ASM IP Holding B.V.

Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.

Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.

Methods and systems for real-time monitoring and control of coating processes or chamber cleaning, utilizing sensor data (e.g., thermal, pressure, optical) and predictive models to ensure quality and optimize efficiency.

Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.

Incorporation of novel semiconductor, dielectric, or metallic materials into transistor structures to achieve enhanced performance, new functionalities, or specific device characteristics.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.

Focuses on novel heating elements, power delivery, and thermal management for efficient and controlled aerosol generation. This includes resistive, inductive, and other heating methods, as well as heat distribution and retention.

Focuses on the physical design, materials, and manufacturing processes for individual memory cells, including transistor structures, interconnects, and multi-layered (3D) architectures to enhance density and performance.

Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.

Development of novel chemical compositions for photoresists, including polymers, sensitizers, and crosslinking agents, to achieve improved lithographic performance such as resolution, sensitivity, line edge roughness, and etch resistance.

Focuses on the mechanisms, control, and sensing involved in robots or automated systems accurately grasping, moving, and releasing individual items, often in conjunction with conveyor systems or storage units, including path planning and end effector design.

Engineering approaches to improve the efficiency, control, and performance of chemical reactors, encompassing continuous processes, heat exchange integration, and specialized reactor configurations for various chemical transformations.

Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.

Design and control of advanced robotic grippers, tools, and mechanical linkages for specific manipulation tasks or operating in challenging environments.

Design and operation of transistors optimized for memory applications, including floating body devices, ferroelectric FETs (FeFETs), vertical TFTs for 3D arrays, and charge-trapping memory cells.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Techniques and apparatus for achieving and maintaining vacuum conditions within charged particle and plasma processing chambers, including pump control, vacuum degree monitoring, and chamber sealing.

Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.