Coretronic Corporation

A heat dissipation module and a projection device are provided. The heat dissipation module is used to dissipate heat from an integrating element of the projection device. The integrating element has a light incident surface, a light-emitting surface, and an optical axis. The heat dissipation module includes a rotating member, a first fixing frame, and a second fixing frame. The rotating member is adjacent to the light incident surface and includes a substrate and a driving device. The first fixing frame surrounds the integrating element along a circumferential direction of the integrating element. The first fixing frame has a peripheral surface and fins disposed at intervals. An extending direction of each fin is not parallel to the optical axis. The second fixing frame surrounds along a circumferential direction of the first fixing frame and has a space with the peripheral surface. The fins are disposed in the space.

A heat dissipation module is provided and includes an elastic component, a heat conduction component, a TEC chip and a heat dissipation component. The elastic component includes a body where the heat conduction component is disposed and at least two slab parts extending outward from the body. The TEC chip has a first surface thermally connected on the heat conduction component and a second surface thermally connected on the heat dissipation component. The heat dissipation component is fixed to the slab parts. The orthographic projection of the body on the TEC chip overlaps the first surface, and the area of the orthographic projection of the body on the TEC chip is less than or equal to the area of the first surface, and thus the elastic force which is generated from the body is applied to the inner side of the TEC chip.

An optical engine module including a circuit board, a light valve module, a thermal conductive member, and a supporting member is provided. The circuit board having a first surface, a second surface opposite to the first surface, a first opening hole and at least one second opening hole. The light valve module is disposed on the first surface and electrically connected to the circuit board. The thermal conductive member is disposed on the second surface of the circuit board and is connected to a back surface of the light valve module through the first opening hole of the circuit board. A supporting member is disposed on one side of the first surface of the circuit board. The supporting member is partially in contact with the light valve module, and is connected to the thermal conductive member through the at least one second opening hole of the circuit board.

A projection device includes an optical engine module including a housing having an accommodating space, a transmissive light valve disposed in the accommodating space and located between a focusing lens and an optical sheet, and a fan module disposed in the housing and having a first air outlet and a second air outlet is provided. The accommodating space is divided into a first inner circulation zone and a second inner circulation zone. The focusing lens is disposed in the first inner circulation zone, and a first gap is formed between the focusing lens and the transmissive light valve. The optical sheet is disposed in the second inner circulation zone, and a second gap is formed between the transmissive light valve and the optical sheet. The fan module provides a first airflow to the first gap and a second airflow to the second gap.

A light valve module and a projection device with the light valve module are provided. The light valve module includes a light valve, an interposer substrate, a thermal conductive component, and a flexible circuit board. The light valve includes a connection surface with a heat dissipation region and an electrical connection region. The interposer substrate includes a first surface and a second surface. The interposer substrate is disposed on the connection surface and is electrically connected to the at least one light valve by the first surface. The thermal conductive component is adjacently disposed with the interposer substrate and has a thermal conductive surface which is attached to the heat dissipation region. The flexible circuit board is disposed on the interposer substrate and the thermal conductive component, and the interposer substrate is electrically connected to the flexible circuit board by the second surface.

A light source device includes a heat dissipation base, a circuit board, a light source unit, a mask cover, a plurality of pressing members, and a plurality of first fasteners. The circuit board is disposed on the heat dissipation base. The light source unit, which is electrically connected to the circuit board, is disposed on the heat dissipation base and located in a through hole of the circuit board. The plurality of pressing members is fixed on the mask cover. The plurality of first fasteners passes through the mask cover, the plurality of circuit board, and the heat dissipation base in sequence, to fasten the mask cover and the circuit board on the heat dissipation base, and the mask cover is connected to the light source unit on the heat dissipation base through the plurality of pressing members.

A heat dissipating module includes a casing including a bottom plate and a water inlet; a cover plate disposed on one side of the casing opposite to the bottom plate; a pressurizing device moving back and forth in the casing and having a maximum stroke; a water pump disposed between the bottom plate and the pressurizing device, where liquid fills a space between the water pump and the pressurizing device to define a water tank; and a stop valve disposed in the water tank and located between the pressurizing device and the water pump. According to a direction from the bottom plate to the cover plate, the height of the water inlet is lower than the stop valve. The heat dissipating module has a small volume and is configured to flip at multiple angles. A projection device including the heat dissipating module and having structural reliability is also provided.

A thermal module including a heat sink and a projector are provided. The heat sink includes a body and heat sink fins. The body includes a fixed plate and partition plates. The fixed plate has a first surface, a second surface and a third surface. The first surface is opposite to the second surface, and the third surface is connected to the first and second surfaces. Spaces form between the partition plates, and the heat sink fin is disposed correspondingly in each space. Each heat sink fin has a corrugated structure with multiple segments, and a fractured structure is provided on the surface of each segment. The third surface and the side surface connected to the end surfaces of the partition plates form an air guide surface, and the heat sink receives or discharges air flow with the air guide surface.

A heat dissipation module configured to dissipate heat from a rotating element rotated with a first axis as a rotation axis is provided. The heat dissipation module includes at least one first fan and a heat dissipation component. The at least one first fan includes a first fan outlet. A first airflow generated by the at least one first fan flows from the first fan outlet to the rotating element. The heat dissipation component includes an inlet duct, a plurality of inner ducts and at least one outlet duct. The plurality of inner ducts are communicated to the inlet duct and the at least one outlet duct. The inlet duct of the heat dissipation component is disposed corresponding to a rotation tangential direction of the rotating element, and the rotation tangential direction is perpendicular to the first axis. In addition, a projection device is also mentioned.

A heat-dissipating module including heat-dissipating fins and heat pipes is provided. The heat-dissipating fins include first and second heat-dissipating fins arranged in an interleaved, spaced apart manner, and arranged in parallel along a first direction. The first heat-dissipating fins have interleaved first vias and first breach holes. The second heat-dissipating fins have interleaved second vias and second breach hole. The first breach holes and the second breach holes are arranged along a second direction, and the second vias respectively correspond to the first vias. The first direction is not parallel to the second direction. The heat pipes are configured to pass through the first vias and the second vias. A position of the orthogonal projection of a first breach hole formed on the second heat-dissipating fins along the first direction and the corresponding second breach hole are not overlap or are partially overlapped, and are arranged in symmetry.