METHOD FOR MANUFACTURING CASING STRUCTURE

CROSS-REFERENCE TO RELATED APPLICATION

[0001]This application claims the priority benefit of China application serial no. 202411812995.1, filed on Dec. 10, 2024. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND

Technical Field

[0002]The disclosure relates to a casing structure, and in particular to a method for manufacturing a casing structure.

Description of Related Art

[0003]To meet the requirements such as light transmission, light reception, heat dissipation, sound transmission, or sound reception, the casings of smartphones, tablet computers, or notebook computers are commonly provided with perforations or microperforations. However, due to the conventional casing manufacturing process, perforations or microperforations may become clogged during the surface treatment steps such as polishing or sandblasting, thereby affecting the product yield.

SUMMARY

[0004]The disclosure provides a method for manufacturing a casing structure that helps enhance product yield.

[0005]According to an embodiment of the disclosure, a method for manufacturing a casing structure is provided, including the following steps: firstly, providing a casing substrate; then, forming perforations in the casing substrate; next, coating the casing substrate with an alkaline wax and filling the perforations; then, performing surface treatment on the casing substrate; next, performing acid pickling on the casing substrate to remove the alkaline wax; and finally, performing anodizing treatment on the casing substrate.

[0006]According to another embodiment of the disclosure, a method for manufacturing a casing structure is provided, including the following steps: firstly, providing a casing substrate; then, forming perforations in a functional area of the casing substrate; next, coating the functional area of the casing substrate with an alkaline wax and filling the perforations; then, performing surface treatment on the casing substrate; next, performing acid pickling on the casing substrate to remove the alkaline wax; and finally, performing anodizing treatment on the casing substrate.

[0007]Based on the foregoing, the method for manufacturing the casing structure provided in the disclosure may avoid clogging of the perforations, significantly enhancing the product yield.

[0008]To make the aforementioned more comprehensible, several embodiments accompanied with drawings are described in detail as follows.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009]The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.

[0010]FIG. 1A to FIG. 1E are partial cross-sectional schematic diagrams illustrating a manufacturing process of a casing structure according to an embodiment of the disclosure.

[0011]FIG. 2A to FIG. 2C are partial bottom-view schematic diagrams respectively corresponding to FIG. 1B to FIG. 1D.

DESCRIPTION OF THE EMBODIMENTS

[0012]FIG. 1A to FIG. 1E are partial cross-sectional schematic diagrams illustrating a manufacturing process of a casing structure according to an embodiment of the disclosure. FIG. 2A to FIG. 2C are partial bottom-view schematic diagrams respectively corresponding to FIG. 1B to FIG. 1D. Please first refer to FIG. 1A, FIG. 1B, and FIG. 2A, a casing substrate 100 is provided. The casing substrate 100 may be made of metal or alloy, and has a first surface 101, a second surface 102 opposite to the first surface 101, and a functional area 1001 located at the first surface 101. Next, a plurality of perforations 103 are formed in the functional area 1001 through laser drilling. Each of the perforations 103 penetrates from the first surface 101 to the second surface 102, and may be microperforation with an aperture ranging from 0.06 mm to 0.12 mm. In subsequent applications, each of the perforations 103 may be used as a light transmission path, a sound transmission path, or a heat dissipation path.

[0013]Next, please refer to FIG. 1C, FIG. 2A and FIG. 2B, an alkaline wax 200 is coated onto the first surface 101 of the casing substrate 100, and the alkaline wax 200 also fills each of the perforations 103. Specifically, the alkaline wax 200 is coated in the functional area 1001 and covers the first surface 101. On the other hand, the purpose of filling each of the perforations 103 is to maintain sealing properties to prevent particles or other impurities generated in subsequent process steps from entering each of the perforations 103.

[0014]Next, please refer to FIG. 1C, FIG. 1D and FIG. 2C, a surface treatment is performed on the casing substrate 100, such as removing roughness, unevenness, or other defects on the first surface 101 and the second surface 102 by grinding and sandblasting. Since each of the perforations 103 is filled with the alkaline wax 200, particles or other impurities generated during the grinding and sandblasting process of the casing substrate 100 are prevented from entering each of the perforations 103. Additionally, at least part or all of the alkaline wax 200 covering the first surface 101 is removed during the grinding and sandblasting process, but each of the perforations 103 is still filled with the alkaline wax 200. That is to say, during the grinding and sandblasting process, only part or all of the alkaline wax 200 located outside each of the perforations 103 is removed.

[0015]Next, please refer to FIG. 1D and FIG. 1E, an acid pickling is performed on the casing substrate 100 to remove particles or other impurities on the first surface 101 and the second surface 102 using an acidic cleaning agent, while completely removing the alkaline wax 200 remaining on the first surface 101 and filled in each of the perforations 103.

[0016]By sealing each of the perforations 103 before performing steps such as grinding and sandblasting, particles or other impurities generated during the grinding and sandblasting process are prevented from clogging the perforations 103, thereby enhancing product yield. For example, the functional area 1001 may include a light emitting area, a light receiving area, a heat dissipating area, a sound transmitting area, or a sound receiving area. In the absence of blockage in the perforations 103, the performance of the functional area 1001 can be significantly enhanced, such as by strengthening and optimizing light efficiency, enhancing light reception capability, enhancing heat dissipation performance, enhancing sound performance, or enhancing sound reception effect.

[0017]Finally, an anodizing process is performed on the casing substrate 100 to form an oxide film on the the first surface 101, the second surface 102, and the inner walls of each of the perforations 103, thereby enhancing the corrosion resistance, wear resistance, and appearance and texture of the resulting casing structure 10.

[0018]In summary of the foregoing, the method for manufacturing the casing structure provided in the disclosure may avoid clogging of the perforations, significantly enhancing the product yield. Furthermore, the functional area may include a light emitting area, a light receiving area, a heat dissipating area, a sound transmitting area, or a sound receiving area. In the absence of blockage in the perforations, the performance of the functional area can be significantly enhanced, such as by strengthening and optimizing light efficiency, enhancing light reception capability, enhancing heat dissipation performance, enhancing sound performance, or enhancing sound reception effect.

[0019]It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure covers modifications and variations provided that they fall within the scope of the following claims and their equivalents.