ELECTROCHEMICAL MACHINING ON WORKPIECE SELECTIVE AREA

BACKGROUND

[0001] The present disclosure generally relates to electrochemical machining. More specifically, the present disclosure relates to electrochemical machining (ECM) on a selective area of a workpiece.

[0002] ECM is an advanced non-contact, non-thermal material removal process that is capable of forming small features along with high quality surfaces while being highly repeatable for manufacturing of production parts. Pulsed ECM (PECM), which is sometimes called precision ECM, is a newer and sometimes more precise variant of ECM. PECM is generally similar to ECM but utilizes a pulsed power supply.

SUMMARY

[0003] According to an aspect of the disclosure, a system for executing electrochemical machining (ECM) on a workpiece is provided. The system includes a tank to contain an electrolyte, a robotic modular chamber, which is disposable and movable on the workpiece for the executing of the ECM on a location of the workpiece using the electrolyte from the tank, an electrolyte circulation system to continuously provide the electrolyte from the tank and to the robotic modular chamber and circuitry to apply a voltage bias to the robotic modular chamber and the workpiece to enable the executing of the ECM.

[0004] According to an aspect of the disclosure, a system for executing electrochemical machining (ECM) on a workpiece is provided. The system includes a tank to contain an electrolyte, robotic modular chambers, which are each disposable and movable on the workpiece for the executing of the ECM on locations of the workpiece using the electrolyte from the tank, an electrolyte circulation system to continuously provide the electrolyte from the tank and to each of the robotic modular chambers and circuitry to apply a voltage bias to each of the robotic modular chambers and the workpiece to enable the executing of the ECM.

[0005] According to an aspect of the disclosure, a method of executing electrochemical machining (ECM) on a workpiece is provided. The method includes determining a size and dimensions of the workpiece including locations where ECM is to be executed, connecting robotic modular chambers to electrolyte contained in a tank and to circuitry, disposing the robotic modular chambers on the workpiece, moving the robotic modular chambers on the workpiece to the locations in accordance with the size and dimensions of the workpiece and the locations where the ECM is to be executed and executing the ECM. The executing of the ECM includes providing the electrolyte to robotic modular chambers at the locations and applying a voltage bias to the robotic modular chambers at the locations.

[0006] Additional technical features and benefits are realized through the techniques of the present disclosure. Embodiments and aspects of the disclosure are described in detail herein and are considered a part of the claimed subject matter. For a better understanding, refer to the detailed description and to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The specifics of the exclusive rights described herein are particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other features and advantages of the embodiments of the disclosure are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:

[0008]FIG. 1 is a schematic diagram of a computing environment executing electrochemical machining (ECM) on a workpiece in accordance with one or more embodiments of the present invention;

[0009]FIG. 2 is a perspective view of a system for executing electrochemical machining (ECM) in accordance with one or more embodiments;

[0010]FIGS. 3A and 3B are side views of robotic modular chambers of the system of FIG. 2 in first and second positions, respectively, in accordance with one or more embodiments;

[0011]FIG. 4 is an axial view of a robotic modular chamber including multiple seals in accordance with one or more embodiments;

[0012]FIG. 5 is a perspective view illustrating movement elements of autonomously movable robotic modular chambers in accordance with one or more embodiments;

[0013]FIG. 6 is a perspective view illustrating an external robotic element capable of moving robotic modular chambers in accordance with one or more embodiments; and

[0014]FIG. 7 is a schematic diagram illustrating a system for executing electrochemical machining (ECM) on a workpiece in accordance with one or more embodiments; and

[0015]FIG. 8 is a flow diagram illustrating a method of executing electrochemical machining (ECM) on a workpiece in accordance with one or more embodiments.

[0016] The diagrams depicted herein are illustrative. There can be many variations to the diagram or the operations described therein without departing from the spirit of the disclosure. For instance, the actions can be performed in a differing order or actions can be added, deleted or modified. Also, the term “coupled” and variations thereof describes having a communications path between two elements and does not imply a direct connection between the elements with no intervening elements/connections between them. All of these variations are considered a part of the specification.

