USD1069730S1
Contact wafer
Publication
Application
Classifications
IPC Classifications
CPC Classifications
Applicants
Samtec, Inc.
Inventors
Jonathan E. Buck, John A. Mongold
Abstract
Figures
Description
[0001]
[0002]
[0003]
[0004]
[0005]
[0006]
[0007]
[0008]
[0009]The Dash-Dash broken lines in the drawing views are included to show portions of the contact wafer that form no part of the claimed design. The Dash-Dot broken lines in the drawing views are included to show claim boundaries that form no part of the claimed design.
Claims
CLAIM
The ornamental design for a contact wafer, as shown and described.