USD1130337S1

Heat dissipation module

Publication

Country:US
Doc Number:D1130337
Kind:S1
Date:2026-06-16

Application

Country:US
Doc Number:29958606
Date:2024-08-21

Classifications

IPC Classifications

CPC Classifications

Applicants

Acer Incorporated

Inventors

Wei-Yu Lai, Yi-Heng Lee

Abstract

Figures

Description

[0001]FIG. 1 is a perspective view of a heat dissipation module showing our new design;

[0002]FIG. 2 is another perspective view thereof;

[0003]FIG. 3 is a front view thereof;

[0004]FIG. 4 is a rear view thereof;

[0005]FIG. 5 is a left side view thereof;

[0006]FIG. 6 is a right side view thereof;

[0007]FIG. 7 is a top view thereof,

[0008]FIG. 8 is a bottom view thereof; and,

[0009]FIG. 9 is an enlarged view of the portion, labeled ‘9’ of FIG. 1.

[0010]The evenly-dashed broken lines illustrate portions of the heat dissipation module that form no part of the claimed design. The dot-dashed broken lines depict the limits of the enlarged views and form no part for the claimed design.

Claims

CLAIM

The ornamental design for a heat dissipation module as shown and described.