[0017] In the accompanying figures and following detailed description of the described embodiments, the various elements illustrated in the figures are provided with two or three digit reference numbers. With minor exceptions, the leftmost digit(s) of each reference number correspond to the figure in which its element is first illustrated.

DETAILED DESCRIPTION

[0018] Various aspects of the present disclosure are described by narrative text, flowcharts, block diagrams of computer systems and/or block diagrams of the machine logic included in computer program product (CPP) embodiments. With respect to any flowcharts, depending upon the technology involved, the operations can be performed in a different order than what is shown in a given flowchart. For example, again depending upon the technology involved, two operations shown in successive flowchart blocks may be performed in reverse order, as a single integrated step, concurrently, or in a manner at least partially overlapping in time.

[0019] A computer program product embodiment ("CPP embodiment" or “CPP”) is a term used in the present disclosure to describe any set of one, or more, storage media (also called "mediums") collectively included in a set of one, or more, storage devices that collectively include machine readable code corresponding to instructions and/or data for performing computer operations specified in a given CPP claim. A "storage device" is any tangible device that can retain and store instructions for use by a computer processor. Without limitation, the computer readable storage medium may be an electronic storage medium, a magnetic storage medium, an optical storage medium, an electromagnetic storage medium, a semiconductor storage medium, a mechanical storage medium, or any suitable combination of the foregoing. Some known types of storage devices that include these mediums include: diskette, hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or Flash memory), static random access memory (SRAM), compact disc read-only memory (CD-ROM), digital versatile disk (DVD), memory stick, floppy disk, mechanically encoded device (such as punch cards or pits / lands formed in a major surface of a disc) or any suitable combination of the foregoing. A computer readable storage medium, as that term is used in the present disclosure, is not to be construed as storage in the form of transitory signals per se, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide, light pulses passing through a fiber optic cable, electrical signals communicated through a wire, and/or other transmission media. As will be understood by those of skill in the art, data is typically moved at some occasional points in time during normal operations of a storage device, such as during access, de-fragmentation or garbage collection, but this does not render the storage device as transitory because the data is not transitory while it is stored.

[0020]With reference to FIG. 1, a computer or computing device 100 that implements a computer-implemented method for executing ECM on a workpiece is provided in accordance with one or more embodiments of the present invention is provided. The computer or computing device 100 of FIG. 1 contains an example of an environment for the execution of at least some of the computer code involved in performing the inventive methods, such as the block 1001 of the computer-implemented method for executing ECM on a workpiece. In addition to the computer-implemented method for executing ECM on a workpiece of block 1001, the computer or computing device 100 includes, for example, computer 101, wide area network (WAN) 102, end user device (EUD) 103, remote server 104, public cloud 105, and private cloud 106. In this embodiment, computer 101 includes processor set 110 (including processing circuitry 120 and cache 121), communication fabric 111, volatile memory 112, persistent storage 113 (including operating system 122 and the computer-implemented method of block 1001, as identified above), peripheral device set 114 (including user interface (UI) device set 123, storage 124, and Internet of Things (IoT) sensor set 125), and network module 115. Remote server 104 includes remote database 130. Public cloud 105 includes gateway 140, cloud orchestration module 141, host physical machine set 142, virtual machine set 143, and container set 144.

[0021] The computer 101 may take the form of a desktop computer, laptop computer, tablet computer, smart phone, smart watch or other wearable computer, mainframe computer, quantum computer or any other form of computer or mobile device now known or to be developed in the future that is capable of running a program, accessing a network or querying a database, such as remote database 130. As is well understood in the art of computer technology, and depending upon the technology, performance of a computer-implemented method may be distributed among multiple computers and/or between multiple locations. On the other hand, in this presentation of the computer-implemented method, detailed discussion is focused on a single computer, specifically computer 101, to keep the presentation as simple as possible. Computer 101 may be located in a cloud, even though it is not shown in a cloud in FIG. 1. On the other hand, computer 101 is not required to be in a cloud except to any extent as may be affirmatively indicated.

