AMULAIRE THERMAL TECHNOLOGY, INC.

A surface-modified aluminum alloy substrate structure includes a 6000-Series aluminum alloy substrate, a diffusion buffer layer, and a meltable metallic layer. The diffusion buffer layer is formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer. The meltable metallic layer is formed on the diffusion buffer layer for being melted in a subsequent process.

An automobile heat dissipation device having a modified surface includes a metal heat dissipation device and a silver metal layer. The metal heat dissipation device has a first and a second heat dissipation surface. The silver metal layer is formed on the first heat dissipation surface of the metal heat dissipation device by arc ion plating (AIP), so as to form a surface modification layer on the metal heat dissipation device. A surface of the surface modification layer is distributed with a plurality of holes that each have a diameter of from 0.1 μm to 30 μm and a plurality of metal particles that each have a size of less than 30 μm, and the surface of the surface modification layer acts as a subsequent silver sintered interface, so that the silver sintered interface is joined to at least one automobile electronic module by silver sintering.

An enclosed liquid-cooling cooler includes a copper heat sink and an aluminum heat sink, and a flow channel is formed therebetween to enable flowing of a coolant. The copper and aluminum heat sinks are bonded by friction stir welding, so as to form one or more bonding surfaces. One or more gaps are formed between the copper and aluminum heat sinks. An electroless-nickel-plating embedding layer is plated within the gap, such that the gap is less than 0.1 mm. A copper surface of the copper heat sink and an aluminum surface of the aluminum heat sink that come into contact with the coolant are each plated with at least one electroless-nickel-plating surface layer having a thickness of between 5 μm and 13 μm, such that the electroless-nickel-plating surface layer replaces the copper surface and the aluminum surface for contacting the coolant. Accordingly, potential difference corrosion can be prevented.

A liquid-cooling heat dissipating plate with sparsely arranged pin-fins and densely arranged pin-fins includes a heat dissipating plate body and a plurality of pin-fins. The heat dissipating plate body has a first heat dissipating face and a second heat dissipating face being opposite to each other. The first heat dissipating face is for contacting a plurality of chips, and an angle between a chip arrangement direction and a cooling liquid flowing direction is between 65° to 115°. The second heat dissipating face is for contacting the cooling liquid, with the plurality of pin-fins being formed thereon. A plurality of sparse regions with lower fin density and a plurality of dense regions with higher fin density are configured on the heat dissipating plate body, such that a flow speed of the cooling liquid along the cooling liquid flowing direction increases when the cooling liquid flows through each sparse region.

A closed-loop liquid cooler with pin-fins is provided, which includes a first external cover, a second cover, a plurality of water holes, a liquid channel, and a plurality of pin-fins. The water holes are formed on at least one of the first external cover and the second external cover. The liquid channel is formed between the first external cover and the second external cover, and is in spatial communication with the water holes. The pin-fins are located in the liquid channel. At least a portion of the pin-fins are copper fins made by copper or copper alloy. At least another portion of the pin-fins are aluminum fins made by aluminum or aluminum alloy. At least one of diameters, inscribed circle diameters, width, spacing, heights, shapes and draft angles of the copper fins and the aluminum fins are different.

A liquid-cooling cooler having a nickel multilayer structure includes a liquid-cooling cooler body and the nickel multilayer structure. The nickel multilayer structure is formed on the liquid-cooling cooler body for bonding with at least one heat source. A topmost layer of the nickel multilayer structure is a pure nickel electroplating layer, and a nickel content of the pure nickel electroplating layer is greater than 99 wt %. An electroless nickel-phosphorus plating layer is disposed beneath the pure nickel electroplating layer, and a phosphorus content of the electroless nickel-phosphorus plating layer ranges between 6 wt % and 13 wt %. The liquid-cooling cooler body is made of a non-nickel metal. A thickness of the pure nickel electroplating layer is less than or equal to 2 μm, and a thickness of the electroless nickel-phosphorus plating layer ranges between 3 μm and 12 μm.

A liquid-cooling heat dissipation plate includes multiple wavy fins and a heat dissipation plate body having first and second heat dissipation surfaces that are opposite to each other. The first heat dissipation surface is configured to be in contact with multiple chips, and the second heat dissipation surface is configured to be in contact with a cooling liquid. The wavy fins are formed on the second heat dissipation surface. The heat dissipation plate body is divided to have multiple heat dissipation areas. Each heat dissipation area is divided into an upstream area, a midstream area, and a downstream area according to a cooling-liquid flowing direction. An upstream fin wavelength of the upstream area is greater than a midstream fin wavelength of the midstream area, and a downstream fin wavelength of the downstream area is greater than the midstream fin wavelength of the midstream area.

A method for manufacturing a patterned surface coating of an automobile heat dissipation device and an automobile heat dissipation device having a patterned surface coating. The method for manufacturing the patterned surface coating of the automobile heat dissipation device includes providing a metal heat dissipation device, and forming a sputtered metal layer that is patterned on an upper surface of the metal heat dissipation device by sputtering, allowing a thickness of the sputtered metal layer to be between 1 μm and 3 μm, and allowing the sputtered metal layer to cover an area less than 90% of an area of the upper surface of the metal heat dissipation device.

A liquid-cooling cooler for an electric vehicle power module includes a liquid-cooling plate and a plurality of fin regions. A first rectangular region formed by outward extension of four sides of a projection of a heat source is defined as a heat source fin region among the plurality of fin regions. A second rectangular region extending outward from the heat source fin region in a counter flow direction of the coolant is defined as an upstream fin region. A third rectangular region extending outward from the heat source fin region in a flow direction of the coolant is defined as a downstream fin region. A fin density of the heat source fin region is greater than that of the downstream fin region, and the fin density of the downstream fin region is greater than or equal to that of the upstream fin region.

A liquid-cooling heat dissipation structure having a nonlinear fin array. The liquid-cooling heat dissipation structure includes an upper plate, a lower plate, and a flow guide member. The upper plate has an accommodating groove of which an inner side has an upper joint area formed thereon. The lower plate has a lower joint area. The flow guide member disposed between the upper plate and the lower plate includes a heat dissipation plate body having a first surface and a second surface, and a plurality of heat dissipation columns integrally disposed on the second surface. The upper brazing area is connected to the lower brazing area, and two ends of the flow guide member are respectively connected to the upper joint area and the lower joint area to form an enclosed cavity for accommodating the heat dissipation columns.