HEAT DISSIPATION DEVICE WITH FAN MODULE

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a non-provisional and claims priority to China Application No. 202422764053.2, filed on November 12, 2024, the contents are thereby incorporated by reference in its entirety.

TECHNICAL FIELD

[0002] The present disclosure relates to a heat dissipation device, particularly to a heat dissipation device incorporating a fan module.

BACKGROUND

[0003] Electronic devices and machinery typically generate significant heat during operation. Manufacturers commonly incorporate heat dissipation devices to maintain consistent performance and avert overheating. Conventional heat dissipation devices primarily utilize a fan for forced air cooling. However, as the power consumption of electronic components increases, heat dissipation devices utilizing only a single, independent fan often because inadequate to fulfill the necessary cooling requirements. Accordingly, the use of multiple fans within a single heat dissipation device has emerged as dominant trend in development.

[0004] In the related art, heat dissipation devices incorporating multi fans often suffer from structural restrictions. In particular, power cables connected to the respective fans tend to become entangled, causing chaos inside the chassis. Furthermore, since each fan typically requires its own dedicated power wire, such configurations lead to cable redundancy, greater material cost, and inconvenience during assembly and disassembly.

[0005] Therefore, there exists a need for improved heat dissipation devices that overcome the aforementioned drawbacks. It is desirable to provide a heat dissipation device incorporating a fan module that simplifies electrical connectivity, lowers cable clutter, and enhances ease of assembly and maintenance.

SUMMARY

[0006] In general terms, this disclosure is directed to a heat dissipation device. In some embodiments, and by non-limiting example, the present disclosure provides a heat dissipation device that incorporates a fan module.

[0007] An aspect of the present disclosure provides a heat dissipation device. The heat dissipation device includes a liquid-cooling radiator assembly, a fan mounting structure disposed on the liquid-cooling radiator assembly, a plurality of recesses formed on an outer side of the fan mounting structure, a plurality of contact terminals mounted in the recesses, respectively, a power connector disposed on the fan mounting structure and electrically connected to the contact terminals, and at least two fans arranged side-by-side and mounted to the fan mounting structure, each fan including a plurality of spring pins. When the fans are secured to the fan mounting structure, each of the spring pins is in electrical contact with a corresponding contact terminal to form a power supply path among the power connector, the contact terminals, and the spring pins.

[0008] In some embodiments, the fan mounting structure comprises a bottom frame having multiple frame portions connected in a rectangular arrangement, side stoppers disposed on opposite sides of the bottom frame, and a front stopper disposed on a front side of and connected to the bottom frame.

[0009] In some embodiments, the front stopper and the side stoppers together define an accommodating region to receive the side-by-side arranged fans.

[0010] In some embodiments, each inner corner of the frame portions is provided with a first fixing hole, each longitudinally extending frame portion is provided with at least one second fixing hole, and each fan includes at least one third fixing hole.

[0011] In some embodiments, the heat dissipation device further includes a plurality of fasteners, each fastener being inserted through a respective one of the first fixing holes and the second fixing holes and engaging a corresponding third fixing hole of the fan to secure the fan to the bottom frame of the fan mounting structure.

[0012] In some embodiments, the liquid-cooling radiator assembly comprises a liquid-cooling radiator and a liquid-cooling conduit.

[0013] In some embodiments, the liquid-cooling conduit passes through a through-hole disposed on one of the side stoppers.

[0014] In some embodiments, the bottom frame, the side stoppers, and the front stopper are integrally formed as a single structure.

[0015] In some embodiments, the heat dissipation device further includes a display panel disposed on the front stopper.

[0016] In some embodiments, each fan integrates a temperature sensor, and the temperature sensors are electrically connected to the display panel that is configured to display temperature information acquired by the temperature sensors.

[0017] Another aspect of the present disclosure provides a heat dissipation device. The heat dissipation device includes a liquid-cooling radiator assembly and a fan mounting structure disposed on the liquid-cooling radiator assembly. The fan mounting structure includes a bottom frame, side stoppers disposed on opposite sides of the bottom frame, a front stopper disposed on a front side of and connected to the bottom frame, and a plurality of positioning protrusions. The heat dissipation device further includes a plurality of first magnetic attachments disposed on the fan mounting structure, at least two fans arranged side-by-side. Each fan includes a plurality of positioning recesses and a plurality of second magnetic attachments. Each positioning recess includes a wide section and a narrow section connected thereto, the width of the wide section being greater than the width of the narrow section.