[0022]The processor set 110 includes one, or more, computer processors of any type now known or to be developed in the future. Processing circuitry 120 may be distributed over multiple packages, for example, multiple, coordinated integrated circuit chips. Processing circuitry 120 may implement multiple processor threads and/or multiple processor cores. Cache 121 is memory that is located in the processor chip package(s) and is typically used for data or code that should be available for rapid access by the threads or cores running on processor set 110. Cache memories are typically organized into multiple levels depending upon relative proximity to the processing circuitry. Alternatively, some, or all, of the cache for the processor set may be located “off chip.” In some computing environments, processor set 110 may be designed for working with qubits and performing quantum computing.

[0023]Computer readable program instructions are typically loaded onto computer 101 to cause a series of operational steps to be performed by processor set 110 of computer 101 and thereby effect a computer-implemented method, such that the instructions thus executed will instantiate the methods specified in flowcharts and/or narrative descriptions of computer-implemented methods included in this document (collectively referred to as “the inventive methods”). These computer readable program instructions are stored in various types of computer readable storage media, such as cache 121 and the other storage media discussed below. The program instructions, and associated data, are accessed by processor set 110 to control and direct performance of the inventive methods. In the computer-implemented method, at least some of the instructions for performing the inventive methods may be stored in the block 1001 of the computer-implemented method in persistent storage 113.

[0024] Communication fabric 111 is the signal conduction path that allows the various components of computer 101 to communicate with each other. Typically, this fabric is made of switches and electrically conductive paths, such as the switches and electrically conductive paths that make up busses, bridges, physical input / output ports and the like. Other types of signal communication paths may be used, such as fiber optic communication paths and/or wireless communication paths.

[0025]Volatile memory 112 is any type of volatile memory now known or to be developed in the future. Examples include dynamic type random access memory (RAM) or static type RAM. Typically, volatile memory 112 is characterized by random access, but this is not required unless affirmatively indicated. In computer 101, the volatile memory 112 is located in a single package and is internal to computer 101, but, alternatively or additionally, the volatile memory may be distributed over multiple packages and/or located externally with respect to computer 101.

[0026]Persistent storage 113 is any form of non-volatile storage for computers that is now known or to be developed in the future. The non-volatility of this storage means that the stored data is maintained regardless of whether power is being supplied to computer 101 and/or directly to persistent storage 113. Persistent storage 113 may be a read only memory (ROM), but typically at least a portion of the persistent storage allows writing of data, deletion of data and re-writing of data. Some familiar forms of persistent storage include magnetic disks and solid state storage devices. Operating system 122 may take several forms, such as various known proprietary operating systems or open source Portable Operating System Interface-type operating systems that employ a kernel. The code included in the block 1001 of the computer-implemented method typically includes at least some of the computer code involved in performing the inventive methods.

[0027]Peripheral device set 114 includes the set of peripheral devices of computer 101. Data communication connections between the peripheral devices and the other components of computer 101 may be implemented in various ways, such as Bluetooth connections, Near-Field Communication (NFC) connections, connections made by cables (such as universal serial bus (USB) type cables), insertion-type connections (for example, secure digital (SD) card), connections made through local area communication networks and even connections made through wide area networks such as the internet. In various embodiments, UI device set 123 may include components such as a display screen, speaker, microphone, wearable devices (such as goggles and smart watches), keyboard, mouse, printer, touchpad, game controllers, and haptic devices. Storage 124 is external storage, such as an external hard drive, or insertable storage, such as an SD card. Storage 124 may be persistent and/or volatile. In some embodiments, storage 124 may take the form of a quantum computing storage device for storing data in the form of qubits. In embodiments where computer 101 is required to have a large amount of storage (for example, where computer 101 locally stores and manages a large database) then this storage may be provided by peripheral storage devices designed for storing very large amounts of data, such as a storage area network (SAN) that is shared by multiple, geographically distributed computers. IoT sensor set 125 is made up of sensors that can be used in Internet of Things applications. For example, one sensor may be a thermometer and another sensor may be a motion detector.

