USD1134345S1 · App 29/957,350
Electronic module housing
Publication
Application
Classifications
IPC Classifications
CPC Classifications
Applicants
Aptiv Technologies AG
Inventors
Timothy Alan Suda, Tobias Richter-Brockmann
Abstract
Get a summary, plain-language explanation, or ask your own question.
Figures
Description
[0001]
[0002]
[0003]The broken dashed lines depict environmental subject matter only and form no part of the claimed design.
[0004]The relatively light and thin shade lines show contour and not surface decoration.
[0005]The electronic module housing is shown with breaks in its width and depth. Any portion of the article between the break lines, including the break lines themselves, form no part of the claimed design.
[0006]The portion of the article that is not illustrated in the Figures is not claimed.
Claims
CLAIM
The ornamental design for an electronic module housing as shown and described.