DAI NIPPON PRINTING CO., LTD.

Techniques and structural designs for fabricating the physical layers of an OLED display, including material deposition, patterning, and methods to protect the active organic layers from environmental degradation like moisture and oxygen.

Innovations in backlight units, optical films, and light management structures to enhance display performance, uniformity, viewing experience, or specific functionalities like touch.

Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.

Focuses on the structural integrity, housing, mounting, and physical integration of battery cells into robust and protected packs within electric vehicles, including manufacturing considerations.

Adhesive compositions specifically formulated to bind active materials within battery electrodes, emphasizing properties like electrolyte resistance, adhesion to current collectors, and processability for manufacturing.

Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.

Components and techniques aimed at improving the visual quality of OLED displays, such as color accuracy, contrast, brightness uniformity, and reducing reflections or glare through optical layers and coatings.

Layered glass or film structures designed to optimize optical (e.g., light transmission, reflection, diffusion) and/or thermal (e.g., insulation, heat reflection/absorption) performance in windows, displays, and lighting applications.

Multi-layer polymer films engineered to provide superior barrier properties against gases (e.g., oxygen), moisture, or aromas, often incorporating heat-sealing or resealing mechanisms for food and product preservation.

Process and equipment for producing solid-state battery cells, including solid electrolyte synthesis (sulfide/oxide/polymer), thin-film deposition, lamination, sintering, dry-electrode fabrication, and stacking under controlled atmosphere.

Methods and structures for incorporating touch sensing capabilities directly into OLED display panels, typically involving conductive layers and insulating layers within or on top of the display stack.

Containers or packaging components featuring active mechanisms for controlled release, preparation, or delivery of their contents, such as liquids, bulk materials, volatile compounds, or single-serve portions.

Slurry compositions and coating processes for battery electrodes, including binder/active-material slurries, surface coating layers, and electrode-to-foil adhesion for cathode and anode.

Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Systems that combine light sources, waveguides, and display elements into unified products for backlighting, automotive applications, general lighting, or color-corrected displays.

Optical and pixel-defining materials for display panels, including black matrix compositions, color filter pigments, optical alignment films, and pixel-define layers.

Development of adhesive compositions that are applied in a molten state and solidify upon cooling, focusing on specific polymer blends, additives, and their resulting mechanical or optical properties.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Adhesive formulations designed for high transparency and minimal light distortion, primarily used in optical components, display devices, and protective films where visual clarity is paramount.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Adhesive technologies focused on environmental benefits such as biodegradability, natural origin, or designed for easy debonding and re-bonding to facilitate recycling, reuse, or specific application needs.

Processes involving the application of heat and pressure to shape thermoplastic or elastomeric materials, often using molds or presses, to achieve specific forms or material properties.

Novel formulations and mechanisms for initiating or controlling the polymerization and cross-linking of adhesives, including dual-curing systems, radical polymerization, and partial curing for tailored material properties.

Chemical additives or surface treatment methods aimed at improving the bonding strength of adhesives to various substrates, including those with challenging surface chemistries or contaminants.

Processes and apparatus for disassembling spent batteries and recovering valuable materials (e.g., metals, electrolytes, plastics) through mechanical, chemical, or electrochemical methods for reuse or sustainable disposal.

Techniques for driving electrophoretic displays, including managing remnant voltage, optimizing particle movement, and specific addressing pulse schemes to improve optical quality and update speed.

Methods and equipment for continuously shaping plastic materials by forcing them through a die, often involving screw extruders, heating elements, and downstream calibration.

Development and application of textile materials with engineered properties such as waterproofing, thermal regulation, anti-cling, structural coloration, or enhanced filtration capabilities for specific performance needs.

Adhesive systems designed to lose their adhesive properties or debond upon exposure to specific wavelengths of light, often utilized for temporary bonding in sensitive manufacturing processes like semiconductor fabrication.

Optical systems and components specifically designed for head-mounted displays, augmented reality (AR) glasses, and virtual reality (VR) headsets, focusing on image projection, waveguide integration, and display durability.

Development and optimization of organic chemical compounds and their structures, including guest-host systems and metal complexes, used within the emission layer to achieve specific light emission characteristics such as color, efficiency, and operational lifetime.

Application of protective layers to improve the durability and longevity of components by enhancing resistance to wear, oxidation, or chemical degradation in demanding operational environments.

Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.

Software, algorithms, and associated hardware for monitoring, controlling, and optimizing battery performance, safety, and lifespan, including charge/discharge cycles, thermal regulation, and system integration.

Active anode materials and manufacturing techniques for rechargeable lithium-ion batteries, including silicon-carbon composites, graphite, lithium-metal anodes, and electrode coating processes that improve capacity, cycle life, and rate capability.

Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.