Company patents
CHROMA ATE INC.
CHROMA ATE INC. exhibits a surprising shift in its patent strategy, with its dominant "Electrical Measurement" category, representing 52.9% of its portfolio, showing a significant decline of -57.9% so far in 2026, indicating a potential re-prioritization. Concurrently, while showing volatility, "Printed Circuits & Electronic Assemblies" saw a remarkable 350.0% year-over-year growth in 2024, suggesting an emerging focus on semiconductor assembly technologies despite a subsequent decline in 2025.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
119 US filings (since 2023) · 12 categories · 26 themes
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.
Design and assembly of power conversion, distribution, and protection modules, focusing on compact form factors, efficient electrical connections, and robust protective measures for electronic systems, often in high-power applications.
Software, algorithms, and associated hardware for monitoring, controlling, and optimizing battery performance, safety, and lifespan, including charge/discharge cycles, thermal regulation, and system integration.
Devices and methods for accurately measuring or monitoring electrical current draw and power usage in various systems, often for control, optimization, or safety purposes.
Focuses on the structural integrity, housing, mounting, and physical integration of battery cells into robust and protected packs within electric vehicles, including manufacturing considerations.
Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Utilizing optical systems, cameras, and image processing algorithms for precise measurement of physical dimensions, alignment, defects, and features on semiconductor wafers or packages.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Methods and systems for identifying anomalies, failures, or impending issues within electric motors or their associated drive and power management circuits, often by monitoring electrical or operational parameters.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Innovations in the physical design, materials, fabrication, or packaging of photodetectors and optical sensor elements, including thermoelectric, NIR-compliant, and self-mixing interference types, to improve performance or integration.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Processes and apparatus for disassembling spent batteries and recovering valuable materials (e.g., metals, electrolytes, plastics) through mechanical, chemical, or electrochemical methods for reuse or sustainable disposal.
Process and equipment for producing solid-state battery cells, including solid electrolyte synthesis (sulfide/oxide/polymer), thin-film deposition, lamination, sintering, dry-electrode fabrication, and stacking under controlled atmosphere.
Techniques and systems for measuring three-dimensional shapes, depths, or surface profiles using optical principles, including diffraction, interferometry, structured light, and imaging.
Slurry compositions and coating processes for battery electrodes, including binder/active-material slurries, surface coating layers, and electrode-to-foil adhesion for cathode and anode.
Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.
Systems and methods for accurately measuring and compensating for position, orientation, and movement errors in mechanical systems, often for manufacturing, robotics, or optical alignment.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Systems designed to manage the temperature of multiple components in electric or hybrid vehicles, such as batteries, electric motors, power electronics, and the passenger cabin, often using shared or interconnected cooling/heating circuits.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.
Patents
Showing 1-8 of 8
Power Consumption & Current Sensing