[0028]Network module 115 is the collection of computer software, hardware, and firmware that allows computer 101 to communicate with other computers through WAN 102. Network module 115 may include hardware, such as modems or Wi-Fi signal transceivers, software for packetizing and/or de-packetizing data for communication network transmission, and/or web browser software for communicating data over the internet. In some embodiments, network control functions and network forwarding functions of network module 115 are performed on the same physical hardware device. In other embodiments (for example, embodiments that utilize software-defined networking (SDN)), the control functions and the forwarding functions of network module 115 are performed on physically separate devices, such that the control functions manage several different network hardware devices. Computer readable program instructions for performing the inventive methods can typically be downloaded to computer 101 from an external computer or external storage device through a network adapter card or network interface included in network module 115.

[0029] WAN 102 is any wide area network (for example, the internet) capable of communicating computer data over non-local distances by any technology for communicating computer data, now known or to be developed in the future. In some embodiments, the WAN 102 may be replaced and/or supplemented by local area networks (LANs) designed to communicate data between devices located in a local area, such as a Wi-Fi network. The WAN and/or LANs typically include computer hardware such as copper transmission cables, optical transmission fibers, wireless transmission, routers, firewalls, switches, gateway computers and edge servers.

[0030]End user device (EUD) 103 is any computer system that is used and controlled by an end user (for example, a customer of an enterprise that operates computer 101), and may take any of the forms discussed above in connection with computer 101. EUD 103 typically receives helpful and useful data from the operations of computer 101. For example, in a hypothetical case where computer 101 is designed to provide a recommendation to an end user, this recommendation would typically be communicated from network module 115 of computer 101 through WAN 102 to EUD 103. In this way, EUD 103 can display, or otherwise present, the recommendation to an end user. In some embodiments, EUD 103 may be a client device, such as thin client, heavy client, mainframe computer, desktop computer and so on.

[0031]Remote server 104 is any computer system that serves at least some data and/or functionality to computer 101. Remote server 104 may be controlled and used by the same entity that operates computer 101. Remote server 104 represents the machine(s) that collect and store helpful and useful data for use by other computers, such as computer 101. For example, in a hypothetical case where computer 101 is designed and programmed to provide a recommendation based on historical data, then this historical data may be provided to computer 101 from remote database 130 of remote server 104.

[0032]Public cloud 105 is any computer system available for use by multiple entities that provides on-demand availability of computer system resources and/or other computer capabilities, especially data storage (cloud storage) and computing power, without direct active management by the user. Cloud computing typically leverages sharing of resources to achieve coherence and economies of scale. The direct and active management of the computing resources of public cloud 105 is performed by the computer hardware and/or software of cloud orchestration module 141. The computing resources provided by public cloud 105 are typically implemented by virtual computing environments that run on various computers making up the computers of host physical machine set 142, which is the universe of physical computers in and/or available to public cloud 105. The virtual computing environments (VCEs) typically take the form of virtual machines from virtual machine set 143 and/or containers from container set 144. It is understood that these VCEs may be stored as images and may be transferred among and between the various physical machine hosts, either as images or after instantiation of the VCE. Cloud orchestration module 141 manages the transfer and storage of images, deploys new instantiations of VCEs and manages active instantiations of VCE deployments. Gateway 140 is the collection of computer software, hardware, and firmware that allows public cloud 105 to communicate through WAN 102.

[0033] Some further explanation of virtualized computing environments (VCEs) will now be provided. VCEs can be stored as “images.” A new active instance of the VCE can be instantiated from the image. Two familiar types of VCEs are virtual machines and containers. A container is a VCE that uses operating-system-level virtualization. This refers to an operating system feature in which the kernel allows the existence of multiple isolated user-space instances, called containers. These isolated user-space instances typically behave as real computers from the point of view of programs running in them. A computer program running on an ordinary operating system can utilize all resources of that computer, such as connected devices, files and folders, network shares, CPU power, and quantifiable hardware capabilities. However, programs running inside a container can only use the contents of the container and devices assigned to the container, a feature which is known as containerization.

