Company patents
Delta Electronics (Shanghai) Co., Ltd.
Delta Electronics (Shanghai) Co., Ltd. appears to be significantly shifting its patent strategy, with a notable decline across many core areas. While Power Conversion (DC/AC, DC/DC) still dominates with 50.6% of its portfolio, it saw a substantial 55.1% decline in 2026 so far, mirroring similar drops in Magnets & Inductors (-53.8%) and Power Distribution & Storage (-58.8%) for the partial year. However, there's an emerging focus on Hardware Platform (Cooling, Power, Packaging), which experienced a remarkable 300.0% growth in 2026 so far, and a 100.0% growth in Impedance Networks (Filters, Resonators) for the partial year, suggesting a strategic pivot towards specific hardware and semiconductor components.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
482 US filings (since 2023) · 12 categories · 30 themes
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Design and assembly of power conversion, distribution, and protection modules, focusing on compact form factors, efficient electrical connections, and robust protective measures for electronic systems, often in high-power applications.
Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.
Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.
Design and control of power supply architectures that combine multiple power sources (e.g., AC grid, DC battery, generators) or modular battery units, often featuring switching, conversion, and redundancy for enhanced reliability and flexibility.
Techniques for efficiently supplying power to electronic devices, managing battery charge/discharge cycles, optimizing power consumption, and converting power between different voltage levels or AC/DC for improved energy efficiency and longevity.
Integration of power converters with energy storage devices (batteries, supercapacitors) or grid interfaces, often involving AC/DC conversion, power flow management, and fault handling for hybrid power systems or specific applications like EVs or PV.
Technologies for efficiently delivering power to electric vehicles, encompassing fast charging, wireless charging, and smart grid integration, alongside vehicle-side control and management of the charging process.
Development and processing of metal powders with specific magnetic properties, including soft magnetic alloys, permanent magnet materials, and insulated powders for electronic components, often involving precise control of particle size, morphology, and composition.
Intelligent control systems that manage the connection and disconnection of power, including pre-charging capacitive loads, reclosing after faults, or isolating parts of a grid based on detected conditions, often involving smart switches and relays with adaptive logic.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Systems and devices that utilize controlled magnetic fields, often generated by electromagnets, to produce mechanical motion, precise positioning, or manipulate physical phenomena like plasma distribution.
Systems and methods for transferring electrical energy without physical contact, often utilizing inductive or resonant coupling, including antenna design, resonance tracking, and control mechanisms for efficient power delivery.
Devices and methods for accurately measuring or monitoring electrical current draw and power usage in various systems, often for control, optimization, or safety purposes.
Techniques and circuits for accurately identifying various electrical faults, such as ground faults, overcurrent, short circuits, switch malfunctions, or electrostatic discharge (ESD) events, often utilizing sensors, signal processing, and diagnostic algorithms.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Methods and systems for identifying anomalies, failures, or impending issues within electric motors or their associated drive and power management circuits, often by monitoring electrical or operational parameters.
Software, algorithms, and associated hardware for monitoring, controlling, and optimizing battery performance, safety, and lifespan, including charge/discharge cycles, thermal regulation, and system integration.
Methods and structures for encapsulating, interconnecting, and integrating impedance network components, particularly acoustic filters, into larger modules or systems.
Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.
Circuits designed to transform the impedance of a source to match the impedance of a load, maximizing power transfer or minimizing signal reflections, often involving inductors, capacitors, and transformers.
Systems that incorporate solar panels as a primary or auxiliary power source for various applications, including visual displays, remote devices, and portable battery charging, often emphasizing efficiency and adaptability.
Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.
Specialized hardware, architectural designs, and computational methods to improve the speed, efficiency, and security of artificial intelligence and machine learning model execution, particularly for inference and data processing.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Systems designed to manage the temperature of multiple components in electric or hybrid vehicles, such as batteries, electric motors, power electronics, and the passenger cabin, often using shared or interconnected cooling/heating circuits.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.
Patents
Showing 1-10 of 158
High-Density Magnetic Component Integration