Thermal Management Case System for Portable Electronic Device

SUMMARY

[0001]A case system for a portable electronic device includes (I) a front assembly including (A) a first side, (B) a second side extending perpendicular with respect to the first side, (C) a third side extending parallel with respect to the first side, (D) a fourth side extending parallel with the respect to the second side, and (E) a base extending perpendicular to and having an interior extending between the first side, the second side, the third side, and the fourth side, wherein the base includes a first portion having a thermal conductivity of at least 30 W/m.K, and wherein the first portion of the base includes at least 30% of the interior of the base.

[0002]In implementations the first portion of the base includes an aluminum alloy. In implementations the first portion of the base has a thermal conductivity of at least 100 W/m.K. In implementations the first portion of the base includes a copper alloy. In implementations the first portion of the base includes at least 50% of the interior of the base. In implementations the first portion of the base includes at least 75% of the interior of the base. Implementations further include at least one air mover positioned adjacent the first side. Implementations further include at least one air mover positioned midway between the first side and the third side. In implementations the base includes an exterior with a plurality of corrugated fins extending between the first side and the third side. In implementations the base includes a plurality of exterior corrugated longitudinal fins. Implementations further include a plate covering a portion of the plurality of exterior corrugated longitudinal fins. In implementations the first portion of the base includes a brass alloy. In implementations the first portion of the base includes a carbon fiber material. In implementations the first portion of the base includes a steel alloy.

[0003]A case system for a portable electronic device includes (I) a front assembly including (A) a first side, (B) a second side extending perpendicular with respect to the first side, (C) a third side extending parallel with respect to the first side, (D) a fourth side extending parallel with the respect to the second side, and (E) a base extending perpendicular to and having an interior extending between the first side, the second side, the third side, and the fourth side, wherein the base includes a first portion having a thermal conductivity of at least 30 W/m.K. In implementations the first portion of the base includes at least 50% of the interior of the base. Implementations further include at least one air mover positioned adjacent the first side.

[0004]A case system for a portable electronic device includes (I) a front assembly including (A) a first side, (B) a second side extending perpendicular with respect to the first side, (C) a third side extending parallel with respect to the first side, (D) a fourth side extending parallel with the respect to the second side, and (E) a base extending perpendicular to and having an interior extending between the first side, the second side, the third side, and the fourth side, wherein the base includes a first metallic portion, and wherein the first portion of the base includes at least 30% of the interior of the base. In implementations the first portion of the base has a thermal conductivity of at least 100 W/m.K. In implementations the base includes an exterior with a plurality of corrugated fins extending between the first side and the third side.

[0005]In addition to the foregoing, other aspects are described in the claims, drawings, and text forming a part of the disclosure set forth herein. Various other aspects are set forth and described in the teachings such as text (e.g., claims and/or detailed description) and/or drawings of the present disclosure. The foregoing is a summary and thus may contain simplifications, generalizations, inclusions, or omissions of detail; consequently, those skilled in the art will appreciate that the summary is illustrative only and is NOT intended to be in any way limiting. Other aspects, features, and advantages of the devices and/or processes and/or other subject matter described herein will become apparent in the teachings set forth herein.

BRIEF DESCRIPTION OF THE FIGURES

[0006]FIG. 1 is a front perspective view of a thermal management case system for portable electronic device.

[0007]FIG. 2 is a rear perspective view of the thermal management case system for portable electronic device of FIG. 1.

[0008]FIG. 3 is a rear perspective of a portable electronic device.

[0009]FIG. 4 is a front perspective of the portable electronic device of FIG. 3.

[0010]FIG. 5 is a front perspective view of thermal a management case system for portable electronic device of FIG. 1 coupled with portable electronic device of FIG. 3.

[0011]FIG. 6 is a top-elevational cross-sectional view of the thermal management case system for portable electronic device of FIG. 1 coupled with portable electronic device of FIG. 3 taken along the 6-6 cutline of FIG. 5.

[0012]FIG. 7 is a rear perspective view of a thermal management case system for portable electronic device coupled with portable electronic device of FIG. 3.

