US20260139883A1
ADAPTABLE INTERLOCKED MANIFOLD
Publication
Application
Classifications
IPC Classifications
CPC Classifications
Applicants
Hanon Systems
Inventors
Sangyong Rhee, Viktor Nyeste, Orest Alexandru Dziubinschi, Madison Turner, Travis LaCross
Abstract
A manifold assembly for conveying a refrigerant therethrough includes a high pressure block configured to be fluidly and mechanically coupled to a condenser of a refrigerant circuit, a low pressure block configured to be fluidly and mechanically coupled to an evaporator of the refrigerant circuit, and a control block disposed between the high pressure block and the low pressure block and configured to be fluidly and mechanically coupled to each of the high pressure block and the low pressure block.
Figures
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001]This patent application claims priority to U.S. Provisional Patent Application Ser. No. 63/721,159, filed on Nov. 15, 2024, the entire disclosure of which is hereby incorporated herein by reference.
FIELD OF THE INVENTION
[0002]The invention relates to a manifold structure, and more particularly, a multi-component manifold structure of a refrigerant distribution module of a thermal management system.
BACKGROUND
[0003]A thermal management system of a vehicle may include a plurality of different fluid circuits configured to manage the characteristics of one or more corresponding fluids. For example, a thermal management system may include at least one refrigerant circuit and/or at least one coolant circuit, each of which includes multiple fluid conveying components arranged in a manner requiring the formation of fluid tight seals at each junction therebetween. Such fluid systems further require the use of fluid lines provided as pipes, hoses, or the like for fluidly connecting the fluid conveying components of each associated fluid circuit.
[0004]It has become increasingly desirable for the components forming a thermal management system of a vehicle to be provided in modular form to facilitate an ease of manufacturing of the thermal management system, a reduction of a packaging space occupied by the thermal management system, an ease of accessing the thermal management system for performing repair and/or maintenance thereof, and a reduction in the number of individual components that need to be coupled to each other while maintaining fluid tight seals therebetween. Such a thermal management system module may include the incorporation therein of multiple components associated with operation of a corresponding refrigeration system and/or coolant system of the vehicle. The thermal management system module may be at least partially preassembled and then received within a corresponding space within the vehicle while utilizing a minimized number of couplings and connections.
[0005]One drawback to the use of such a modular thermal management system relates to the manner in which the reduction in the number of independent components forming the thermal management system leads to the need to produce relatively large and complex structures that are connected to or otherwise associated with multiple components of the thermal management system. For example,
[0006]Implementation of either of the exemplary manifold structures may thus undesirably require that relatively large manufacturing machines (such as 6,000 ton hot forging machines) be utilized in manufacturing such relatively large and monolithic components, which can negatively require additional facility space, cost, and energy usage in performing the manufacturing processes associated with formation of either of the described manifold structures. Additionally, the formation of relatively large components can in some circumstances lead to a reduction in the number of suitable manufacturing processes capable of achieving such configurations, which may lead to the elimination of the use of manufacturing processes that are relatively fast, energy efficient, and/or cost effective in place of more complex and/or costly processes.
[0007]Another concern with the manufacturing of such relatively large components relates to the manner in which it is difficult to maintain dimensional accuracy across an entirety of such components, which may result in one or more of the fluid or mechanical connections along the corresponding manifold structure being misaligned such that it is difficult to efficiently assemble the corresponding thermal management system module. Such a lack of dimensional accuracy can accordingly lower the first time through (FTT) metric associated with the manufacturing of such manifold structures, thereby reducing the efficiency of the corresponding manufacturing process while adding additional time and cost.
[0008]Lastly, such relatively large manifold structures having multiple fluid and/or mechanical connections are not able to be easily adapted for use with different packaging configurations and/or different fluid flow configurations as may be associated with different and new vehicle configurations. That is, any repositioning, addition, or removal of any of the fluid or mechanical connections may lead to the need to redesign the entire manifold structure and/or to utilize different manufacturing machines and/or processes to achieve such variability. Such manifold structures may thus be limited to use in only a select number of vehicles having similar configurations and features.
[0009]It would thus be desirable to provide an improved manifold structure for use in a modular thermal management system that reduces the size of the manufacturing equipment necessary to produce the manifold structure, that improves the dimensional accuracy of the relevant features thereof, and that promotes the adaptability of the manifold structure to different vehicle configurations and/or modes of operation of the corresponding modular thermal management system.
