Composite seal for semiconductor manufacturing device

[0001]1. Composite seal for semiconductor manufacturing device

[0002]1.1 : Perspective

[0003]1.2 : Top

[0004]1.3 : Front

[0005]1.4 : Cross section taken along line 1.4-1.4 in view 1.2

[0006]1.5 : Enlarged portion view taken from encircled portion labeled, “1.5,” in view 1.4

[0007]1.6 : Right

[0008]1.7 : Bottom

[0009]1.8 : Back

[0010]1.9 : Left

[0011]The dot-dashed lines show the boundary of the enlarged view of 1.5 in views 1.4 and 1.5 and form no part of the claimed design.