[0013]FIG. 8 is a top-elevational cross-sectional view of the thermal management case system for portable electronic device of FIG. 7 coupled with portable electronic device of FIG. 3 taken along the 8-8 cutline of FIG. 7.

[0014]FIG. 9 is a rear perspective view of a thermal management case system for portable electronic device coupled with portable electronic device of FIG. 3.

[0015]FIG. 10 is a top-elevational cross-sectional view of the thermal management case system for portable electronic device of FIG. 9 coupled with portable electronic device of FIG. 3 taken along the 10-10 cutline of FIG. 9.

[0016]FIG. 11 is a rear perspective view of a thermal management case system for portable electronic device coupled with portable electronic device of FIG. 3.

[0017]FIG. 12 is a top-elevational cross-sectional view of the thermal management case system for portable electronic device of FIG. 11 coupled with portable electronic device of FIG. 3 taken along the 12-12 cutline of FIG. 11.

[0018]FIG. 13 is an exploded rear perspective view of a thermal management case system for portable electronic device.

[0019]FIG. 14 is a partial exploded rear perspective view of the thermal management case system for portable electronic device of FIG. 13.

[0020]FIG. 15 is a rear perspective view of the thermal management case system for portable electronic device of FIG. 13.

[0021]FIG. 16 is an exploded rear perspective view of a thermal management case system for portable electronic device.

[0022]FIG. 17 is a rear perspective view of the thermal management case system for portable electronic device of FIG. 16.

[0023]FIG. 18 is a partial rear perspective view of a thermal management case system for portable electronic device.

[0024]FIG. 19 is a rear perspective view of the thermal management case system for portable electronic device of FIG. 18.

[0025]FIG. 20 is a partial rear perspective view of a thermal management case system for portable electronic device.

[0026]FIG. 21 is a rear perspective view of the thermal management case system for portable electronic device of FIG. 20.

[0027]FIG. 22 is an partial rear perspective view of a thermal management case system for portable electronic device.

[0028]FIG. 23 is a rear perspective view of the thermal management case system for portable electronic device of FIG. 22.

[0029]FIG. 24 is an exploded rear perspective view of a thermal management case system for portable electronic device.

[0030]FIG. 25 is a rear perspective view of the thermal management case system for portable electronic device of FIG. 24.

[0031]FIG. 26 is a front perspective view of a thermal management case system for portable electronic device.

[0032]FIG. 27 is a rear perspective view of the thermal management case system for portable electronic device of FIG. 26.

[0033]For a more complete understanding of implementations, reference now is made to the following descriptions taken in connection with the accompanying drawings. The use of the same symbols in different drawings typically indicates similar or identical items, unless context dictates otherwise.

[0034]With reference now to the figures, shown are one or more examples of Thermal Management Case System for Portable Electronic Device, articles of manufacture, compositions of matter for same that may provide context, for instance, in introducing one or more processes and/or devices described herein.

DETAILED DESCRIPTION

[0035]In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative implementations described in the detailed description, drawings, and claims are not meant to be limiting. Other implementations may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here.

[0036]Turning to FIG. 1, depicted therein is a front perspective view of thermal management case system for portable electronic device 10. Depicted implementation of thermal management case system for portable electronic device 10 is shown to include side 10a, side 10b, side 10c, side 10d, and base 10e. Depicted implementation of base 10e is shown to include interior planar surface of thermally conductive portion 10e1 and aperture 10e2.

[0037]Of note, implementations of thermally conductive portions of various bases depicted herein can be characterized as being of materials with thermal conductivities significantly exceeding those of conventional case materials. For instance, thermal conductivities (expressed in “Watts/(meter×Kelvin)” or ‘W/m.K”) of conventional case materials include 0.3 W/m.K for polyamide (nylon), 0.21 W/m.K for acrylonitrile butadiene styrene (ABS), 0.21 W/m.K for polycarbonate, 0.4 W/m.K for polyethylene terephthalate, and 0.29 W/m.K for polyurethane. (From following source: EngineerExcel, Charlie Young et al. (2023 Dec. 7). Thermal conductivity of plastics. EngineerExcel. https://engineerexcel.com/thermal-conductivity-plastic/).