[0034] Private cloud 106 is similar to public cloud 105, except that the computing resources are only available for use by a single enterprise. While private cloud 106 is depicted as being in communication with WAN 102, in other embodiments a private cloud may be disconnected from the internet entirely and only accessible through a local/private network. A hybrid cloud is a composition of multiple clouds of different types (for example, private, community or public cloud types), often respectively implemented by different vendors. Each of the multiple clouds remains a separate and discrete entity, but the larger hybrid cloud architecture is bound together by standardized or proprietary technology that enables orchestration, management, and/or data/application portability between the multiple constituent clouds. In this embodiment, public cloud 105 and private cloud 106 are both part of a larger hybrid cloud

[0035] For the sake of brevity, conventional fabrication techniques may or may not be described in detail herein. Moreover, the various tasks and process steps described herein can be incorporated into a more comprehensive procedure or process having additional steps or functionality not described in detail herein. In particular, various steps in the manufacture of certain types of devices are well known and so, in the interest of brevity, many conventional steps will only be mentioned briefly herein or will be omitted entirely without providing the well-known process details.

[0036] Turning now to an overview of technologies that are more specifically relevant to aspects of the disclosure, PECM has some key terms. These include, but are not limited to, cathode, anode, electrolyte and gap. The cathode is a tool in the PECM process and is often designed and manufactured for each specific application. Typically, the cathode is an inverse of a desired shape to be machined. The anode is a part of the workpiece or the material that will be dissolved away. The anode can take on many forms including, but not limited to, wrought stock, a near net shape cast piece, a conventionally machined part, a 3D printed or additively manufactured part, etc. The electrolyte is the working fluid in the ECM/PECM process and is flushed between the cathode and the anode. The electrolyte is typically a salt-based solution that allows electrical current to flow between the cathode and anode and that flushes away by-products of the ECM/PECM process including metal hydroxides of dissolved metals. The gap, or the interelectrode gap (IEG), is the space maintained between the cathode and the anode during the machining process. In ECM/PECM, the gap is a major contributor to the performance of the process. The introduction of PECM has allowed for gap sizes on the order of 10 to 100 μm (0.0004 to 0.004") and ultimately the ability to resolve much smaller features in the final workpiece.

[0037] To carry out ECM/PECM on a large workpiece, it is often the case that a relatively large tank is required to immerse the workpiece. This, in turn, necessitates a higher volume of electrolyte and an even larger tank. Therefore, if selective ECM/PECM is to be performed on a large object, various preparation steps, a volume of electrolyte and multiple other factors may tend to increase ECM/PECM costs.

[0038] Hereinafter, for purposes of clarity and brevity, ECM/PECM will be generally referred to as “ECM.”

[0039] Turning now to an overview of the aspects of the disclosure, one or more embodiments of the disclosure address the above-described shortcomings of the prior art by providing a robotic-controlled modular concentric cylindrical chamber that facilitates precise ECM by autonomously moving and positioning on large machine parts, ensuring efficient material removal through airtight sealing and continuous electrolyte recycling. Historical data can be used to select optimal chamber dimensions and electrolyte volumes.

[0040] During a particular ECM process, the robotic-controlled modular concentric cylindrical chamber will be positioned (i.e., autonomously positioned) at selective locations on a large machine part based on dimensions thereof and based on where ECM is needed and will be securely fixed in place with airtight sealing at the target location, after which electrolyte will be applied to initiate ECM. The robotic-controlled modular concentric cylindrical chamber will be connected to an electrolyte circulation tank and will continuously recycle the electrolyte until the ECM is completed.

