Inventors
Yoshinori Ogawa, Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi Kitagawa
Description
[0001]FIG. 1 is a perspective view of a first embodiment of a stamp component for transferring microstructure, showing our new design;
[0002]FIG. 2 is a front elevational view thereof, the rear, left-side, and right-side elevational views being identical;
[0003]FIG. 3 is a top plan view thereof;
[0004]FIG. 4 is a bottom plan view thereof;
[0005]FIG. 5 is an enlarged view of encircled portion labeled “5,” in FIG. 1;
[0006]FIG. 6 is an enlarged view of encircled portion labeled “6,” in FIG. 5;
[0007]FIG. 7 is an enlarged view of encircled portion labeled, “7,” in FIG. 2;
[0008]FIG. 8 is an enlarged view of encircled portion labeled “8,” in FIG. 7.
[0009]FIG. 9 is a perspective view of a second embodiment of a stamp component for transferring microstructure, showing our new design;
[0010]FIG. 10 is a front elevational view thereof, the rear elevation view being identical; ps FIG. 11 is a left-side elevational view thereof, the right-side elevational view being identical;
[0011]FIG. 12 is a top plan view thereof;
[0012]FIG. 13 is a bottom plan view thereof;
[0013]FIG. 14 is an enlarged view of encircled portion labeled “14,” in FIG. 9;
[0014]FIG. 15 is an enlarged view of encircled portion labeled “15,” in FIG. 14;
[0015]FIG. 16 is an enlarged view of encircled portion labeled “16,” in FIG. 10; and,
[0016]FIG. 17 is an enlarged view of encircled portion labeled “17,” in FIG. 16.
[0017]The evenly-spaced broken lines depict parts of the stamp component for transferring microstructure that form no part of the claimed design. The dot-dash lines depict the boundaries of the enlarged portion views of FIGS. 5-8 and 14-17 in FIGS. 1, 2, 5-10, and 14-17, and form no part of the claimed design.