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USD1134249S1 · App 29/877,896

Lid for a semiconductor package

Publication

Country:US
Doc Number:D1134249
Kind:S1
Date:2026-07-14

Application

Country:US
Doc Number:29/877,896 (29877896)
Date:2023-06-13

Classifications

IPC Classifications

CPC Classifications

Applicants

Artilux, Inc.

Inventors

Cheng-Te Yu, Chih-Wei Chen

Abstract

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Figures

Description

[0001]FIG. 1 is a bottom perspective view of a lid for a semiconductor package showing our new design;

[0002]FIG. 2 is another bottom perspective view thereof;

[0003]FIG. 3 is a top view thereof;

[0004]FIG. 4 is a bottom view thereof;

[0005]FIG. 5 is a right side view thereof;

[0006]FIG. 6 is a left side view thereof;

[0007]FIG. 7 is a front view thereof; and,

[0008]FIG. 8 is a rear view thereof.

[0009]Within the drawings, the broken lines show unclaimed portions of the lid for a semiconductor package, and thus form no part of the claimed design.

Claims

CLAIM

The ornamental design for a lid for a semiconductor package, as shown and described.