USD941780S1

Contact wafer

Publication

Country:US
Doc Number:D0941780
Kind:S1
Date:2022-01-25

Application

Country:US
Doc Number:29725389
Date:2020-02-25

Classifications

IPC Classifications

CPC Classifications

Applicants

Samtec, Inc.

Inventors

Jonathan E. Buck, John A. Mongold

Abstract

Figures

Description

[0001]FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;

[0002]FIG. 2 is a bottom, back, and left side perspective view thereof;

[0003]FIG. 3 is a front view thereof;

[0004]FIG. 4 is a back view thereof;

[0005]FIG. 5 is a left thereof;

[0006]FIG. 6 is a right view thereof;

[0007]FIG. 7 is a top view thereof; and,

[0008]FIG. 8 is a bottom view thereof.

[0009]The broken lines in the drawing views are included to show portions of the contact wafer that form no part of the claimed design.

Claims

CLAIM

The ornamental design for contact wafer, as shown and described.