Company patents
Avary Holding (Shenzhen) Co., Limited.
Avary Holding (Shenzhen) Co., Limited. shows a surprising and significant decline in its patenting activity across nearly all categories, with its dominant "Printed Circuits & Electronic Assemblies" category, representing 79.2% of its portfolio, experiencing a sharp -67.7% YoY decline in 2025 and a further -60.0% so far in 2026. This widespread reduction, including a -100.0% YoY decline so far in 2026 across multiple categories like "Semiconductor Manufacturing Process" and "Pictorial / Video Communications," suggests a substantial shift in its innovation strategy or a temporary pause in patent filings.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
101 US filings (since 2023) · 10 categories · 9 themes
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Measures force or pressure by detecting changes in electrical capacitance. This typically involves the deformation of a dielectric material or the relative movement of conductive plates, altering the distance or area between them.
Sensors and systems designed to detect and quantify localized contact forces, pressure distribution, or touch interactions, often employed in robotics, human-machine interfaces, or object manipulation applications.
Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.
The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.
Systems and sensors designed to measure the pressure difference between two distinct points or to capture rapid, transient pressure fluctuations in fluid or gas systems, often using diaphragms or pistons.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Patents
Showing 1-10 of 242