USD914621S1
Packaged semiconductor module
Publication
Country:US
Doc Number:D0914621
Kind:S1
Date:2021-03-30
Application
Country:US
Doc Number:29707990
Date:2019-10-02
Classifications
IPC Classifications
CPC Classifications
Applicants
Rohm Co., Ltd.
Inventors
Makoto Hirata, Shingo Matsumaru, Satoru Nate
Abstract
Figures
Description
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Claims
CLAIM
The ornamental design for a packaged semiconductor module, as shown and described.