[0018] In some embodiments, the mounting structure includes a plurality of contact terminals, and each fan includes a plurality of spring pins, and each of the spring pins is in electrical contact with a corresponding contact terminal when the fans are secured to the fan mounting structure.

[0019] In some embodiments, the heat dissipation device further includes a power connector that is disposed on one of the side stoppers and electrically connected to the fans to form a power supply path among the power connector, the contact terminals, and the spring pins.

[0020] In some embodiments, the positioning protrusions are removably received in corresponding positioning recesses, and when the positioning protrusions are located in the narrow sections, the fans are secured by magnetic attraction between the first magnetic attachments and the second magnetic attachments.

[0021] This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

[0022]FIG. 1 is a perspective view of a heat dissipation device, in accordance with some embodiments of the present disclosure.

[0023]FIG. 2 is a perspective view of a fan of the heat dissipation device of FIG. 1.

[0024]FIG. 3 is an exploded view illustrating installation of the fan of FIG. 1.

[0025]FIG. 4 is a perspective view of a fan mounting structure of the heat dissipation device of FIG. 1, shown from a first angle.

[0026]FIG. 5 is a perspective view of the fan mounting structure of FIG. 1, shown from a second angle.

[0027]FIG. 6 is a perspective view of a bottom frame of the heat dissipation device of FIG. 1.

[0028]FIG. 7 is an exploded view of a heat dissipation device, in accordance with some embodiments of the present disclosure.

[0029]FIG. 8 is a cross-sectional view of the heat dissipation device of FIG. 7.

[0030]FIG. 9 is a perspective view showing a fan of the heat dissipation device of FIG. 7 prior to being mounted to the fan mounting structure.

[0031]FIG. 10 is a perspective view showing the fan of FIG. 9 mounted to the fan mounting structure.

[0032]FIG. 11 is a cross-sectional view of a heat dissipation device, in accordance with some embodiments of the present disclosure.

[0033]FIG. 12 is a perspective view showing a fan of the heat dissipation device of FIG. 11 prior to being mounted to the fan mounting structure.

[0034]FIG. 13 is a perspective view showing the fan of FIG. 12 mounted to the fan mounting structure.

[0035]FIG. 14 is a cross-sectional view showing the fan of FIG. 13 mounted to the fan mounting structure.

[0036]FIG. 15 is another perspective view of the fan of FIG. 13 mounted to the fan mounting structure.

[0037]FIG. 16 is another cross-sectional view of the fan of FIG. 13 mounted to the fan mounting structure.

DETAILED DESCRIPTION

[0038] Various embodiments will be described in detail with reference to the drawings, wherein like reference numerals represent like parts and assemblies throughout the several views. Reference to various embodiments does not limit the scope of the claims attached hereto. Additionally, any examples set forth in this specification are not intended to be limiting and merely set forth some of the many possible embodiments for the appended claims.

[0039] Referring to FIG. 1, FIG. 1 illustrates a perspective view of a heat dissipation device 100 in accordance with some embodiments of the present disclosure. As an example shown in FIG. 1, the heat dissipation device 100 includes a liquid-cooling radiator assembly 1, a fan mounting structure 2, and at least two fans 3. The fan mounting structure 2 is disposed on the liquid-cooling radiator assembly 1. The fans 3 are arranged side-by-side and mounted to the fan mounting structure 2. By employing the fan mounting structure 2 to secure the side-by-side fans 3, the assembly of the heat dissipation device 100 can be modularized.

