voids, in accordance with some examples. Specifically, FIG. 6A illustrates a first deposition layer 155a formed over a build plate 150 and contacting all pixelated electrodes (120a-120e). Referring to FIG. 6B, a corresponding deposited layer dataset in the deposition map 530 (identified as a row “155a”) receives filled values “1”. FIG. 6C illustrates a second deposited layer 155b being formed over the first deposition layer 155a by activating pixelated electrodes 120a-120e. In this example, all pixelated electrodes 120a-120e represent a subset of pixelated electrodes 121. It should be noted that the first deposition layer 155a may be also referred to as a deposited layer 155, while the second deposition layer 155b may be referred to as an additional deposited layer 157. In general, a deposited layer 155 may be deposited directly into the build plate 150 or on another deposited layer, while the additional deposited layer 157 is deposited directly over the deposited layer 155. FIG. 6D illustrates the second deposited layer 155b formed and contacting all pixelated electrodes (120a-120e). Referring to FIG. 6E, a corresponding deposited layer dataset in the deposition map 530 (identified as a row “155b”) receives filled values “1”. No voids were detected in this example since all electrodes in the subset of pixelated electrodes 121 contacts the corresponding deposited layer.

[0082]FIGS. 7A-7F are schematic cross-sectional views of an electroplated component and a corresponding deposition map during different stages of its deposition and forming a minor void that is fully or partially cured without any changes to the deposition sequence, in accordance with some examples. Specifically, FIG. 7A illustrates a first deposition layer 155a formed over a build plate 150 such that most pixelated electrodes (120a and 120c-120e) contact the first deposition layer 155a except the pixelated electrode 120b. This is an indication that the first deposition layer 155a does not extend to the pixelated electrode 120b and that there is a void between the first deposition layer 155a and pixelated electrode 120b. Referring to FIG. 7B, a corresponding deposited layer dataset in the deposition map 530 (identified as a row “155a”) receives filled values “1” in all columns except the column “120b”. Considering the minor nature of this void (e.g., a single pixel at least in this cross-section), the deposition may proceed without any special curing operations. FIG. 7C illustrates a second deposited layer 155b being formed over the first deposition layer 155a by activating pixelated electrodes 120a-120e. Again, in this example, all pixelated electrodes 120a-120e represent a subset of pixelated electrodes 121. FIG. 7D illustrates the second deposited layer 155b formed and contacting all pixelated electrodes (120a-120e) with the initial void in the first deposition layer 155a being cured. FIG. 7E illustrates the second deposited layer 155b formed and contacting all pixelated electrodes (120a-120e) with the initial void in the first deposition layer 155a not being cured and still present at the interface of the first deposition layer 155a and the second deposited layer 155b. Referring to FIG. 7F, a corresponding deposited layer dataset in the deposition map 530 (identified as a row “155b”) receives filled values “1”. No voids were detected in the second deposited layer 155b example since all electrodes in the subset of pixelated electrodes 121 contacts the corresponding deposited layer.

[0083]It should be noted that the deposition map 530 may be the same as the examples in FIGS. 7D and 7E, e.g., the deposition map 530 may be insufficient to distinguish between these examples. However, coupled with Coulomb counting for each electrode, these examples can be distinguished. Specifically, the electrode 120b in FIG. 7D should pass a lot more electric charge than the electrode 120b in FIG. 7D (or any other electrodes in FIGS. 7D and 7E) to fill the initial void (the electric charge is proportional to the amount of deposited material). As such, in some examples, Coulomb counting can be used to update the value in a deposited layer dataset 532, e.g., for the previously deposited layer.

[0084]In some examples, the set of action options 540 may comprise (c) stopping any further deposition (“NO” option from decision block 450). For example, the deposition of the electroplated component 151 may be completed (i.e., the deposited layer dataset 532 just added to the deposition map 530 represents the last deposited layer 155 in the deposition parameter set 502). Alternatively, the electroplated component 151 may be scrapped. In this latter case, method 400 may involve (block 455) performing scrap marking (e.g., using scrap marking deposition parameters provided by the system controller 106). More specifically, the set of action options 540 may comprise (e) performing a scrap-marking deposition cycle thereby forming a scrap-marking layer 157 over the deposited layer 155.

[0085]In some examples, the set of action options 540 may comprise (d) determining a void mitigation parameter set 505, performing a void mitigation cycle on the deposited layer 155 using the void mitigation parameter set 505 thereby converting the deposited layer 155 into a mitigated deposited layer 156, and mapping the mitigated deposited layer 156. This set of operations may be collectively referred to as (block 465) performing a curing operation. In this curing operation, the deposited layer dataset 532 is updated based on mapping the mitigated deposited layer 156.