SUMMARY OF THE INVENTION
[0010]In accordance with the present disclosure, a multi-component manifold assembly of a thermal management system has surprisingly been discovered.
[0011]According to an embodiment of the present invention, a manifold assembly for conveying a refrigerant therethrough includes a high pressure block configured to be fluidly and mechanically coupled to a condenser of a refrigerant circuit, a low pressure block configured to be fluidly and mechanically coupled to an evaporator of the refrigerant circuit, and a control block disposed between the high pressure block and the low pressure block and configured to be fluidly and mechanically coupled to each of the high pressure block and the low pressure block.
BRIEF DESCRIPTION OF THE DRAWINGS
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[0022]
DETAILED DESCRIPTION OF THE INVENTION
[0023]The following description of technology is merely exemplary in nature of the subject matter, manufacture and use of one or more inventions, and is not intended to limit the scope, application, or uses of any specific invention claimed in this application or in such other applications as may be filed claiming priority to this application, or patents issuing therefrom. Regarding methods disclosed, the order of the steps presented is exemplary in nature, and thus, the order of the steps can be different in various embodiments. “A” and “an” as used herein indicate “at least one” of the item is present; a plurality of such items may be present, when possible. Except where otherwise expressly indicated, all numerical quantities in this description are to be understood as modified by the word “about” and all geometric and spatial descriptors are to be understood as modified by the word “substantially” in describing the broadest scope of the technology. “About” when applied to numerical values indicates that the calculation or the measurement allows some slight imprecision in the value (with some approach to exactness in the value; approximately or reasonably close to the value; nearly). If, for some reason, the imprecision provided by “about” and/or “substantially” is not otherwise understood in the art with this ordinary meaning, then “about” and/or “substantially” as used herein indicates at least variations that may arise from ordinary methods of measuring or using such parameters.
[0024]All documents, including patents, patent applications, and scientific literature cited in this detailed description are incorporated herein by reference, unless otherwise expressly indicated. Where any conflict or ambiguity may exist between a document incorporated by reference and this detailed description, the present detailed description controls.
[0025]Although the open-ended term “comprising,” as a synonym of non-restrictive terms such as including, containing, or having, is used herein to describe and claim embodiments of the present technology, embodiments may alternatively be described using more limiting terms such as “consisting of” or “consisting essentially of.” Thus, for any given embodiment reciting materials, components, or process steps, the present technology also specifically includes embodiments consisting of, or consisting essentially of, such materials, components, or process steps excluding additional materials, components or processes (for consisting of) and excluding additional materials, components or processes affecting the significant properties of the embodiment (for consisting essentially of), even though such additional materials, components or processes are not explicitly recited in this application. For example, recitation of a composition or process reciting elements A, B and C specifically envisions embodiments consisting of, and consisting essentially of, A, B and C, excluding an element D that may be recited in the art, even though element D is not explicitly described as being excluded herein.
[0026]As referred to herein, disclosures of ranges are, unless specified otherwise, inclusive of endpoints and include all distinct values and further divided ranges within the entire range. Thus, for example, a range of “from A to B” or “from about A to about B” is inclusive of A and of B. Disclosure of values and ranges of values for specific parameters (such as amounts, weight percentages, etc.) are not exclusive of other values and ranges of values useful herein. It is envisioned that two or more specific exemplified values for a given parameter may define endpoints for a range of values that may be claimed for the parameter. For example, if Parameter X is exemplified herein to have value A and also exemplified to have value Z, it is envisioned that Parameter X may have a range of values from about A to about Z. Similarly, it is envisioned that disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping or distinct) subsume all possible combination of ranges for the value that might be claimed using endpoints of the disclosed ranges. For example, if Parameter X is exemplified herein to have values in the range of 1-10, or 2-9, or 3-8, it is also envisioned that Parameter X may have other ranges of values including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, 3-9, and so on.
