Company patents

ASIA VITAL COMPONENTS (CHINA) CO., LTD.

ASIA VITAL COMPONENTS (CHINA) CO., LTD. demonstrates a primary focus on manufacturing, with Heat Exchangers (Specific Types) accounting for 47.4% of its portfolio, despite a recent decline of 22.2% in 2026 so far. Surprisingly, the company shows a rapidly emerging focus in Pumps (Centrifugal), which experienced a 150.0% year-over-year growth in 2024, indicating a strategic shift towards fluid dynamics within its manufacturing core.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

78 US filings (since 2023) · 10 categories · 14 themes

Advanced Heat Exchanger Architectures

Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.

Heat Exchangers (Specific Types)Heat Exchange Components
Who else files here? →
47since 2023
+7.7%YoY
Two-Phase Cooling Devices

Heat transfer devices that utilize the phase change of a working fluid (evaporation and condensation) to efficiently move heat, often incorporating capillary structures, heat pipes, or vapor chambers.

Heat Exchangers (Specific Types)
Who else files here? →
42since 2023
-8.3%YoY
Enhanced Surface Fin Geometries

Design and optimization of fin structures, baffles, and surface textures within heat exchangers to increase heat transfer area, promote turbulence, or manage fluid flow for improved thermal performance.

Heat Exchange Components
Who else files here? →
21since 2023
0.0%YoY
Internal Flow Path Optimization

Techniques and structures within heat exchangers designed to enhance heat transfer efficiency by controlling and optimizing fluid flow, including baffle arrangements, jet impingement, and condensate management.

Heat Exchangers (Specific Types)
Who else files here? →
19since 2023
0.0%YoY
Package Thermal Management

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Semiconductor Packaging & Encapsulation
Who else files here? →
14since 2023
+500.0%YoY
Advanced Impeller & Flow Path Design

Focuses on optimizing the geometry, structure, and internal flow channels of impellers, blades, and housings to improve fluid dynamics, efficiency, or specific performance characteristics of centrifugal pumps and fans.

Pumps (Centrifugal)
Who else files here? →
9since 2023
0.0%YoY
Pump & Fan Operational Control & Diagnostics

Systems and methods for monitoring, regulating, and diagnosing the performance and health of pumps and fans, including speed control, flow rate management, abnormality detection, and safety mechanisms like overspeed safeguards.

Pumps (Centrifugal)
Who else files here? →
8since 2023
0.0%YoY
Advanced Motor Topologies

Development of novel motor architectures beyond traditional radial flux designs, including linear, axial, or multi-armature configurations, often to optimize for specific performance characteristics like torque density or form factor.

Electric Motors & Generators
Who else files here? →
5since 2023
-66.7%YoY
Stator & Coil Manufacturing

Manufacturing processes and techniques for producing stator cores, windings, and coils, including lamination, impregnation, hairpin winding, and segment coil bending, to improve motor efficiency, power density, or reliability.

Electric Motors & Generators
Who else files here? →
4since 2023
-50.0%YoY
Device Enclosure & Material Engineering

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Printed Circuits & Electronic Assemblies
Who else files here? →
2since 2023
new
Advanced Electronic Packagingfiltered

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Printed Circuits & Electronic Assemblies
Who else files here? →
2since 2023
new
Integrated Actuation and Drive Systems

Methods and components for converting power into mechanical motion to drive pump mechanisms, encompassing electric motors, hydraulic actuators, and specialized motion converters like ball screws or solenoids.

Pumps (Centrifugal)
Who else files here? →
2since 2023
0.0%YoY
Power Delivery & Battery Management

Techniques for efficiently supplying power to electronic devices, managing battery charge/discharge cycles, optimizing power consumption, and converting power between different voltage levels or AC/DC for improved energy efficiency and longevity.

Hardware Platform (Cooling, Power, Packaging)
Who else files here? →
1since 2023
new
Specialized Fluid Handling Applications

Pumps and blowers specifically adapted or designed for unique fluid types, challenging environments, or particular industrial, medical, or consumer applications, often involving debris, specific gas mixtures, or precise delivery requirements.

Pumps (Centrifugal)
Who else files here? →
1since 2023
n/a

Patents

Page 1 of 1