[0041]With reference to FIG. 2, a system 201 is provided for executing ECM on a workpiece 202, which may be, but is not required to be, relatively large in size and dimension. The system 201 includes a tank 210 to contain an electrolyte 211, robotic modular chambers 220, an electrolyte circulation system 240 and circuitry 260. The robotic modular chambers 220 are each disposable and movable on a surface 203 of the workpiece 202 for the executing of the ECM on locations of the workpiece 202 using the electrolyte 211 from the tank 210. The electrolyte circulation system 240 is configured to continuously provide the electrolyte 211 from the tank 210 and to each of the robotic modular chambers 220 as needed for ECM execution and completion. The circuitry 260 includes a voltage source 261 and is configured to apply a voltage bias to each of the robotic modular chambers 220 and the workpiece 202 to enable the executing of the ECM.

[0042] With continued reference to FIG. 2 and with additional reference to FIGS. 3A and 3B, FIG. 4 and FIGS. 5 and 6, each of the robotic modular chambers 220 can include a base portion 221 with multiple concentric seal layers 222 that are configured to form an airtight seal with the surface 203 of the workpiece 202 and can further include lower and upper concentric body sections 223 and 224. The lower concentric body section 223 is extendible upwardly from the base portion 221. The upper concentric body section 224 is disposed and arranged telescopically with the lower concentric body section 223 to assume and move between a first position and a second position. At the first position, as shown in FIG. 3A, the upper concentric body section 224 is disposed within the lower concentric body section 223. At the second position, as shown in FIG. 3B, the upper concentric body section 224 telescopes upwardly from the lower concentric body section 223.

[0043] As shown in FIG. 3B, the upper concentric body section 224, the lower concentric body section 223 and the base portion 221 can cooperatively form an electrolyte passage 225. This electrolyte passage 225 can be receptive of input/output lines 241 of the electrolyte circulation system 240.

[0044] As shown in FIG. 5, the robotic modular chambers 220 can each be autonomously movable along the surface 203 of the workpiece 202 and can each include, in the base portion 221, a movement element 501. The movement element 501 for each of the autonomously movable robotic modular chambers 220 can be operable to drive movement of the robotic modular chambers 220 along the surface 203 of the workpiece 202. The movement element 501 can include one or more wheels 510 and a controller that can be localized and/or distributed across the system 201 as a whole.

[0045]As shown in FIG. 6, the system 201 can further include one or more external robotic elements 601 to move each of the autonomously movable or non-autonomous robotic modular chambers 220. The external robotic elements 601 can be configured, for example, as pick-and-place machines 610 which can pick up a robotic modular chamber 220 and place that robotic modular chamber 220 on the surface 203 of the workpiece 202.

[0046]With reference back to FIGS. 2 and FIGS. 3A and 3B, the electrolyte circulation system 240 can include sets 242 of the input/output lines 241 shown in FIG. 3B that extend from the tank 210 to each robotic modular chamber 220. In addition, the system 201 and/or the electrolyte circulation system 240 in particular can include one or more pumps 243. In an exemplary case, as shown in FIG. 3B, each pump 243 can be disposed in a robotic modular chamber 220 to pump the electrolyte 211 along the input/output lines 241 so as to continuously recycle the electrolyte 211 between the tank 210 and each of the robotic modular chambers 220.

[0047]With reference to FIG. 7, the system 201 can include the various features described above as well as at least one or more of sensors 701 and feedback mechanisms 702 for monitoring at least movements of the robotic modular chambers 220 and for monitoring ECM processing toward completion for each of the robotic module chambers 220. In these or other cases, the above-mentioned controller can be provided as a distributed control system 710 that includes a processor 711, a memory unit 712 and an input/output (I/O) unit 713 by which the processor 711 is communicative with each of the robotic modular chambers 220 (and their local controllers), each of the one or more movement elements 501, each of the one or more external robotic elements 601, each of the one or more pumps 243, each of the sensors 701 and each of the feedback mechanisms 702. The memory unit 712 has executable instructions stored thereon, which are readable and executable by the processor 711. When they are read and executed by the processor 711, the executable instructions cause the processor 711 to operate as described herein.

