USD941780S1
Contact wafer
Publication
Country:US
Doc Number:D0941780
Kind:S1
Date:2022-01-25
Application
Country:US
Doc Number:29725389
Date:2020-02-25
Classifications
IPC Classifications
CPC Classifications
Applicants
Samtec, Inc.
Inventors
Jonathan E. Buck, John A. Mongold
Abstract
Figures
Description
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[0009]The broken lines in the drawing views are included to show portions of the contact wafer that form no part of the claimed design.
Claims
CLAIM
The ornamental design for contact wafer, as shown and described.