Patent Theme
Package Thermal Management
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
8,555 US filings from 1,524 companies since 2023 · 2023: 2,039 · 2024: 2,667 · 2025: 2,755 · 2026 YTD: 1,094
Chip-to-Chip Interconnect (Bonding, Bumps)Multi-Chip & 3D AssembliesSemiconductor Manufacturing ProcessSemiconductor Packaging & EncapsulationPower Conversion (DC/AC, DC/DC)
Top companies
Ranked by filings in this theme since 2023. 2026 is partial.
| # | Company | Since 2023 | 2023 | 2024 | 2025 | 2026 YTD | YoY |
|---|
| 1 | SAMSUNG ELECTRONICS CO., LTD. | 420 | 101 | 113 | 135 | 71 | +19.5% |
| 2 | INTEL CORPORATION | 349 | 105 | 107 | 94 | 43 | -12.1% |
| 3 | DELL PRODUCTS L.P. | 281 | 66 | 102 | 81 | 32 | -20.6% |
| 4 | Taiwan Semiconductor Manufacturing Company, Ltd. | 263 | 53 | 77 | 113 | 20 | +46.8% |
| 5 | BAIDU USA LLC | 140 | 93 | 37 | 10 | · | -73.0% |
| 6 | Huawei Technologies Co., Ltd. | 127 | 32 | 41 | 35 | 19 | -14.6% |
| 7 | Microsoft Technology Licensing, LLC | 123 | 30 | 34 | 46 | 13 | +35.3% |
| 8 | Taiwan Semiconductor Manufacturing Co., Ltd. | 118 | 29 | 29 | 49 | 11 | +69.0% |
| 9 | Mitsubishi Electric Corporation | 105 | 22 | 41 | 31 | 11 | -24.4% |
| 10 | Micron Technology, Inc. | 90 | 25 | 26 | 30 | 9 | +15.4% |
| 11 | International Business Machines Corporation | 80 | 18 | 24 | 30 | 8 | +25.0% |
| 12 | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC | 80 | 15 | 26 | 32 | 7 | +23.1% |
| 13 | OVH | 75 | 8 | 26 | 21 | 20 | -19.2% |
| 14 | TEXAS INSTRUMENTS INCORPORATED | 75 | 19 | 26 | 26 | 4 | 0.0% |
| 15 | GOOGLE LLC | 74 | 22 | 24 | 21 | 7 | -12.5% |
| 16 | COOLER MASTER CO., LTD. | 66 | 16 | 19 | 26 | 5 | +36.8% |
| 17 | Frore Systems Inc. | 66 | 16 | 23 | 20 | 7 | -13.0% |
| 18 | INVENTEC CORPORATION | 63 | 17 | 21 | 20 | 5 | -4.8% |
| 19 | Nvidia Corporation | 63 | 10 | 19 | 20 | 14 | +5.3% |
| 20 | TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC. | 61 | 21 | 20 | 15 | 5 | -25.0% |
| 21 | Infineon Technologies AG | 60 | 19 | 22 | 14 | 5 | -36.4% |
| 22 | Cisco Technology, Inc. | 58 | 18 | 24 | 9 | 7 | -62.5% |
| 23 | Adeia Semiconductor Bonding Technologies Inc. | 57 | 5 | 10 | 37 | 5 | +270.0% |
| 24 | Advanced Micro Devices, Inc. | 55 | 8 | 18 | 24 | 5 | +33.3% |
| 25 | SILICONWARE PRECISION INDUSTRIES CO., LTD. | 54 | 6 | 17 | 29 | 2 | +70.6% |