Company patents
Ayar Labs, Inc.
Ayar Labs, Inc. demonstrates a strong, albeit consolidating, focus on "Optical Elements & Systems," which constitutes 81.1% of its patent portfolio, despite a 56.0% year-over-year decline in patent filings so far in 2026. While "Liquid Crystal & Optical Modulators" saw a significant 66.7% growth in 2025, the company appears to be shifting away from several semiconductor-related areas, with "Semiconductor Manufacturing Process," "Semiconductor Packaging & Encapsulation," and "Multi-Chip & 3D Assemblies" all showing 100.0% declines in filings so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
111 US filings (since 2023) · 11 categories · 15 themes
Design and integration of lasers and associated components specifically for transmitting data over optical fibers or through free space, including modulation schemes and efficient light coupling.
Methods and devices for controlling, detecting, and compensating for the polarization state of light signals in optical communication systems, crucial for reducing crosstalk and managing signal integrity.
The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.
Techniques for combining and separating multiple optical signals at different wavelengths over a single optical fiber, including components like filters, comb sources, and tunable add/drop multiplexers.
Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.
Methods and structures for assembling laser chips into functional modules, encompassing optical alignment, electrical interconnection, mechanical support, thermal management, and encapsulation for protection.
Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.
Hardware and control techniques for optimizing memory access latency, ensuring data integrity, and managing storage resources efficiently. This includes error correction, read/write voltage control, and intelligent data placement or in-memory computation.
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Strategies for sharing wireless communication channels among multiple users or data streams, encompassing techniques like orthogonal frequency division multiplexing, spread spectrum, beamforming, and control channel allocation.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Utilizing optical systems, cameras, and image processing algorithms for precise measurement of physical dimensions, alignment, defects, and features on semiconductor wafers or packages.
Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.
Patents
Showing 1-6 of 6
Metasurface & Diffractive Optics