[0027]When an element or layer is referred to as being “on,” “engaged to,” “connected to,” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to,” “directly connected to” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
[0028]Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
[0029]Spatially relative terms, such as “inner,” “outer,” “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0030]
[0031]As explained hereinafter, the RDM 1 being in fluid and/or heat exchange communication with the coolant control module having the coolant circuit may include the coolant being circulated through various heat exchangers of the refrigerant circuit formed by the RDM 1, wherein such heat exchangers may refer to one or both of the condenser and the evaporator of the corresponding refrigerant circuit. However, the RDM 1 may be utilized in any type of vehicle, including internal combustion engine (ICE) vehicles utilizing alternative refrigerant circuit configurations and heat exchange fluids, while still appreciating the beneficial features of the RDM 1 as disclosed herein. It should be apparent to one skilled in the art that the disclosed configuration of the RDM 1 may be adapted for use with components more commonly associated with ICE vehicle refrigerant circuits and the use of air (rather than liquid coolant) as a primary heat exchange medium while remaining within the scope of the present invention.
[0032]The RDM 1 includes the implementation of a refrigerant manifold assembly 2 utilized for distributing refrigerant to and/or receiving refrigerant from multiple different refrigerant-conveying components of the refrigerant circuit of the RDM 1. The manifold assembly 2 may also play a role in receiving and distributing a coolant to any refrigerant-to-coolant heat exchangers associated with the RDM 1, such as is disclosed in the present example. The manifold assembly 2 may form a base structure of the RDM 1 and may include associated flanges, bracket-like structures, or other connecting means for mounting the manifold assembly 2 to the associated vehicle, such as mounting the manifold assembly 2 to a chassis of the vehicle.
[0033]The manifold assembly 2 includes each of a high pressure block (HPB) 9, a control block (CB) 10, and a low pressure block (LPB) 11. The HPB 9 is configured to be removably coupled to the CB 10 and the CB 10 is configured to be removably coupled to the LPB 11. The removable coupling of the blocks 9, 10, 11 refers to both a removable fluid coupling of the refrigerant conveying flow paths formed through adjacent ones of the blocks 9, 10, 11 to one another as well as a mechanical coupling of each of the adjacent blocks 9, 10, 11 to one another. The manifold assembly 2 may accordingly be manufactured via the independent formation of three different components, each of which occupies only a minority (less than 50%) of a total volume of the assembled manifold assembly 2. The use of three relatively smaller components allows each of the blocks 9, 10, 11 to be formed by a relatively smaller manufacturing apparatus in comparison to the relatively large manifold structures described in the present background section, thereby providing the ability to utilize various different manufacturing processes that may be more cost effective, timely, fast, efficient, reliable, or the like.
[0034]The removable coupling of the blocks 9, 10, 11 to one another also allows the manifold assembly 2 to be partially disassembled for providing access to various components of the RDM 1 or adjacent systems, and/or for performing repair/maintenance to only a portion of the RDM 1 associated with only certain ones of the blocks 9, 10, 11. This removable multi-component configuration of the manifold assembly 2 thereby eliminates the need to remove or replace the entirety of a common manifold structure as may be necessary with respect to the relatively large manifold structures of the prior art.
[0035]Each of the blocks 9, 10, 11 includes a plurality of fluid component connection structures 20 and a plurality of block connection structures 30. As shown, each of the connection structures 20, 30 has the configuration of a block of a block fitting assembly, which may alternatively be referred to as a coupling flange herein. Such a block fitting assembly may include a male block (flange), a complimentary female block (flange), a sealing element disposed between complimentary portions of the male block and the female block, and a tightening means for compressing the sealing element between the male and female blocks, wherein a fluid flow path is formed through each of the male block, the sealing element, and the female block with the sealing element compressed to seal the interface between the male and female blocks along the corresponding fluid flow path. Such block fitting assemblies may accordingly provide a sealed fluid flow path between adjacent components of the refrigerant circuit while also partially or fully mechanically coupling such fluid conveying components to one another. However, other forms of fluid connecting structures or configurations for achieving the same forms of sealed fluid connections may be utilized without necessarily departing from the scope of the present invention, hence the present invention is not limited to the use of the complimentary male and female block fittings for forming the necessary sealed connections.
[0036]As depicted, each of the fluid component connection structures 20 is more specifically shown as resembling one of the described female blocks of such block fitting assemblies, wherein each of the fluid conveying components coupled to one of the fluid component connection structures 20 may thus include the complimentary male block (not shown) formed or otherwise provided thereon for mating with one of the fluid component connection structures 20. However, alternative or reverse configurations may be utilized while remaining within the scope of the present invention, such as the blocks 9, 10, 11 including the male fluid component connection structures 20 for coupling to fluid components having female fluid component connection structures 20, as desired. The connections formed at each of the fluid component connection structures 20 may also be utilized in mounting the corresponding fluid conveying components to the manifold assembly 20 absent additional coupling structures or means, or may alternatively be supplemented by the inclusion of additional bracket-like structures or other mechanical connection structures on or associated with any of the disclosed blocks 9, 10, 11, as circumstances may warrant for suitably mounting the associated fluid conveying components to the manifold assembly 2. In any circumstance, each of the fluid component connection structures 20 is associated with both fluidly and mechanically coupling the associated fluid conveying component to the manifold assembly 2 to facilitate mechanical stability and fluid communication between each of the blocks 9, 10, 11 and each of the fluid conveying components associated therewith.
