Company patents
ASMPT SINGAPORE PTE. LTD.
ASMPT SINGAPORE PTE. LTD. exhibits a surprising patent strategy with a strong, albeit fluctuating, focus on core semiconductor manufacturing, particularly in "Chip-to-Chip Interconnect (Bonding, Bumps)" (24.2% of portfolio), which saw a significant 200.0% YoY growth in 2026 so far, indicating a renewed emphasis after a sharp decline in 2025. Conversely, categories like "Semiconductor Manufacturing Process" and "Printed Circuits & Electronic Assemblies" show a shifting priority with a 100.0% YoY decline in 2026 so far, despite previous year's growth, suggesting a dynamic reallocation of R&D efforts within its semiconductor domain.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
66 US filings (since 2023) · 12 categories · 18 themes
Specialized welding or bonding techniques and apparatuses tailored for joining small-scale electronic components, integrated circuits, or semiconductor wafers, emphasizing precision, miniaturization, and electrical connectivity.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Focuses on the mechanisms, control, and sensing involved in robots or automated systems accurately grasping, moving, and releasing individual items, often in conjunction with conveyor systems or storage units, including path planning and end effector design.
Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.
Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.
Techniques and systems utilizing laser beams for precise material modification, including cutting, cladding, ablation, and surface treatment, often for joining, shaping, or removing material.
Systems and methods for precisely controlling welding parameters such as power, speed, oscillation, and material feed to optimize weld quality, consistency, and efficiency, often involving automated or semi-automated processes.
Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.
Design and features of welding and soldering tools, fixtures, and accessories that enhance user safety, ergonomics, operational efficiency, and precise workpiece manipulation, including protective equipment and clamping mechanisms.
Design and control of advanced robotic grippers, tools, and mechanical linkages for specific manipulation tasks or operating in challenging environments.
Systems that combine data from multiple camera sensors or capture multiple images from different perspectives or qualities, often involving image processing techniques like synthesis to create enhanced or comprehensive views.
Patents
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