[0048]The processor 711 can be receptive of a size and dimensions of the workpiece 202 including locations where the ECM is to be executed and can control each of the robotic modular chambers 220 accordingly. In an exemplary case, in which the robotic modular chambers 220 are autonomously movable, the processor 711 can issue a set of commands via the I/O unit 713 to one of the robotic modular chambers 220 to autonomously move to a certain location, to execute ECM at that location, to cease the ECM once the ECM is complete and to repeat that process for another location. In another exemplary case, in which the robotic modular chambers 220 are not autonomously movable or are not completely autonomously movable, the processor 711 can issue a first set of commands via the I/O unit 713 to an external robotic element 601 to pick-and-place one of the robotic modular chambers 220 at a certain location and a second set of commands to the robotic modular chamber 220 to execute ECM at that location and to cease the ECM once the ECM is complete. The processor 711 can then reissue the first and second sets of commands to repeat the process for another location. In each case, the processor 711 can monitor progress of the various features using the sensors 701 and the feedback mechanisms 702 and can make necessary adjustments where progress lags or differs from a target.

[0049]With reference to FIG. 8, a method 800 of executing ECM on a workpiece, such as the workpiece 202 described above, is provided. The method 800 includes determining a size and dimensions of the workpiece including locations where ECM is to be executed (block 801), connecting robotic modular chambers to electrolyte contained in a tank and to circuitry (block 802), disposing the robotic modular chambers on the workpiece (block 803), autonomously moving the modular chambers or having an external robotic element move the modular robotic chambers on the workpiece to the locations in accordance with the size and dimensions of the workpiece and the locations where the ECM is to be executed (block 804) and executing the ECM (block 805).

[0050] The moving of the modular chambers of block 804 can include sensing positions of the robotic modular chambers and adjusting the moving accordingly (block 8041). The executing of the ECM of block 805 can include forming an airtight seal between a surface of the workpiece and the robotic modular chambers at the locations (block 8051), expanding concentric cylindrical body sections of the robotic modular chambers at the locations to form electrolyte passages if those cylindrical body sections are not already expanded (block 8052), providing the electrolyte to robotic modular chambers at the locations by for example pumping the electrolyte into and through the electrolyte passages of each of the robotic modular chambers at the locations (block 8053) and applying a voltage bias to the robotic modular chambers at the locations (block 8054). In addition, the executing of the ECM of block 805 can further include monitoring ECM completion for each of the robotic modular chambers at the locations (block 8055), ceasing the executing of the ECM for each of the robotic modular chambers at the locations for which the ECM is completed (block 8056), moving the corresponding robotic modular chamber to a next location (block 8057) and restarting the executing of the ECM for the corresponding robotic modular chamber at the next location (block 8058).

[0051] Various embodiments of the present disclosure are described herein with reference to the related drawings. Alternative embodiments can be devised without departing from the scope of this disclosure. Although various connections and positional relationships (e.g., over, below, adjacent, etc.) are set forth between elements in the following description and in the drawings, persons skilled in the art will recognize that many of the positional relationships described herein are orientation-independent when the described functionality is maintained even though the orientation is changed. These connections and/or positional relationships, unless specified otherwise, can be direct or indirect, and the present disclosure is not intended to be limiting in this respect. Accordingly, a coupling of entities can refer to either a direct or an indirect coupling, and a positional relationship between entities can be a direct or indirect positional relationship. As an example of an indirect positional relationship, references in the present description to forming layer “A” over layer “B” include situations in which one or more intermediate layers (e.g., layer “C”) is between layer “A” and layer “B” as long as the relevant characteristics and functionalities of layer “A” and layer “B” are not substantially changed by the intermediate layer(s).

[0052] The following definitions and abbreviations are to be used for the interpretation of the claims and the specification. As used herein, the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having,” “contains” or “containing,” or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a composition, a mixture, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but can include other elements not expressly listed or inherent to such composition, mixture, process, method, article, or apparatus.

[0053] Additionally, the term “exemplary” is used herein to mean “serving as an example, instance or illustration.” Any embodiment or design described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments or designs. The terms “at least one” and “one or more” are understood to include any integer number greater than or equal to one, i.e. one, two, three, four, etc. The terms “a plurality” are understood to include any integer number greater than or equal to two, i.e. two, three, four, five, etc. The term “connection” can include an indirect “connection” and a direct “connection.”

