USD1024062S1

Electronic module housing

Publication

Country:US
Doc Number:D1024062
Kind:S1
Date:2024-04-23

Application

Country:US
Doc Number:29796507
Date:2021-06-24

Classifications

IPC Classifications

CPC Classifications

Applicants

Aptiv Technologies AG

Inventors

Timothy Alan Suda, Tobias Merten

Abstract

Figures

Description

[0001]FIG. 1 is a front, right side perspective view of an electronic module housing showing the design;

[0002]FIG. 2 is a top plan view of the electronic module housing of FIG. 1;

[0003]FIG. 3 is a front elevation view of the electronic module housing of FIG. 1;

[0004]FIG. 4 is a bottom view of the electronic module housing of FIG. 1;

[0005]FIG. 5 is a rear elevation view of the electronic module housing of FIG. 1;

[0006]FIG. 6 is a left side elevation view of the electronic module housing of FIG. 1; and,

[0007]FIG. 7 is a right side elevation view of the electronic module housing of FIG. 1.

[0008]The broken lines shown represent unclaimed subject matter and form no part of the claimed design. The portion of the article that is not illustrated in the Figures is not claimed. The relatively light and thin shade lines show contour and not surface decoration.

Claims

CLAIM

We claim the ornamental design for an electronic module housing, as shown and described.