Company patents
CENTER FOR ADVANCED META-MATERIALS
CENTER FOR ADVANCED META-MATERIALS' patent strategy shows a surprising recent surge in "Material & Chemical Analysis," which comprises 21.9% of its portfolio and experienced a remarkable 250.0% year-over-year growth in 2025, indicating an emerging focus despite a partial decline so far in 2026. Concurrently, the company appears to be shifting priorities away from "Printed Circuits & Electronic Assemblies," "Optical Elements & Systems," and "Antennas," all of which saw a 100.0% year-over-year decline in patent filings so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
64 US filings (since 2023) · 12 categories · 16 themes
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.
Design and manufacturing techniques for incorporating antenna structures directly into electronic devices, product housings, or materials, often under constraints of space, aesthetics, or environmental factors.
Antennas engineered to operate effectively across a wide continuous range of frequencies (broadband) or multiple distinct frequency bands, often requiring specific radiating element geometries or impedance matching circuits.
Innovations in backlight units, optical films, and light management structures to enhance display performance, uniformity, viewing experience, or specific functionalities like touch.
Chemical compounds developed for applications in energy storage devices, such as rechargeable lithium batteries, often functioning as electrolyte additives to improve performance, safety, or lifespan.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Optical systems and components specifically designed for head-mounted displays, augmented reality (AR) glasses, and virtual reality (VR) headsets, focusing on image projection, waveguide integration, and display durability.
Systems and methods for electronically steering or shaping antenna beams by controlling the phase and amplitude of signals fed to individual elements in an array, including calibration techniques and multi-antenna configurations.
Technologies enabling dynamic control over electromagnetic wave propagation using arrays of passive or active elements (unit cells) to reflect, refract, or absorb signals, often for channel optimization or energy efficiency.
Specialized welding or bonding techniques and apparatuses tailored for joining small-scale electronic components, integrated circuits, or semiconductor wafers, emphasizing precision, miniaturization, and electrical connectivity.
Patents
Showing 1-10 of 89