USD1134331S1 · App 35/524,417

CPU module

Publication

Country:US
Doc Number:D1134331
Kind:S1
Date:2026-07-14

Application

Country:US
Doc Number:35/524,417 (35524417)
Date:2024-03-21

Classifications

IPC Classifications

CPC Classifications

Applicants

Yokogawa Electric Corporation

Inventors

Kazuhira Urushizaki, Tatsuya Kurihara, Liang Ma, Keiichi Sasaki, Atsushi Tsuruta, Yoshiya Watanabe, Jumpei Okamoto

Abstract

Ask AI about this patent

Get a summary, plain-language explanation, or ask your own question.

Figures

Description

[0001]1.1 : Perspective

[0002]1.2 : Front

[0003]1.3 : Back

[0004]1.4 : Top

[0005]1.5 : Bottom

[0006]1.6 : Left

[0007]1.7 : Right

[0008]The broken lines do not form part of the claimed design; the present design is characterized by its flat front surface, while the top is beveled at an angle.

Claims

CLAIM

The ornamental design for a CPU module as shown and described.