Company patents
ASML Netherlands B.V.
ASML Netherlands B.V. maintains a strong focus on its core Photolithography technology, which accounts for 66.8% of its patent portfolio. Surprisingly, despite its core strength, ASML shows significant emerging interests in diverse areas like Machine Learning & AI, which saw a 75.0% YoY growth in 2024, and Image Processing, with a 63.6% YoY growth in 2024, indicating a strategic expansion beyond traditional semiconductor manufacturing into advanced computing and analytical capabilities, though patent filings so far in 2026 show a general decline across all categories compared to previous full years.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
1,642 US filings (since 2023) · 12 categories · 31 themes
Techniques and apparatus for measuring critical dimensions, overlay accuracy, defect detection, and surface topography in lithographic processes, often involving optical, laser, or charged particle beams.
Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.
Computational methods for modeling and simulating photolithography processes, including mask design, aerial image generation, and defect prediction for semiconductor manufacturing.
Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.
Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.
Techniques and devices for generating, shaping, focusing, and deflecting electron or ion beams, often involving multi-pole lenses, deflectors, and aberration correction for applications like microscopy or processing.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Utilizing optical systems, cameras, and image processing algorithms for precise measurement of physical dimensions, alignment, defects, and features on semiconductor wafers or packages.
Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Techniques and systems for real-time or near-real-time measurement and adjustment of semiconductor manufacturing parameters (e.g., temperature, etch rate, ion beam uniformity) to ensure process quality and consistency.
Techniques and systems for measuring three-dimensional shapes, depths, or surface profiles using optical principles, including diffraction, interferometry, structured light, and imaging.
Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.
Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.
Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.
Techniques and apparatus for achieving and maintaining vacuum conditions within charged particle and plasma processing chambers, including pump control, vacuum degree monitoring, and chamber sealing.
The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.
Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.
Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.
Utilizing sensor data, historical performance, and analytical models to anticipate equipment failures, diagnose faults, and estimate remaining useful life, thereby enabling proactive maintenance and reducing downtime.
Methods and compositions for identifying, quantifying, or characterizing specific biological molecules (e.g., nucleic acids, proteins, metabolites, antibodies) or microbial species, often for diagnostic, prognostic, or quality control applications.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Development of novel chemical compositions for photoresists, including polymers, sensitizers, and crosslinking agents, to achieve improved lithographic performance such as resolution, sensitivity, line edge roughness, and etch resistance.
Technologies for non-contact measurement of distance, position, or 3D properties of a target object, often involving active emission and detection of light or radio frequency waves, including target tracking.
Applying machine learning and artificial intelligence models to analyze industrial data, predict system behavior, and optimize control strategies for improved efficiency, quality, or environmental compliance in manufacturing and operations.
Automated methods and tools for generating, optimizing, and verifying the physical layout and interconnections of electronic components, including integrated circuits, printed circuit boards, and system-level interface protection.
Utilizing machine learning, particularly deep learning, to analyze medical data such as images, sensor readings, or physiological signals for disease prediction, diagnosis, or treatment assessment.
Systems and methods for accurately measuring and compensating for position, orientation, and movement errors in mechanical systems, often for manufacturing, robotics, or optical alignment.
Patents
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