Brooks Automation US, LLC

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Design and control of advanced robotic grippers, tools, and mechanical linkages for specific manipulation tasks or operating in challenging environments.

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Focuses on the mechanisms, control, and sensing involved in robots or automated systems accurately grasping, moving, and releasing individual items, often in conjunction with conveyor systems or storage units, including path planning and end effector design.

Utilizing sensor data, historical performance, and analytical models to anticipate equipment failures, diagnose faults, and estimate remaining useful life, thereby enabling proactive maintenance and reducing downtime.

Methods and systems for monitoring the operational status, detecting anomalies, ensuring safe interaction, and preventing damage or injury in robotic systems.

Development of novel motor architectures beyond traditional radial flux designs, including linear, axial, or multi-armature configurations, often to optimize for specific performance characteristics like torque density or form factor.

Integration of electric motors into larger systems (e.g., vehicles, power tools) and safety features for high-voltage components, including control interfaces, mechanical integration, and environmental protection (e.g., waterproofing).