USD1069730S1

Contact wafer

Publication

Country:US
Doc Number:D1069730
Kind:S1
Date:2025-04-08

Application

Country:US
Doc Number:29725670
Date:2020-02-26

Classifications

IPC Classifications

CPC Classifications

Applicants

Samtec, Inc.

Inventors

Jonathan E. Buck, John A. Mongold

Abstract

Figures

Description

[0001]FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;

[0002]FIG. 2 is a top, back, and left side perspective view thereof;

[0003]FIG. 3 is a left side elevation view thereof;

[0004]FIG. 4 is a right side elevation view thereof;

[0005]FIG. 5 is a front elevation view thereof;

[0006]FIG. 6 is a back elevation view thereof;

[0007]FIG. 7 is a top plan view thereof; and,

[0008]FIG. 8 is a bottom plan view thereof.

[0009]The Dash-Dash broken lines in the drawing views are included to show portions of the contact wafer that form no part of the claimed design. The Dash-Dot broken lines in the drawing views are included to show claim boundaries that form no part of the claimed design.

Claims

CLAIM

The ornamental design for a contact wafer, as shown and described.