[0038]In contrast, implementations of thermally conductive portions of various bases depicted herein can include materials, mixtures, alloys with much higher thermal conductivities such as materials, mixtures, or alloys of 235 W/m.K for aluminum, 109 W/m.K for brass, 100 W/m.K for carbon fiber, 401 W/m.K for copper, 314 W/m.K for gold, 67 W/m.K for iron, 35 W/m.K for lead, 91 W/m.K for nickel, 428 W/m.K for silver, 14 W/m.K for stainless steel, 43 W/m.K for steel, etc. (From following source: Thermal conductivity of materials. Material Properties. (2021 Mar. 17). https://material-properties.org/thermal-conductivity-of-materials/).

[0039]Turning to FIG. 2, depicted therein is a rear perspective view of thermal management case system for portable electronic device 10. Depicted implementation of base 10e is shown to include exterior planar surface of thermally conductive portion 10e3.

[0040]Turning to FIG. 3, depicted therein is a rear perspective of portable electronic device 200. Depicted implementation of portable electronic device 200 is shown to include side 200a, side 200b, side 200c, side 200d, and back 200e. Depicted implementation of back 200e is shown to include image input 200e1.

[0041]Turning to FIG. 4, depicted therein is a front perspective of the portable electronic device of FIG. 3. Depicted implementation of portable electronic device 200 is shown to include display 200f.

[0042]Turning to FIG. 5, depicted therein is a front perspective view of thermal a management case system for portable electronic device of FIG. 1 coupled with portable electronic device of FIG. 3.

[0043]Turning to FIG. 6, depicted therein is a top-elevational cross-sectional view of the thermal management case system for portable electronic device of FIG. 1 coupled with portable electronic device of FIG. 3 taken along the 6-6 cutline of FIG. 5.

[0044]Turning to FIG. 7, depicted therein is a rear perspective view of a thermal management case system for portable electronic device coupled with portable electronic device of FIG. 3. Depicted implementation of thermal management case system for portable electronic device 20 is shown to include side 20a, side 20b, side 20c, side 20d, and base 20e. Depicted implementation of base 20e is shown to include exterior corrugated fin surface of thermally conductive portion 20e1.

[0045]Turning to FIG. 8, depicted therein is a top-elevational cross-sectional view of the thermal management case system for portable electronic device of FIG. 7 coupled with portable electronic device of FIG. 3 taken along the 8-8 cutline of FIG. 7. Depicted implementation of base 20e is shown to include interior planar surface of thermally conductive portion 20e2.

[0046]Turning to FIG. 9, depicted therein is a rear perspective view of a thermal management case system for portable electronic device coupled with portable electronic device of FIG. 3. Depicted implementation of thermal management case system for portable electronic device 30 is shown to include side 30a, side 30b, side 30c, side 30d, and base 30e. Depicted implementation of base 30e is shown to include exterior corrugated fin surface of thermally conductive portion 30e1, and standoff 30e2.

[0047]Turning to FIG. 10, depicted therein is a top-elevational cross-sectional view of the thermal management case system for portable electronic device of FIG. 9 coupled with portable electronic device of FIG. 3 taken along the 10-10 cutline of FIG. 9. Depicted implementation of base 30e is shown to include interior planar surface of thermally conductive portion 30e3.

[0048]Turning to FIG. 11, depicted therein is a rear perspective view of a thermal management case system for portable electronic device coupled with portable electronic device of FIG. 3. Depicted implementation of thermal management case system for portable electronic device 40 is shown to include side 40a, side 40b, side 40c, side 40d, and base 40e. Depicted implementation of base 40e is shown to include exterior corrugated fin surface of thermally conductive portion 40e1, cover plate 40e2, and standoff 40e3. Depicted implementation of exterior corrugated fin surface of thermally conductive portion 40e1 is shown to include air passage 40e1a, air passage 40e1b, and air passage 40e1c.

