Analog Devices Inc

High linearity harmonic rejection mixers are disclosed herein. In certain embodiments, a mixer operates to mix a signal received at an input with a local oscillator signal from a local oscillator. The mixer includes a plurality of in-phase (I) signal paths and a plurality of quadrature-phase (Q) signals paths that are selectively activated by a plurality of clock signal phases of the local oscillator signal. For example, each clock signal phase selects a corresponding I signal path and Q signal path that are active for that clock signal phase. The mixer is implemented such that a total absolute current of the I signal path and the Q signal path is substantially constant for each of the clock signal phases.

A method of manufacturing a vertical inductor, the method comprising: forming a substrate, forming a bottom electrode, forming a dielectric layer, forming a magnetic core, forming insulation layer, forming a conductive loop structure by extending vertical interconnects through the insulation layer from a first side of the magnetic core to a second side of the magnetic core, electrically connecting the vertical interconnects to the bottom electrode on the second side of the magnetic core.

A semiconductor die for an inductor-based switching power converter includes a semiconductor layer stack, a first enhancement mode, N-channel metal oxide semiconductor field effect transistor (first NMOS FET) formed in the semiconductor layer stack, a second enhancement mode, N-channel metal oxide semiconductor field effect transistor (second NMOS FET) formed in the semiconductor layer stack, first driver circuitry formed in the semiconductor layer stack, second driver circuitry formed in the semiconductor layer stack, and bootstrap capacitance. The first driver circuitry is configured to drive the first gate from a bootstrap power rail in response to a first control signal, and the second driver circuitry is configured to drive the second gate in response to a second control signal. The bootstrap capacitance includes one or more bootstrap trench capacitors formed in the semiconductor layer stack, and each bootstrap capacitor is electrically coupled between the bootstrap power rail and the switching node.

A hybrid sensing circuit for generating a control signal for controlling a switching direct-current-to-direct-current (DC-to-DC) converter where (i) the switching DC-to-DC converter includes a first inductor-capacitor (LC) filter and (ii) a second LC filter is electrically coupled between a local output node and a remote output node of the switching DC-to-DC converter. The hybrid sensing circuit includes (a) one or more first amplifiers configured to generate a first amplifier output signal proportional to a dynamic voltage at the local output node, (b) one or more second amplifiers configured to generate a second amplifier output signal proportional to a difference between (i) a desired output voltage of the switching DC-to-DC converter and (ii) an output voltage of the switching DC-to-DC converter at the remote output node, and (c) summing circuitry configured to generate a control signal based on a sum of the first and second amplifier output signals.

Methods of forming compound semiconductors devices, such as GaN-based high electron mobility transistors (HEMTs) are described. AlScN can be employed for lattice-matching to a GaN layer. A “two-dimensional” (2D) (e.g., graphene, MoS2, HbN, Si, or other) intermediate layer can act as a sacrificial layer, or can be selectively removed such as to leave behind a back-side electric field plate for the GaN HEMT device. Back-barrier layer and “superlattice” formation techniques are described, along with backside processing and layer formation and phase-change compliant layers. Certain steps can involve concurrent chemical vapor deposition (CVD) and physical vapor deposition (PVD), e.g., sputtering, at lower temperature than otherwise possible using Metal organic chemical vapor deposition (MOCVD).

Apparatus and methods for switch-mode power supply start-up are provided herein. In certain embodiments, a switch-mode power supply includes an inductor and one or more power switches used to control a current through the inductor to provide voltage regulation. The switch-mode power supply uses external voltage levels to regulate one or more internal control signals (for example, for opening or closing the one or more power switches) to their zero output current switching state at the appropriate switch duty cycle. Furthermore, the switch-mode power supply can be implemented to provide a first pulse timing signal to establish the inductor current waveform for zero net output current delivery to a load.

An encapsulated integrated circuit package is disclosed. The package includes an integrated device package mounted on a substrate. The integrated device package may have a housing defining a cavity and a crystal oscillator in the cavity. The integrated device package may be encapsulated using a high-pressure molding process. The integrated circuit package may further comprise a protection layer over the integrated device package to reduce deformation during pressure processes.

Power modules with enhanced thermal conductivity are disclosed herein. In certain embodiments, a power module includes a circuit board, an inductor component attached to a first or top side of the circuit board, and a semiconductor die attached to a second or bottom side of the circuit board opposite the first side. The power module further includes a thermally conductive wrap at least partially around a dielectric body of the inductor component. The thermally conductive wrap serves to transfer heat from the semiconductor die to a cold plate or heat sink that can be attached to the inductor component opposite the circuit board.

Aspects of the present disclosure include a detection system, a method, and/or a base node for providing the electrical energy to a plurality of edge nodes, transmitting a sensor interrogation signal to at least one of the plurality of edge nodes in the detection system, receiving, in response to the sensor interrogation signal, sensor information, send the sensor information to a predictor configured to: receive sensor training data, train an artificial intelligence engine using the sensor training data, identify an anomaly and an action associated with the anomaly based on providing the sensor information to the artificial intelligence engine, and provide the action, and performing the action provided by the predictor.

System and techniques to enable transfer learning for machine-learning model interoperability are described herein. Data in a target domain is subjected to a transport process that shifts the data towards a source domain. The transport process includes creating synthetic data based on a portion of the target domain data and a constraint. A transformation is applied to a combination of the synthetic data and the original data that shifts the combination into the source domain. An ML model, trained on the source domain, is invoked on the data that results from the transformation.