[0037]Each of the block connection structures 30 is associated with both fluidly and mechanically coupling the CB 10 to a corresponding one of the HPB 9 or the LPB 11. Each of the block connection structures 30 is also shown as being provided as a female block of a block fitting assembly in similar fashion to the described fluid component connection structures 20. As shown in
[0038]Each of the block connection structures 30 is formed in the corresponding block 9, 10, 11 to be three-dimensionally positioned for alignment with a corresponding block connection structure 30 of another one of the blocks 9, 10, 11 while forming as short of a flow path therebetween for eliminating unnecessary length to the manifold assembly 2 while also more efficiently passing the refrigerant (and/or coolant, as circumstances may warrant) between adjacent blocks 9, 10, 11 without substantively altering the properties thereof, such as maintaining the pressure of the refrigerant across such joints. In the provided embodiment, there are three joints formed between the blocks 9, 10 and two joints formed between the blocks 10, 11, but alternative numbers and configurations of the joints may be utilized while remaining within the scope of the present invention, including different configurations associated with variations to the refrigerant circuit from that disclosed herein. Each of the joints formed between the blocks 9, 10, 11 may beneficially include the direction of insertion of all associated features arranged in a parallel direction such that assembly of each of the blocks 9, 10, 11 to one another can occur in a common direction and can occur substantially simultaneously. Specifically, the openings formed through the block connection structures 30, the interlockers 12, and the tightening means 13 may all extend axially in parallel to each other at each joint present between adjacent ones of the blocks 9, 10, 11.
[0039]In some embodiments, a particular configuration of the RDM 1 and associated refrigerant circuit may result in certain connections structures 20, 30 not being in use or not needing to convey a fluid therethrough. In such circumstances, a plug (not shown) having suitable structure for plugging such structures 20, 30 may be utilized.
[0040]Any of the blocks 9, 10, 11 may include one or more sensors 6, such as pressure and/or temperature sensors (PT sensors) 6, and may further include one or more fluid control valves 8, which may be adjustable electric refrigerant expansion valves 8. Each of the sensors 6 and each of the fluid control valves 8 may be associated with a corresponding electric component connection structure 40, which may include structure for coupling a corresponding sensor 6 or valve 8 to extend across a desired flow path formed through one of the blocks 9, 10, 11 of the manifold assembly 2 to allow for the corresponding operation thereof, as desired.
[0041]Any combination of the blocks 9, 10, 11 may include any of the aforementioned connection means for connecting the manifold assembly 2, and in turn the RDM 1, to the corresponding vehicle. That is, the means for connecting the manifold assembly 2 to the vehicle may not include structure formed on each and all of the blocks 9, 10, 11 for connection directly to the vehicle due to the connections formed between the adjacent blocks 9, 10, 11 being rigid and robust enough to support the remaining blocks 9, 10, 11 absent the direct coupling of each of the blocks 9, 10, 11 to the vehicle independently, as desired.