[0049]Turning to FIG. 12, depicted therein is a top-elevational cross-sectional view of the thermal management case system for portable electronic device of FIG. 11 coupled with portable electronic device of FIG. 3 taken along the 12-12 cutline of FIG. 11. Depicted implementation of base 40e is shown to include interior planar surface of thermally conductive portion 40e4.

[0050]Turning to FIG. 13, depicted therein is an exploded rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic device 50 is shown to include side 50a, side 50b, side 50c, side 50d, and base 50e. Depicted implementation of base 50e is shown to include exterior corrugated fin surface of thermally conductive portion 50e1, fan area 50e2, standoff 50e3, cover plate 50e4, axial fan air mover 50e5, screened cover 50e6, and exterior planar surface of thermally conductive portion 50e7. Implementations of axial fan air mover 50e5 and the other air movers described herein can be powered by electrical power sources such as electrical batteries, USB or Apple lightning cabled sources, AC-to-DC power converters, etc.

[0051]Turning to FIG. 14, depicted therein is a partial exploded rear perspective view of the thermal management case system for portable electronic device of FIG. 13. Depicted implementation of exterior corrugated fin surface of thermally conductive portion 50e1 is shown to include air passage 50e1a, and air passage 50e1b.

[0052]Turning to FIG. 15, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of FIG. 13. Implementations of axial fan air mover 50e5 are so positioned with gapped separation to allow for air passage between axial fan air mover 50e5 and exterior planar surface of thermally conductive portion 50e7.

[0053]Turning to FIG. 16, depicted therein is an exploded rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic device 60 is shown to include side 60a, side 60b, side 60c, side 60d, and base 60e. Depicted implementation of base 60e is shown to include exterior corrugated fin surface of thermally conductive portion 60e1, fan area 60e2, exterior corrugated fin surface of thermally conductive portion 60e3, standoff 60e4, cover plate 60e5, axial fan air mover 60e6, and exterior planar surface of thermally conductive portion 60e7.

[0054]Turning to FIG. 17, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of FIG. 16. Depicted implementation of exterior corrugated fin surface of thermally conductive portion 60e1 is shown to include air passage 60e1a, and air passage 60e1b. Implementations of axial fan air mover 60e6 are so positioned with gapped separation to allow for air passage between axial fan air mover 60e6 and exterior planar surface of thermally conductive portion 60e7.

[0055]Turning to FIG. 18, depicted therein is a partial rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic device 70 is shown to include side 70a, side 70b, side 70c, side 70d, and base 70e. Depicted implementation of base 70e is shown to include exterior corrugated fin surface of thermally conductive portion 70e1, 70e2, centrifugal fan air mover 70e3, and exterior planar surface of thermally conductive portion 70e4. Depicted implementation of centrifugal fan air mover 70e3 is shown to include air inlet 70e3a, side 10b, side 10c, and air outlet 70e3b.

[0056]Turning to FIG. 19, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of FIG. 18. Depicted implementation of base 70e is shown to include cover plate 70e5, and exterior corrugated fin surface of thermally conductive portion 70e1 is shown to include air passage 70e1a, and air passage 70e1b.

[0057]Turning to FIG. 20, depicted therein is a partial rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic device 80 is shown to include side 80a, side 80b, side 80c, side 80d, and base 80e. Depicted implementation of base 80e is shown to include exterior corrugated fin surface of thermally conductive portion 80e1, standoff 80e2, air area 80e3, piezoelectric-based flapping fan air mover 80e4 (such as related to, but not limited to, technological developments by Mide Technology Corporation, Woburn, MA), and exterior planar surface of thermally conductive portion 80e5. In implementations, it may be preferred to keep piezoelectric-based flapping fan air mover 80e4 uncovered as shown in FIG. 20 rather than covered as shown in FIG. 21.