[0040] Referring to FIGS. 2-6 along with FIG. 1, FIG. 2 is a perspective view of a fan of FIG. 1; FIG. 3 is an installation view of the fan of FIG. 1; FIG. 4 is a perspective view of the fan mounting structure of FIG. 1 from a first angle; FIG. 5 is a perspective view of the fan mounting structure of FIG. 1 from a second angle; and FIG. 6 is a perspective view of a bottom frame 21 of the heat dissipation device 100 of FIG. 1. As shown in FIG. 4, the fan mounting structure 2 includes a bottom frame 21, side stoppers 22 and 23, and a front stopper 24. The bottom frame 21 is mounted to the liquid-cooling radiator assembly 1. The side stoppers 22, 23 are disposed on the liquid-cooling radiator assembly 1 on opposite sides of the bottom frame 21. The front stopper 24 is disposed on one end of two side stoppers 22, 23 and connected to the bottom frame 21. The surface of the front stopper 24 coupled to two side stoppers 22, 23 is facing the bottom frame 21. The front stopper 24 and the side stoppers 22, 23 together define an accommodating region S. The fans 3 are arranged side-by-side and mounted within the accommodating region S. In some examples, the front stopper 24 can also be connected to the side stoppers 22, 23.

[0041] According to the illustrated embodiments, the bottom frame 21, the side stoppers 22, 23, and the front stopper 24 are all separate components. In other embodiments, the bottom frame 21, the side stoppers 22, 23, and the front stopper 24 can be formed as a single integrated structure.

[0042]In some embodiments, the bottom frame 21 includes four frame portions 211, 212, 213, and 214 connected in a rectangular arrangement. The frame portion 211 and the frame portion 213 are opposed with one another; the frame portion 212 and the frame portion 214 are opposed with one another. Inner corners of the frame portions 211-214 are provided with first fixing portions 215, respectively. Each of the first fixing portions 215 defines a first fixing hole K1. The frame portions 211 and 213 are each provided with at least one second fixing portion 216 protruding inwardly. Each second fixing portion 216 includes a second fixing hole K2. The heat dissipation device 100 further includes multiple fasteners 217. Each fan 3 has multiple third fixing holes K3. The fasteners 217 are inserted through the first fixing holes K1 and second fixing holes K2. The fasteners 217 further engage the third fixing holes K3 to secure the fans 3 to the bottom frame 21. The fasteners 217 may be, for example, screws. It is appreciated that the number of second fixing portions 216 and second fixing holes K2 may be varied as needed.

[0043]In some embodiments, each fan 3 includes spring pins 31. The frame portion 211 includes at least one recess C1 on its outer side. The heat dissipation device 100 further includes at least one contact terminal 4 (sometimes referred to as a “gold finger”). For example, three recesses C1 and three corresponding contact terminals 4 may be provided. The contact terminals 4 are mounted in the recesses C1. A power connector 221 is disposed on the side stopper 22 for connection to an external power supply. The contact terminals 4 are electrically connected to the power connector 221, for example, through internal wiring (not shown). When the fans 3 are secured to the bottom frame 21, the spring pins 31 establish electrical contact with the corresponding contact terminals 4, forming a power supply connection between the power connector 221, the contact terminals 4, and the spring pins 31. Accordingly, fan power is supplied and the need of distinct wiring is significantly minimized.

[0044]As an example shown in FIG. 6, three recesses C1 are formed along a longitudinal direction of the frame portion 211 for receiving the contact terminals 4. However, the embodiments is not limited thereto. In other embodiments, the positions of the recesses C1 may be adjusted according to fan type. For example, all three recesses C1 may be formed on the frame portion 213, or the recess C1 in the middle may be formed on the frame portion 213 while the remaining recesses C1 are still positioned on the frame portion 211. Therefore, the recesses C1 may be distributed across different frame portions 211, 213.

[0045]In some embodiments, the liquid-cooling radiator assembly 1 includes a liquid-cooling radiator 11 and at least one liquid-cooling conduit 12. The side stopper 23 includes at least one through-hole K4. The liquid-cooling conduit 12 passes through the through-hole K4 and connects to the liquid-cooling radiator 11.

[0046]As an example shown in FIG. 5, the power connector 221 is disposed on the side stopper 22 and the through-hole K4 is formed on the side stopper 23. However, the embodiment is not limited thereto. In other embodiments, the positions of the power connector 221 and through-hole K4 may be adjusted according to the connection between the liquid-cooling radiator 11 and the liquid-cooling conduit 12. For example, the power connector 221 and the through-hole K4 may both be disposed on the side stopper 22, or both on the side stopper 23.

