Company patents
Amphenol Corporation
Amphenol Corporation's patent strategy reveals a strong, albeit consolidating, focus on Electrical Connectors, which constitute 76.9% of its portfolio, despite a -2.7% decline in 2025 and a -75.0% drop so far in 2026. Surprisingly, while its core category is slowing, the company showed a significant re-emphasis on Printed Circuits & Electronic Assemblies in 2025 with a +37.5% growth, indicating a potential shift towards integrated electronic solutions.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
169 US filings (since 2023) · 3 categories · 9 themes
Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Design techniques and components within connectors to minimize signal degradation, crosstalk, and impedance mismatches for high-frequency data transmission.
Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Handheld or motorized tools designed for efficiently removing insulation (stripping) or severing (cutting) electrical wires and cables during installation or maintenance processes.
Patents
Showing 1-10 of 278