[0054] References in the specification to “one embodiment,” “an embodiment,” “an example embodiment,” etc., indicate that the embodiment described can include a particular feature, structure, or characteristic, but every embodiment may or may not include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

[0055] For purposes of the description hereinafter, the terms “upper,” “lower,” “right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” and derivatives thereof shall relate to the described structures and methods, as oriented in the drawing figures. The terms “overlying,” “atop,” “on top,” “positioned on” or “positioned atop” mean that a first element, such as a first structure, is present on a second element, such as a second structure, wherein intervening elements such as an interface structure can be present between the first element and the second element. The term “direct contact” means that a first element, such as a first structure, and a second element, such as a second structure, are connected without any intermediary conducting, insulating or semiconductor layers at the interface of the two elements.

[0056] Spatially relative terms, e.g., “beneath,” “below,” “lower,” “above,” “upper,” and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the term “below” can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0057] The phrase “selective to,” such as, for example, “a first element selective to a second element,” means that the first element can be etched and the second element can act as an etch stop.

[0058] The terms “about,” “substantially,” “approximately,” and variations thereof, are intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application. For example, “about” can include a range of ± 8% or 5%, or 2% of a given value.

[0059] For the sake of brevity, conventional techniques related to semiconductor device and integrated circuit (IC) fabrication may or may not be described in detail herein. By way of background, however, a more general description of the semiconductor device fabrication processes that can be utilized in implementing one or more embodiments of the present disclosure will now be provided. Although specific fabrication operations used in implementing one or more embodiments of the present disclosure can be individually known, the described combination of operations and/or resulting structures of the present disclosure are unique. Thus, the unique combination of the operations described in connection with the fabrication of a semiconductor device according to the present disclosure utilize a variety of individually known physical and chemical processes performed on a semiconductor (e.g., silicon) substrate, some of which are described in the immediately following paragraphs.

[0060] In general, the various processes used to form a micro-chip that will be packaged into an IC fall into four general categories, namely, film deposition, removal/etching, semiconductor doping and patterning/lithography. Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer. Available technologies include physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others. Removal/etching is any process that removes material from the wafer. Examples include etch processes (either wet or dry), and chemical-mechanical planarization (CMP), and the like. Semiconductor doping is the modification of electrical properties by doping, for example, transistor sources and drains, generally by diffusion and/or by ion implantation. These doping processes are followed by furnace annealing or by rapid thermal annealing (RTA). Annealing serves to activate the implanted dopants. Films of both conductors (e.g., poly-silicon, aluminum, copper, etc.) and insulators (e.g., various forms of silicon dioxide, silicon nitride, etc.) are used to connect and isolate transistors and their components. Selective doping of various regions of the semiconductor substrate allows the conductivity of the substrate to be changed with the application of voltage. By creating structures of these various components, millions of transistors can be built and wired together to form the complex circuitry of a modern microelectronic device. Semiconductor lithography is the formation of three-dimensional relief images or patterns on the semiconductor substrate for subsequent transfer of the pattern to the substrate. In semiconductor lithography, the patterns are formed by a light sensitive polymer called a photo-resist. To build the complex structures that make up a transistor and the many wires that connect the millions of transistors of a circuit, lithography and etch pattern transfer steps are repeated multiple times. Each pattern being printed on the wafer is aligned to the previously formed patterns and slowly the conductors, insulators and selectively doped regions are built up to form the final device.

[0061] The flowchart and block diagrams in the Figures illustrate possible implementations of fabrication and/or operation methods according to various embodiments of the present disclosure. Various functions/operations of the method are represented in the flow diagram by blocks. In some alternative implementations, the functions noted in the blocks can occur out of the order noted in the Figures. For example, two blocks shown in succession can, in fact, be executed substantially concurrently, or the blocks can sometimes be executed in the reverse order, depending upon the functionality involved.

[0062] The descriptions of the various embodiments of the present disclosure have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments described. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments described herein.