Company patents
BOE MLED Technology Co., Ltd.
BOE MLED Technology Co., Ltd's patent strategy reveals a strong and sustained focus on semiconductor technologies, particularly in "Multi-Chip & 3D Assemblies," which constitutes 48.4% of its portfolio and saw a remarkable 1166.7% growth in 2024. While display-related categories like "LED & Optoelectronics (Legacy CPC)" and "Display Drivers" also experienced significant surges in 2024 (966.7% and 320.0% YoY, respectively), the emergence of "Light-Emitting Devices (LEDs)" with 22 patents in 2025, after no activity in prior years, indicates a recent, dedicated push into core LED technology, even as other display categories show signs of shifting priorities with declines in 2025 and partial data for 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
159 US filings (since 2023) · 11 categories · 23 themes
Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.
Techniques and structural designs for fabricating the physical layers of an OLED display, including material deposition, patterning, and methods to protect the active organic layers from environmental degradation like moisture and oxygen.
Techniques and structural designs for assembling multiple display modules or panels to create a larger, continuous display with minimized visible seams, uniform light emission, and robust mechanical integrity.
Innovations in the internal design of individual light-emitting diode chips or packages, focusing on semiconductor layer arrangements, electrode configurations, reflective elements, and light extraction features.
Physical layout and material composition of individual pixels within a display panel, including active layers, electrodes, light-emitting elements (LEDs, OLEDs), and associated thin-film transistors (TFTs).
Design and implementation of circuits and layouts for driving individual pixels or rows/columns of pixels, including gate drivers, data drivers, pixel driving circuits, and their integration onto the display substrate, often in non-display regions.
Innovations in backlight units, optical films, and light management structures to enhance display performance, uniformity, viewing experience, or specific functionalities like touch.
Techniques for driving electrophoretic displays, including managing remnant voltage, optimizing particle movement, and specific addressing pulse schemes to improve optical quality and update speed.
Mechanical systems and structural designs that facilitate the rolling up or unrolling of a display panel, typically comprising a roller part, a housing, and support linkages or drivers.
Methods and circuits for coordinating the timing of display signals, data transmission, and control signals across various display components, ensuring proper image rendering and efficient operation.
Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.
Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.
Techniques and circuits for optimizing power consumption, voltage stability, and energy efficiency in display panels, often involving dynamic voltage scaling, duty cycle control, or remnant voltage management.
LED devices and display systems designed to emit or utilize light across different spectral ranges, including visible and invisible light, or to create specific illumination patterns and immersive lighting experiences.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Support structures and stands specifically engineered for electronic devices such as displays, tablets, cameras, or handheld devices, often incorporating features for viewing angle adjustment, stability, or power/data integration.
Systems designed for rapid and secure attachment and detachment of devices or components to a main support structure, often employing snap-fit, clamping, or magnetic mechanisms for convenience and flexibility.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Algorithms and hardware implementations within display drivers or associated components to enhance visual quality, resolution, or color reproduction, including upscaling, dithering, and compensation for display artifacts like crosstalk.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.
Patents
Showing 1-10 of 99
Micro-LED Array Fabrication