[0047] In some embodiments, the heat dissipation device 100 further includes a display panel 5 disposed on the front stopper 24. Each fan 3 integrates a temperature sensor (not shown) therein. The temperature sensors are electrically connected to the display panel 5, which is configured to display temperature information acquired by the temperature sensors.

[0048] Referring to FIGS. 7 and 8, FIG. 7 is an exploded perspective view of a heat dissipation device 200 in accordance with some embodiments of the present disclosure, and FIG. 8 is a cross-sectional view thereof. The difference between the heat dissipation device 200 and the heat dissipation device 100 illustrated in FIGS. 1-6 lies in the fan securing mechanism. In FIGS. 1-6, the fan 3 is secured to the fan mounting structure 2 by screws. In the example shown in FIGS. 7-8, the fan 3A is secured to the fan mounting structure 2A by a plurality of first magnetic attachments 218A and a plurality of second magnetic attachments 219A.

[0049] In some embodiments, the first magnetic attachments 218A are disposed on the fan mounting structure 2A, and the second magnetic attachments 219A are disposed on the fan 3A. For example, the first magnetic attachments 218A and the second magnetic attachments 219A can be magnets.

[0050] In some embodiments, the fan mounting structure 2A may further include a plurality of positioning protrusions 23A, and each fan 3A may include a plurality of positioning recesses 32A. The positioning protrusions 23A are removably received in the corresponding positioning recesses 32A, securing the fan 3A into the fan mounting structure 2A.

[0051] Referring to FIGS. 9 and 10, FIG. 9 is a perspective view showing the fan 3A prior to installation into the fan mounting structure 2A, and FIG. 10 is a perspective view showing the fan 3A installed into the fan mounting structure 2A.

[0052] In some embodiments, when the user intends to install the fan 3A into the fan mounting structure 2A, the fan 3A may be moved along direction A into the fan mounting structure 2A. The positioning protrusions 23A and positioning recesses 32A cooperate to align the fan 3A. Further, the first magnetic attachments 218A and the second magnetic attachments 219A magnetically secure the fan 3A to the fan mounting structure 2A. Additionally, the spring pins 31 of the fan 3A are electrically connected to the contact terminal 4. Accordingly, the fan 3A is both mechanically secured and electrically connected upon installation.

[0053] In some embodiments, when the user intends to remove the fan 3A from the fan mounting structure 2A, the fan 3A may be moved in the opposite direction of direction A. This separates the positioning protrusions 23A from the positioning recesses 32A as well as disengaging the first magnetic attachments 218A from the second magnetic attachments 219A. Accordingly, the fan 3A can be readily detached from the fan mounting structure 2A.

[0054] According to the embodiments, both the first magnetic attachments 218A and the second magnetic attachments 219A are magnets, but the embodiment is not limited thereto. In other embodiments, one or both of the attachments may be made of magnetically conductive materials.

[0055] Referring to FIG. 11, FIG. 11 is a cross-sectional view of a heat dissipation device 300 in accordance with some embodiments of the present disclosure. The difference between the heat dissipation device 300 and the heat dissipation device 200, as shown in FIGS. 7-10, lies in the structure of the positioning recesses 32A in the heat dissipation device 200 and structure of the positioning recesses 32B in the heat dissipation device 300. Specifically, in the heat dissipation device 300, each positioning recess 32B includes a wide section 321B and a narrow section 322B connected thereto, with the width of the wide section 321B greater than that of the narrow section 322B.

[0056] In some embodiments, when the positioning protrusions 23B are located in the wide sections 321B, the fan 3B is disengaged from its positional fixation and is capable of movement relative to the fan mounting structure 2B. When the positioning protrusions 23B are located in the narrow sections 322B, the fan 3B is placed into the fan mounting structure 2B, and the fan 3B is further secured by the magnetic attraction between the first magnetic attachments 218B and the second magnetic attachments 219B.