[0058]Turning to FIG. 21, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of FIG. 20. Depicted implementation of exterior corrugated fin surface of thermally conductive portion 80e1 is shown to include air passage 80e1a, and air passage 80e1b. Depicted implementation of air area 80e3 is shown to include air passage 80e3a, and air passage 80e3b. Depicted implementation of base 80e is shown to include cover plate 80e6.

[0059]Turning to FIG. 22, depicted therein is a partial rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of base 80e is shown to include centrifugal fan air mover 80e7.

[0060]Turning to FIG. 23, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of FIG. 22. Depicted implementation of base 80e is shown to include cover plate 80e8.

[0061]Turning to FIG. 24, depicted therein is an exploded rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic device 90 is shown to include side 90a, side 90b, side 90c, side 90d, and base 90e.

[0062]Depicted implementation of base 90e is shown to include exterior corrugated fin surface of thermally conductive portion 90e1, standoff 90e2, air mover area 90e3, piezoelectric-based vibrating-thin-membranes fan air mover assembly 90e4 (such as related to, but not limited to, technological developments by Frore Systems Inc, San Jose, CA), cover plate 90e5, and exterior planar surface of thermally conductive portion 90e6. Depicted implementation of piezoelectric-based vibrating-thin-membranes fan air mover assembly 90e4 is shown to include air intake 90e4a, and air outlet 90e4b.

[0063]Turning to FIG. 25, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of FIG. 24. Depicted implementation of exterior corrugated fin surface of thermally conductive portion 90e1 is shown to include air passage 90e1a, and air passage 90e1b.

[0064]Turning to FIG. 26, depicted therein is a front perspective view of a thermal management case system for portable electronic device 100 of larger size than portable electronic device 200. Depicted implementation of thermal management case system for portable electronic device 100 is shown to include side 100a, side 100b, side 100c, side 100d, and base 100e. Depicted implementation of base 100e is shown to include interior planar surface of thermally conductive portion 100e1, and aperture 100e2.

[0065]Turning to FIG. 27, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of FIG. 26. Depicted implementation of base 100e is shown to include exterior planar surface of thermally conductive portion 100e3. Implementations of thermal management case systems depicted in FIGS. 7-25 can be sized accordingly to equivalent sizing of thermal management case system for portable electronic device 10 relative to sizing of thermal management case system for portable electronic device 100.

[0066]While particular aspects of the present subject matter described herein have been shown and described, it will be apparent to those skilled in the art that, based upon the teachings herein, changes and modifications may be made without departing from the subject matter described herein and its broader aspects and, therefore, the appended claims are to encompass within their scope all such changes and modifications as are within the true spirit and scope of the subject matter described herein. It will be understood by those within the art that, in general, terms used herein, and especially in the appended claims (e.g., bodies of the appended claims) are generally intended as “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” etc.). It will be further understood by those within the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases “at least one” and “one or more” to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim recitation to claims containing only one such recitation, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an” (e.g., “a” and/or “an” should typically be interpreted to mean “at least one” or “one or more”); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of “two recitations,” without other modifiers, typically means at least two recitations, or two or more recitations). Furthermore, in those instances where a convention analogous to “at least one of A, B, and C, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., “a system having at least one of A, B, and C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). In those instances where a convention analogous to “at least one of A, B, or C, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., “a system having at least one of A, B, or C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). It will be further understood by those within the art that typically a disjunctive word and/or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms unless context dictates otherwise. For example, the phrase “A or B” will be typically understood to include the possibilities of “A” or “B” or “A and B.”

[0067]With respect to the appended claims, those skilled in the art will appreciate that recited operations therein may generally be performed in any order. Also, although various operational flows are presented in a sequence(s), it should be understood that the various operations may be performed in other orders than those which are illustrated, or may be performed concurrently. Examples of such alternate orderings may include overlapping, interleaved, interrupted, reordered, incremental, preparatory, supplemental, simultaneous, reverse, or other variant orderings, unless context dictates otherwise. Furthermore, terms like “responsive to,” “related to,” or other past-tense adjectives are generally not intended to exclude such variants, unless context dictates otherwise.