[0086]FIGS. 8A-8F are schematic cross-sectional views of an electroplated component and a corresponding deposition map 530 during different stages of its deposition and forming a major void that is cured using at least one curing cycle, separate from the deposition sequence, in accordance with some examples. Specifically, FIG. 8A illustrates a first deposition layer 155a formed over a build plate 150 such that most pixelated electrodes (120a and 120d-120e) contact the first deposition layer 155a except the pixelated electrodes 120b and 120c. This is an indication that the first deposition layer 155a does not extend to the pixelated electrodes 120b and 120c and that there is a void 159 between the first deposition layer 155a and pixelated electrodes 120b and 120c. Referring to FIG. 8B, a corresponding deposited layer dataset in the deposition map 530 (identified as a row “155a”) receives filled values “1” in all columns except the columns “120b” and “120c”. Considering the significant nature of this void 159 (e.g., multiple adjacent pixels at least in this cross-section), the deposition may proceed with a void curing operation. FIG. 8C illustrates a curing stage during which the build plate 150 is lifted relative to the set of pixelated electrodes 120 to increase the gap size and allow fresh electrolyte 180 to flow into the gap (e.g., to replace the depleted electrolyte and remove a bubble that may have caused some voids). FIG. 8D illustrates another curing stage during which the pixelated electrodes 120b and 120c are activated, while the remaining electrodes may remain inactive. As noted above, the pixelated electrodes 120b and 120c may be selected based on the previous mapping operations (e.g., electrodes aligned with voids)/the deposited layer dataset 532. FIG. 8E illustrates another mapping operation (optional), which is performed after the curing operation, to determine the effectiveness of the curing. Specifically, FIG. 8E illustrates an example with the most pixelated electrodes (120a, 120b, 120d, and 120e) contacting the first deposition layer 155a except the pixelated electrode 120c. This example may be referred to as partial curing, e.g., to differentiate from full curing in which all pixelated electrodes contact the first deposition layer 155a. In either case, the deposited layer dataset (corresponding to the first deposition layer 155a) in the deposition map 530 is updated to reflect the “remapping” values. With partial curing, the curing operation may be repeated, or the process may continue with a deposition of the next layer.

[0087]FIGS. 9A-9E are schematic cross-sectional views of an electroplated component and a corresponding deposition map 530 during different stages of its deposition and forming a major void that is cured using at least one curing cycle, separate from the deposition sequence, in accordance with some examples. Specifically, FIG. 9A illustrates a first deposition layer 155a formed over a build plate 150 such that most pixelated electrodes (120a and 120d-120e) contact the first deposition layer 155a except the pixelated electrode 120b, i.e., the first deposition layer 155a does not extend to the pixelated electrode 120b and forming a void 159 between the first deposition layer 155a and pixelated electrode 120b. Referring to FIG. 9B, a corresponding deposited layer dataset in the deposition map 530 (identified as a row “155a”) receives filled value “1” in all columns except the column “120b”. FIG. 9C illustrates another deposition stage with a second deposited layer 155b being formed over the first deposition layer 155a. FIG. 9D illustrates another mapping operation, now performed on the second deposited layer 155b, which does not contact and forms a gap with the pixelated electrodes 120b and 120c. Referring to FIG. 9E, a new deposited layer dataset in the deposition map 530 (identified as a row “155b”) receives filled value “1” in all columns except the columns “120b” and “120c”. This situation indicates the growth of the void 159, e.g., the void 159 tapers out/becomes bigger. The decision can be made (a) to continue without curing, (b) to perform a void curing operation, or (c) to stop further deposition.

[0088]In some examples, the curing operation is repeated one or more times until the deposited layer dataset 532 is within a set threshold. In other words, determining a void mitigation parameter set 505, performing a void mitigation cycle on the deposited layer 155 using the void mitigation parameter set 505 thereby converting the deposited layer 155 into a mitigated deposited layer 156, and mapping the mitigated deposited layer 156 is repeated one or more times until the deposited layer dataset 532 is within a set threshold.

[0089]FIGS. 10B-10F are different examples of inspecting deposition maps 530 to determine acceptance and quality of the electroplated component, in accordance with some examples. While the deposition maps 530 in FIGS. 10B-10F are shown as two-dimensional, one having ordinary skills in the art would appreciate that these maps may be three- dimensional as shown in FIG. 10A. Furthermore, in addition to the inspection across the “depth” (the Z-axis), during which the voids in multiple deposition layers are considered, the inspection may be performed on each deposited layer dataset (corresponding to one layer, defined by the X-Y plane). The same criteria may be used for both types of inspection. Finally, while void portion subsets 536 in FIGS. 10B-10F are viewed as undesirable (i.e., a deposition should be presented in these portions by design), and some void portions may be desirable (designed). The portions may be either ignored during this analysis or specifically analyzed to determine that the designed void portions in fact have voids. In some examples, examples of various subtractive void “forming” techniques (e.g., by applying a reverse voltage) may be used to form needed voids.

