USD914621S1

Packaged semiconductor module

Publication

Country:US
Doc Number:D0914621
Kind:S1
Date:2021-03-30

Application

Country:US
Doc Number:29707990
Date:2019-10-02

Classifications

IPC Classifications

CPC Classifications

Applicants

Rohm Co., Ltd.

Inventors

Makoto Hirata, Shingo Matsumaru, Satoru Nate

Abstract

Figures

Description

[0001]FIG. 1 is a perspective view of a packaged semiconductor module showing our new design;

[0002]FIG. 2 is a front view thereof;

[0003]FIG. 3 is a rear view thereof;

[0004]FIG. 4 is a top plan view thereof;

[0005]FIG. 5 is a bottom plan view thereof;

[0006]FIG. 6 is a right side view thereof;

[0007]FIG. 7 is a left side view thereof;

[0008]FIG. 8 is a cross sectional view taken along lines 8-8 in FIG. 2; and,

[0009]FIG. 9 is a cross sectional view taken along lines 9-9 in FIG. 2.

Claims

CLAIM

The ornamental design for a packaged semiconductor module, as shown and described.