[0057] Referring to FIGS. 12 to 16, FIG. 12 is a perspective view illustrating the fan 3B prior to installation in the fan mounting structure 2B, in accordance with some embodiments of the present disclosure. FIG. 13 is a perspective view illustrating the fan 3B installed in the fan mounting structure 2B. FIG. 14 is a cross-sectional view illustrating the installation of the fan 3B in the fan mounting structure 2B. FIG. 15 is another perspective view illustrating the fan 3B installed in the fan mounting structure 2B, and FIG. 16 is a cross-sectional view corresponding to FIG. 15.

[0058] In some embodiments, when a user intends to install the fan 3B into the fan mounting structure 2B, as shown in FIGS. 12 to 14, the fan 3B may be placed into the fan mounting structure 2B along direction B, so that the positioning protrusions 23B are respectively located in the wide sections 321B of the positioning recesses 32B.

[0059] In some embodiments, the fan 3B is moved along direction C, forcing the positioning protrusions 23B to be move from the wide sections 321B to the narrow sections 322B, as shown in FIGS. 15 and 16. When the positioning protrusions 23B are respectively located in the narrow sections 322B, they are positioned within the positioning recesses 32B, therefore securing the fan 3B in the fan mounting structure 2B. Simultaneously, the first magnetic attachments 218B engage with the second magnetic attachments 219B, further securing the fan 3B to the fan mounting structure 2B and electrically connecting the fan 3B’s the spring pins 31 to the contact terminals 4. Accordingly, the fan 3B is mounted to the fan mounting structure 2B.

[0060] In some embodiments, when a user intends to remove the fan 3B from the fan mounting structure 2B, the fan 3B is first moved in the opposite direction of direction C such that the positioning protrusions 23B are displaced from the narrow sections 322B back into the wide sections 321B, disengaging the first magnetic attachments 218B from the second magnetic attachments 219B and releasing the positioning and securing of the fan 3B within the fan mounting structure 2B. The fan 3B then is moved in the opposite direction of direction B, separating the positioning protrusions 23B from the positioning recesses 32B. Accordingly, the fan 3B is removed from the fan mounting structure 2B.

[0061] The present disclosure employs a fan mounting structure to secure multiple fans arranged side-by-side, allowing for modular assembly of the heat dissipation device. Additionally, cooperation between the spring pins and the contact terminal not only enables the fan to operate, but also significantly minimizes the need for wiring. Furthermore, the inclusion of a display panel enables real-time monitoring of the heat dissipation device’s operating conditions. .

[0062] Therefore, embodiments disclosed herein are well adapted to attain the ends and advantages mentioned as well as those that are inherent therein. The particular embodiments disclosed above are illustrative only, as the embodiments disclosed may be modified and practiced in different but equivalent manners apparent to those of ordinary skill in the relevant art having the benefit of the teachings herein. Furthermore, no limitations are intended to the details of construction or design herein shown, other than as described in the claims below. It is therefore evident that the particular illustrative embodiments disclosed above may be altered, combined, or modified and all such variations are considered within the scope and spirit of the present disclosure. Of course, the disclosed embodiments are merely exemplary embodiments and that various modifications can be made without departing from the spirit and scope of the disclosure. Further, it should be understood that various aspects of the embodiment are not mutually exclusive of each other and can be combined as desired by a person of ordinary skill in the art as a matter of design choices.

[0063] The embodiments illustratively disclosed herein suitably may be practiced in the absence of any element that is not specifically disclosed herein and/or any optional element disclosed herein. While compositions and methods are described in terms of “comprising,” “containing,” or “including” various components or steps, the compositions and methods can also “consist essentially of” or “consist of” the various components and steps. All numbers and ranges disclosed above may vary by some number. Whenever a numerical range with a lower limit and an upper limit is disclosed, any number and any included range falling within the range is specifically disclosed. In particular, every range of values (of the form, “from about a to about b,” or, equivalently, “from approximately a to b,” or, equivalently, “from approximately a-b”) disclosed herein is to be understood to set forth every number and range encompassed within the broader range of values. Also, the terms in the claims have their plain, ordinary meaning unless otherwise explicitly and clearly defined by the patentee. Moreover, the indefinite articles “a” or “an,” as used in the claims, are defined herein to mean one or more than one of the elements that it introduces.