Power semiconductor package

[0001]FIG. 1 is a top perspective view of a power semiconductor package showing my new design;

[0002]FIG. 2 is a bottom perspective view thereof;

[0003]FIG. 3 is a top view thereof;

[0004]FIG. 4 is a bottom view thereof;

[0005]FIG. 5 is a front view thereof;

[0006]FIG. 6 is a rear view thereof;

[0007]FIG. 7 is a side view thereof; and,

[0008]FIG. 8 is an opposite side view thereof.

[0009]The broken lines shown in the drawings depict portions of the power semiconductor package that form no part of the claimed design.