[0042]As can be seen in
[0043]Each of the blocks 9, 10, 11 includes internal flow paths formed therethrough that extend between adjacent combinations of the block connection structures 30 and/or the fluid component connection structures 20 for forming portions of the refrigerant circuit of the RDM 1, wherein one representative example of a flow configuration of the manifold assembly 2 associated with such internal flow paths is disclosed with reference to
[0044]The HPB 9 is configured for reception of relatively high pressure and high temperature refrigerant after having been compressed in the compressor (not shown) of the associated refrigerant circuit. The HPB 9 may accordingly be associated with a condenser 3 of the refrigerant circuit disposed downstream of a discharge end of the compressor. As depicted in
[0045]The CB 10 may be configured for distributing and/or receiving the refrigerant from certain components of the refrigerant circuit associated with improving the efficiency thereof via additional heating and/or cooling of the refrigerant at certain points along the refrigerant circuit. Such processes may relate to the use of vapor injection and/or hot gas bypass (HGB). In the present embodiment, the CB 10 is associated with connection to a refrigerant-to-refrigerant heat exchanger 5 that operates as an economizer of the refrigerant circuit. In the present context, an economizer refers to a heat exchanger that may be utilized with certain scroll compressor configurations, wherein the economizer is configured for exchanging heat between returned vapor injection refrigerant (after passage through the condenser 3 and expansion within an associated expansion element) and refrigerant flowing along the refrigerant circuit downstream of the condenser 3 and downstream of the branching of the vapor injection return pathway back towards the scroll compressor. In other embodiments, the heat exchanger 5 of the CB 10 may be what is sometimes referred to as an inner or internal heat exchanger of the refrigerant circuit where refrigerant downstream of the condenser 3 and upstream of an associated expansion element exchanges heat with refrigerant downstream of the associated evaporator 4 and upstream of the suction port of the compressor, whereby the structure and flow configuration through the blocks 9, 10, 11 may require slight modifications from those shown and described with respect to the presently disclosed embodiment when utilizing such an inner or internal heat exchanger.
[0046]The LPB 11 may be associated with the evaporator 4 (alternatively referred to as a chiller 4) of the refrigerant circuit and may further include an integrated expansion valve and/or connecting structure for attachment of such an expansion valve, as discussed in greater detail in describing the flow configuration of the manifold assembly 2 as illustrated in
[0047]The configuration of the blocks 9, 10, 11 provides a benefit in that the placement of the CB 10 between the HPB 9 and the LPB 11 creates a thermal isolation of the relatively high temperature/pressure refrigerant and the relatively low temperature/pressure refrigerant of the refrigerant circuit, thereby improving refrigerant circuit efficiency via a reduction in undesired heat exchange between the oppositely arranged blocks 9, 11. That is, the presence of the intermediate control block 10 ensures that any heat transfer occurring through the blocks 9, 10, 11 themselves does not include a direct heat transfer pathway between different flows of the refrigerant that have a maximized temperature difference present therebetween in a manner negatively impacting expected operation of the RDM 1.
[0048]Referring now to
[0049]A flow R1 corresponds to the flow of hot gaseous refrigerant exiting the compressor (not shown) of the corresponding refrigerant circuit and entering the manifold assembly 2 via one of the fluid component connection structures 20 of the CB 10 disposed at one lateral side thereof. The refrigerant entering the CB 10 then flows from the CB 10 to the HPB 9 by way of flow R2 through a pair of coupled block connection structures 30, wherein flow R1 turns 90 degrees to become flow R2 via a corresponding 90 degree bend formed in an internal flow path of the CB 10. The refrigerant of flow R2 is routed (upwardly) through an internal flow path of the HPB 9 and is turned 90 degrees to exit the HPB 9 as a flow R3, which occurs via a corresponding fluid component connection structure 20. The flow R3 is configured to enter the condenser 3 (see
[0050]The flow R4 flows across the thickness (depth direction) of the HPB 9 for entry into the reservoir 7 (see
[0051]The flow R8 enters the CB 10 and turns 90 degrees to exit the CB 10 towards the refrigerant-to-refrigerant heat exchanger (economizer) 5 through a corresponding connection structure 20 as flow R9. The internal flow path connecting the flow R9 to the flow R10 may include one of the fluid control valves 8 disposed therealong, which may be an adjustable expansion element for controlling a pressure of the refrigerant therethrough in advance of being utilized in a vapor injection process and in advance of exchanging heat with refrigerant corresponding to the flow R12 branching from flow R7. The position of the fluid control valve 8 along the identified internal flow path can be seen by the position of the electric component connection structure 40 identified as reference character 40a in
[0052]After flowing through the economizer 5, the refrigerant originating as flow R9 returns to the CB 10 via flow R10, which is diagonally arranged relative to the flow R9 via the positions of the corresponding connections structures 20. The flow R10 transitions to a flow R11 while turning 180 degrees within an internal flow path of the CB 10. The flow R11 exits the CB 10 via a corresponding connection structure 20 and flows back towards the compressor of the refrigerant circuit for entry into a vapor injection port of the compressor, thereby utilizing a vapor injection feature of the compressor.
