USD1024062S1
Electronic module housing
Publication
Application
Classifications
IPC Classifications
CPC Classifications
Applicants
Aptiv Technologies AG
Inventors
Timothy Alan Suda, Tobias Merten
Abstract
Figures
Description
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[0008]The broken lines shown represent unclaimed subject matter and form no part of the claimed design. The portion of the article that is not illustrated in the Figures is not claimed. The relatively light and thin shade lines show contour and not surface decoration.
Claims
CLAIM
We claim the ornamental design for an electronic module housing, as shown and described.