Company patents

BAE Systems Information and Electronic Systems Integration Inc.

BAE Systems Information and Electronic Systems Integration Inc. shows a surprising shift in its patent strategy, with a significant emerging focus on Antennas, which saw a 108.3% year-over-year growth in 2025, despite a broader decline in its core Radar / Sonar / Lidar category (down 7.7% in 2025). While Printed Circuits & Electronic Assemblies also experienced rapid growth of 700.0% in 2024, the company appears to be shifting away from Computer Hardware Architecture, which declined by 28.6% in 2025, and Physical Transmission & Modulation, which saw a 100.0% decline in 2024 and 2026 so far.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

528 US filings (since 2023) · 12 categories · 39 themes

Phased Array & Beamforming Antennas

Systems and methods for electronically steering or shaping antenna beams by controlling the phase and amplitude of signals fed to individual elements in an array, including calibration techniques and multi-antenna configurations.

Antennas
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79since 2023
+61.9%YoY
Multi-Band & Broadband Antenna Design

Antennas engineered to operate effectively across a wide continuous range of frequencies (broadband) or multiple distinct frequency bands, often requiring specific radiating element geometries or impedance matching circuits.

Antennas
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48since 2023
+91.7%YoY
Integrated & Embedded Antennas

Design and manufacturing techniques for incorporating antenna structures directly into electronic devices, product housings, or materials, often under constraints of space, aesthetics, or environmental factors.

Antennas
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42since 2023
+144.4%YoY
Advanced Radar/Lidar Hardware

Innovations in the physical components and architectures of radar, lidar, and sonar systems, including antenna design, RF signal generation, beam steering mechanisms, and optical elements for improved performance.

Radar / Sonar / Lidar
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35since 2023
-36.4%YoY
Advanced Electronic Packaging

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Printed Circuits & Electronic Assemblies
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34since 2023
-30.8%YoY
Precise Positioning & Localizationfiltered

Methods and systems for accurately determining the absolute or relative position of an object or device, often integrating satellite navigation (GNSS), inertial measurement units (IMU), and local ranging or wireless communication technologies.

Radar / Sonar / Lidar
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24since 2023
+71.4%YoY
Advanced Optical Imaging & Lens Design

Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.

Optical Elements & Systems
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22since 2023
-66.7%YoY
Antenna Isolation & Interference Mitigation

Techniques and structures used to reduce unwanted electromagnetic coupling, scattering, or interference between multiple antennas, different frequency bands, or sensitive electronic components within a device.

Antennas
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19since 2023
+233.3%YoY
Multi-Sensor Imaging & Synthesis

Systems that combine data from multiple camera sensors or capture multiple images from different perspectives or qualities, often involving image processing techniques like synthesis to create enhanced or comprehensive views.

Pictorial / Video Communications
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19since 2023
-20.0%YoY
Flexible Frame Structures & Resource Grouping

Design and configuration of adaptable frame structures, resource block groupings, and subcarrier spacings to optimize data transmission across diverse wireless environments and services, including considerations for fronthaul interfaces.

Physical Transmission & Modulation
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13since 2023
0.0%YoY
Advanced Modulation & Coding Schemes

Techniques for encoding digital data onto analog carrier signals using complex constellation diagrams, multi-level signaling, or layered approaches, often combined with error correction codes, to achieve higher data rates, improved spectral efficiency, or extended range.

Physical Transmission & Modulation
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11since 2023
+400.0%YoY
Memory System Performance & Reliability

Hardware and control techniques for optimizing memory access latency, ensuring data integrity, and managing storage resources efficiently. This includes error correction, read/write voltage control, and intelligent data placement or in-memory computation.

Computer Hardware Architecture
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11since 2023
0.0%YoY
Multi-modal Sensor Fusion

Techniques for combining data from disparate sensor types (e.g., cameras, radar, mobile device signals) to achieve a more robust and comprehensive understanding of an environment or subject, often leveraging machine learning for interpretation and correlation.

Radar / Sonar / LidarComputer Vision
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10since 2023
0.0%YoY
Joint Communication and Sensing (JCS)

Integration of communication and sensing functionalities within a single wireless system, often by designing waveforms or utilizing reference signals that serve both data transmission and environmental sensing (e.g., ranging, velocity detection) purposes.

Physical Transmission & Modulation
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9since 2023
-25.0%YoY
Wearable Display Optics

Optical systems and components specifically designed for head-mounted displays, augmented reality (AR) glasses, and virtual reality (VR) headsets, focusing on image projection, waveguide integration, and display durability.

