Company patents
Allegro MicroSystems, LLC
Allegro MicroSystems, LLC demonstrates a dynamic patent strategy, with a significant focus on "Electrical Measurement" (51.6% of its portfolio), which saw a remarkable 69.0% growth in 2025, indicating a strong commitment to this core area despite a partial decline so far in 2026. Surprisingly, the company has shown an emerging focus on "Magnets & Inductors," experiencing explosive growth of 1200.0% in 2024 and 92.3% in 2025, suggesting a rapid expansion into magnetic sensing and power applications.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
498 US filings (since 2023) · 12 categories · 25 themes
Methods and devices that determine the position, angle, or distance of an object by detecting changes in magnetic fields or inductive coupling.
Methods and apparatus for measuring magnetic fields or utilizing magnetic resonance principles for medical diagnostics, material analysis, or precise localization, including gradient field measurement in MRI.
Design and implementation of capacitive sensors, including methods for improving accuracy, reducing power consumption, compensating for environmental variations (like temperature), and analyzing complex displacement interactions.
Devices and methods for accurately measuring or monitoring electrical current draw and power usage in various systems, often for control, optimization, or safety purposes.
Digital logic circuits designed to interface with analog sensors or signals, including comparators, input buffers, differential input stages, and logic for processing sensor outputs (e.g., capacitance, optical, touch) for detection or measurement.
Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.
Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.
Systems and methods designed to improve the accuracy, reliability, or operational range of sensors and electronic components by measuring temperature and applying corrections or adjustments.
Methods and systems for identifying anomalies, failures, or impending issues within electric motors or their associated drive and power management circuits, often by monitoring electrical or operational parameters.
Innovations in the physical components and architectures of radar, lidar, and sonar systems, including antenna design, RF signal generation, beam steering mechanisms, and optical elements for improved performance.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.
Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.
Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Technologies for non-contact measurement of distance, position, or 3D properties of a target object, often involving active emission and detection of light or radio frequency waves, including target tracking.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Systems and methods for accurately measuring and compensating for position, orientation, and movement errors in mechanical systems, often for manufacturing, robotics, or optical alignment.
Systems and devices that utilize controlled magnetic fields, often generated by electromagnets, to produce mechanical motion, precise positioning, or manipulate physical phenomena like plasma distribution.
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Techniques used by sensing systems to identify the presence, location, and characteristics of objects or unusual conditions in an environment, including methods to suppress false positives or 'ghost' detections.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Patents
Showing 1-10 of 138
Capacitive Sensing & Compensation