Company patents

Asphetek Solution (Chengdu) Ltd.

Asphetek Solution (Chengdu) Ltd. exhibits a highly concentrated patent strategy, with 65.0% of its portfolio in Optical Elements & Systems, which saw an explosive 2200.0% growth in 2025, though patenting in this area has slowed significantly so far in 2026. Surprisingly, despite this focus, the company also shows a shifting priority away from manufacturing-related categories like Plastic Articles (Specific) and Plastics Shaping & Molding, both experiencing a 100.0% decline in 2026 after a surge in 2025.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

40 US filings (since 2023) · 11 categories · 11 themes

Wearable Display Optics

Optical systems and components specifically designed for head-mounted displays, augmented reality (AR) glasses, and virtual reality (VR) headsets, focusing on image projection, waveguide integration, and display durability.

Optical Elements & Systems
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20since 2023
+1600.0%YoY
Advanced Optical Imaging & Lens Design

Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.

Optical Elements & Systems
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13since 2023
+900.0%YoY
Precision Optical Component Molding

Manufacturing methods for optical components such as lenses, waveguides, films, and filters, requiring high precision in molding, surface treatment, or material composition to achieve specific optical properties like refractive index, microstructures, or tinting.

Plastic Articles (Specific)
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8since 2023
new
Integrated Display & Illumination

Systems that combine light sources, waveguides, and display elements into unified products for backlighting, automotive applications, general lighting, or color-corrected displays.

Optical Elements & Systems
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4since 2023
+200.0%YoY
Advanced Display Backlight & Optics

Innovations in backlight units, optical films, and light management structures to enhance display performance, uniformity, viewing experience, or specific functionalities like touch.

Liquid Crystal & Optical Modulators
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4since 2023
new
Multi-material Product Integration & Finishing

Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.

Plastic Articles (Specific)Plastics Shaping & Molding
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2since 2023
new
Display Power Management

Techniques and circuits for optimizing power consumption, voltage stability, and energy efficiency in display panels, often involving dynamic voltage scaling, duty cycle control, or remnant voltage management.

Display Drivers
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1since 2023
new
Optical Fiber Sensing Systems

Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.

Optical Elements & Systems
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1since 2023
new
3D Image Sensor Pixel Design

Focuses on advanced pixel architectures, often involving vertical stacking (3D) or silicon-on-insulator (SOI) structures, to improve performance, density, or functionality of photodiodes, transistors, and floating diffusion regions within image sensor pixels.

Photovoltaic / Photoconductive Devices
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1since 2023
new
3D Die Stacking & Vertical Interconnects

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Chip-to-Chip Interconnect (Bonding, Bumps)
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1since 2023
new
Interconnect Materials & Reliability

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.

Chip-to-Chip Interconnect (Bonding, Bumps)
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1since 2023
new

Patents

Showing 1-10 of 40

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