Company patents

Axcelis Technologies, Inc.

Axcelis Technologies, Inc. demonstrates a highly concentrated patent strategy, with 83.1% of its portfolio in Electron / Ion Tubes & Discharge, despite a significant -67.7% decline in patenting in this core area so far in 2026. Surprisingly, while Semiconductor Manufacturing Process saw a 200.0% surge in 2025, it has experienced a sharp -91.7% drop in patenting activity so far in 2026, suggesting a potential shift in immediate R&D focus within its semiconductor-related innovations.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

83 US filings (since 2023) · 4 categories · 9 themes

Ion Implantation Control & Metrology

Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.

Electron / Ion Tubes & Discharge
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71since 2023
+288.9%YoY
Advanced Etching & Patterning Control

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Semiconductor Manufacturing Process
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29since 2023
+433.3%YoY
Plasma Process Chamber Engineering

Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.

Electron / Ion Tubes & Discharge
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24since 2023
+125.0%YoY
Charged Particle Beam Optics

Techniques and devices for generating, shaping, focusing, and deflecting electron or ion beams, often involving multi-pole lenses, deflectors, and aberration correction for applications like microscopy or processing.

Electron / Ion Tubes & Discharge
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22since 2023
+100.0%YoY
Wafer Handling and Process Environment Control

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Semiconductor Manufacturing Process
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19since 2023
+333.3%YoY
RF Plasma Power Delivery

Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.

Electron / Ion Tubes & Discharge
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19since 2023
+100.0%YoY
Advanced Deposition Chamber Hardware

Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.

Coating & Surface Treatment
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12since 2023
new
Conformal & Selective Film Deposition

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Coating & Surface Treatment
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4since 2023
+100.0%YoY
Temporary Wafer Bonding & Debonding

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Semiconductor Manufacturing Process
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2since 2023
new

Patents

Showing 1-10 of 106

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