[0053]The flow R12 turns (downwardly) within a hidden portion of the otherwise exposed internal flow path of the HPB 9 and then becomes flow R13 when flowing from the HPB 9 to the CB 10 via paired connection blocks 30. The flow R13 bends 90 degrees within an internal flow path of the CB 10 to flow out of the CB 10 towards the refrigerant-to-refrigerant heat exchanger (economizer) 5. The economizer 5 includes heat exchange (and not fluid mixing) between the flow R9 of the refrigerant flowing back to the compressor for vapor injection and the flow R14 corresponding to flow along the primary loop of the refrigerant circuit downstream of the condenser 3, wherein the flows R9 and R14 are fluidly isolated from one another within the economizer 5. The refrigerant entering the economizer 5 as flow R14 flows diagonally therethrough in a counter-cross flow configuration relative to the vapor injection refrigerant of flow R9 and then reenters the CB 10 as flow R15, which occurs via a corresponding fluid component connection structure 20. The flow R15 bends 90 degrees downwardly within an internal flow path of the CB 10 to then flow to the LPB 11 as a flow R16.
[0054]
[0055]The flow R19 turns 90 degrees within an internal flow path and then flows from the LPB 11 back to the CB 10 via a paired connection of structures 30 as flow R20. Flow R20 then turns 90 degrees within an internal flow path to exit the CB 10, and the manifold assembly 2 more broadly, via a fluid component connection structure 20 to flow towards the suction port (inlet end) of the compressor of the refrigerant circuit as flow R21. The refrigerant exiting the compressor then returns to the manifold assembly as flow R1 to repeat the cycle.
[0056]The manifold assembly 2 of the present invention also includes a suction-pressure injection feature wherein high pressure refrigerant exiting the compressor and returning to the manifold assembly 2 as flow R1 may be diverted back towards the suction port of the compressor as flow R21 when it is necessary to increase the suction pressure of the compressor to a desired value to promote efficiency of operation of the compressor. This occurs via an internal flow path of the CB 10 that extends therethrough from the connection structure 20 associated with flow R1 to the connection structure 20 associated with R21, wherein this internal flow path is shown as conveying a flow R22 of the refrigerant therethrough in each of
[0057]Referring now to
[0058]The bores 80 may also be introduced into the manifold assembly 2 in combination to form the described 90 degree bends in each of the internal flow paths described hereinabove. For example, the block connection structure 30 labeled in
[0059]The formation of the manifold assembly 2 to generally include the fluid component connection structures 20 disposed along a common plane (extending in the width and length directions of the manifold assembly 2 as depicted in
[0060]The formation of the blocks 9, 10, 11 independently of each other provides the benefit of improving the dimensional accuracy of the placement of each of the associated features in need of potential alignment, such as the disclosed connection structures 20, 30, 40 that may beneficially be perfectly aligned with any mating structures for secure assembly of the RDM 1. This may occur via an increase in accuracy associated with forming relatively smaller components via the associated processes discussed herein. Additionally, the use of smaller components may allow for different manufacturing processes to be utilized in comparison to those typical of the prior art, such as the use of gravity casting, HPDC, or sintering, as non-limiting examples.
[0061]Referring now to
[0062]From the foregoing description, one ordinarily skilled in the art can easily ascertain the essential characteristics of this invention and, without departing from the spirit and scope thereof, can make various changes and modifications to the invention to adapt it to various usages and conditions.
Claims
What is claimed is:
1. A manifold assembly conveying a refrigerant therethrough, the manifold assembly comprising:
a high pressure block configured to be fluidly and mechanically coupled to a condenser of a refrigerant circuit;
a low pressure block configured to be fluidly and mechanically coupled to an evaporator of the refrigerant circuit; and
a control block disposed between the high pressure block and the low pressure block and configured to be fluidly and mechanically coupled to each of the high pressure block and the low pressure block.
2. The manifold assembly of
3. The manifold assembly of
4. The manifold assembly of
5. The manifold assembly of
6. The manifold assembly of
7. The manifold assembly of
8. The manifold assembly of
9. The manifold assembly of
10. The manifold assembly of
11. The manifold assembly of
12. The manifold assembly of
13. The manifold assembly of
14. The manifold assembly of
a second one of the fluid component connection structures, or
a block connection structure associated with fluidly and mechanically coupling the control block to a corresponding one of the high pressure block or the low pressure block.
15. The manifold assembly of
16. The manifold assembly of
17. The manifold assembly of
18. The manifold assembly of
19. The manifold assembly of
20. The manifold assembly of