Optical Elements & Systems
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9since 2023
-50.0%YoY
Video Quality & Encoding Optimization

Methods and apparatus for improving the visual fidelity, resolution, or compression efficiency of video signals, often through advanced processing, up-scaling, or neural network-based filters.

Computer VisionPictorial / Video Communications
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9since 2023
-75.0%YoY
3D Die Stacking & Vertical Interconnects

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Semiconductor Packaging & Encapsulation
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8since 2023
-40.0%YoY
High-Speed Data Interconnects

Technologies for establishing and managing high-bandwidth, low-latency communication pathways between computing components, peripherals, or systems, focusing on signal integrity, synchronization, and interface standards.

Computer Hardware Architecture
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8since 2023
-33.3%YoY
Package Thermal Management

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Semiconductor Packaging & Encapsulation
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7since 2023
0.0%YoY
Video Enhancement & Object Tracking

Methods and systems for improving the quality of video streams, generating intermediate frames, or continuously locating and following objects within a sequence of images, even under occlusion.

Image Processing
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6since 2023
-33.3%YoY
Vision-Based Object & Pose Estimation

Methods and apparatus for detecting objects and determining their three-dimensional position and orientation (pose) using imagery or point cloud data, often for navigation, surveying, or environmental understanding.

Computer Vision
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6since 2023
new
Metasurface & Diffractive Optics

Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.

Optical Elements & Systems
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5since 2023
+200.0%YoY
Advanced Package Interconnects

Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.

Semiconductor Packaging & Encapsulation
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5since 2023
+100.0%YoY
Flexible and Printed Circuitry

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Printed Circuits & Electronic Assemblies
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4since 2023
-50.0%YoY
Fan-Out & Embedded Die Packaging

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.

Semiconductor Packaging & Encapsulation
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3since 2023
new
Reference Signal Design & Optimization

Methods for designing, transmitting, and utilizing specific reference signals (e.g., DMRS, SRS, PT-RS) to enable accurate channel estimation, interference measurement, synchronization, or sensing in wireless communication systems.

Physical Transmission & Modulation
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3since 2023
new
Generative AI for Images

Techniques utilizing deep learning models like Generative Adversarial Networks (GANs) or diffusion models to create new images, modify existing ones, or generate synthetic data based on various inputs or conditions.

Image ProcessingComputer Vision
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2since 2023
new
Photonic Integration & Interconnects

The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.

Optical Elements & Systems
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2since 2023
new
AI/ML for Cryptographic Security

Applying artificial intelligence and machine learning techniques to enhance cryptographic systems, such as generating encryption models, improving zero-trust architectures, or enabling privacy-preserving computations like federated learning.

Computer Security
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2since 2023
new
Device Enclosure & Material Engineering

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Printed Circuits & Electronic Assemblies
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2since 2023
0.0%YoY
Aircraft Fluid & Gas Control

Systems designed to regulate the flow, pressure, and distribution of non-fuel gases and fluids within aircraft, such as cabin air, oxygen supply, or pneumatic actuation systems.

Aircraft Equipment
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2since 2023
n/a
Hydrogen Aircraft Fuel Systems

Technologies for storing, managing pressure, and safely distributing hydrogen fuel within an aircraft, including tank integration, pressure control, and leak detection.

Aircraft Equipment
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2since 2023
n/a
3D Reconstruction & Modeling

Processes for creating or manipulating three-dimensional digital representations of objects or environments, including mesh generation, surface fitting, and depth estimation from multiple views.

Image Processing
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1since 2023
new
Optical Fiber Sensing Systems

Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.

Optical Elements & Systems
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1since 2023
new
Advanced Cabin Interior Systems

Innovations in aircraft cabin design, including reconfigurable spaces, passenger amenities, integrated displays, and automated control of cabin devices based on flight status.

Aircraft Equipment
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1since 2023
new
On-Chip Power Management & Protection

Integrated circuits or sub-circuits designed to regulate, balance, or protect power delivery within a device, often involving specific transistor and capacitor arrangements.

Computer Hardware Architecture
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1since 2023
n/a
Specialized Compute Architectures

Novel hardware designs and processing pipelines tailored for specific computational tasks, such as graphics rendering, neural network operations, or matrix transformations, often involving custom circuits, memory arrays, or data flow mechanisms.

Computer Hardware Architecture
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1since 2023
n/a
Aircraft Sensor & Diagnostic Systems

Technologies for detecting operational parameters, monitoring component health, and diagnosing malfunctions in aircraft using various sensors and data analysis, often employing AI/ML.

Aircraft Equipment
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1since 2023
n/a
Electronics Encapsulation & Sealing

Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.

Semiconductor Packaging & Encapsulation
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1since 2023
n/a

Patents

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