[0090]FIG. 10B illustrates an example of an acceptable deposition map 530. Specifically, the deposition map 530 is identified with a critical portion 539 and a non-critical portion 538, such that different void criteria are applied to these portions. For example, no voids may be allowed in the critical portion 539, while some voids may be allowed in the non-critical portion 538. Various criteria described above may be set for these portions, e.g., (a) a combined size of the void portion subset 536, (b) an individual size of each void portion in the void portion subset 536, and (c) an overlap of the void portion subset 536 with one or more critical portions the deposition map 530. Specifically, the part corresponding to the deposition map 530 in FIG. 10B may be deemed acceptable since (a) the void portion subset 536 is sufficiently small/disjoined in the non-critical portion 538 and (b) there are no voids in the critical portion 539. The part corresponding to the deposition map 530 in FIG. 10C may be deemed unacceptable since the void portion subset 536 extends into the critical portion 539. The part corresponding to the deposition map 530 in FIG. 10C may be deemed unacceptable since some parts of the void portion subset 536 are too large even for the non-critical portion 538.

[0091]FIGS. 10C and 10D illustrate examples in which a part is rejected after being fully or at least substantially fabricated, i.e., all/most layers deposited. FIGS. 10E and 10E illustrate alternative examples, in which further deposition is stopped because the last deposited layer/deposited layer dataset does not pass the set criteria (e.g., some parts of the void portion subset 536 are too large in FIG. 10E, the void portion subset 536 extends into the critical portion 539 in FIG. 10E).

[0092]Overall, FIGS. 10B-10F illustrate examples of two different criteria for inspection of the deposition map 530, i.e., one for the critical portion 539 and another one for the non-critical portion 538. In some examples, the entire acceptable deposition map 530 may be inspected using the same criteria, i.e., there are no separations between the critical portion 539 and the non-critical portion 538. Alternatively, two, three, four, or more different criteria sets may be used for different portions of the deposition map 530.

[0093]As noted above, method 400 may proceed with performing (block 450) one or more deposition actions using the ECAM system 100.

[0094]In some examples, method 400 further comprises (block 480) performing an ex-situ inspection of the electroplated component 151 by performing one or more selected from the group consisting of (a) cross-sectioning and visually inspecting, (b) a computed tomography (CT) scan, (c) heat-conduction testing, and (d) electric-conduction testing. FIGS. 11A-11F are schematic cross-sectional views of an electroplated component and a corresponding deposition map while being cross-sectioned and visually inspected to validate the corresponding deposition map, in accordance with some examples. Specifically, FIG. 11A is a cross-sectional view of an electroplated component 151 with multiple deposited layers 155a-155d along the thickness (the Z axis). A void 159 extends through the second deposited layer 155b and third deposited layer 155c (and aligned with the pixelated electrode 120b, during the deposition process) but is not visible when looking at either the first deposition layer 155a or the fourth deposition layer 155d (shown as a top view in FIG. 11B). FIG. 11B is a deposition map 530 corresponding to the electroplated component 151 in FIG. 11A. The void 159 is identified in the deposition map 530 with two “0” values in the column “120b” and rows “155b” and “155c”.

[0095]While the void 159 is not visibly detectable in FIGS. 11A and 11B (i.e., the completed electroplated component 151), once the fourth deposition layer 155d is removed (e.g., as a part of the physical cross-sectioning of the electroplated component 151), the void 159 is visible, at least in the third deposited layer 155c (as schematically shown in FIGS. 11D and 11E). It should be noted that the electroplated component 151 can be cross-sectioned along a different axis, e.g., FIGS. 11A and 11D illustrate the cross-sections along the Z-axis. Similar cross-sections may be performed along the X-axis and/or along the Y-axis.

[0096]As such, the “0” value in the column “120b” and row “155c” are verified in this cross-section. In some examples, the “0” value in the column “120b” and row “155b” can be also verified in this cross-section, e.g., by measuring the depth of the void 159.

[0097]This example involves one of two common cross-sectioning procedures (XY cross-section, or removing deposit along the Z plane). In some examples, XZ cross-sections are performed (removing deposit along the Y plane), which may produce a view like the schematic of 11A, so that the visual inspection direction is along the Y direction and the resulting view may more closely match map 11C. Alternatively, YZ cross-sectioning may be performed.

[0098]In some examples, a further cross-section of the electroplated component 151 (e.g., the removal of the third deposited layer 155c) may be performed to determine the extent of the void 159 and potentially detect other voids.

[0099]In some examples, method 400 further comprises (block 490) updating the set of inspection parameters 520 based on ex-situ inspection 572. For example, the charge/current thresholds may be adjusted when the actual voids don't fully match the void portion subset 536. Specifically, the set of inspection parameters 520 is updated based on correlations of the results of the ex-situ inspection and values in the deposition map 530.

[0100]In some examples, method 400 further comprises (block 495) inspecting the deposition map 530 to assign a quality rating to the electroplated component 151. This operation may be also referred to as the “binning” of electroplated components. For example, an electroplated component 151 may have a certain aggregated size of the void portion subset 536, which may not be suitable for one application, but still suitable for another application.

Conclusion

[0101]Although the foregoing concepts have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. It should be noted that there are many alternative ways of implementing the processes, systems, and apparatuses. Accordingly, the present embodiments are to be considered illustrative and not restrictive.