Company patents
Denka Company Limited
DENKA COMPANY LIMITED's patent strategy reveals a surprising, albeit short-lived, surge in Non-metallic Inorganic Compounds, with a remarkable 170.0% YoY growth in 2024, indicating a brief but intense focus in this area. Despite this, the company appears to be shifting priorities across its materials portfolio, with significant declines in patenting activity in categories like Polymer Additives (down 72.7% so far in 2026) and Polymer Compositions (down 73.7% so far in 2026), suggesting a broader re-evaluation of its core material science innovations.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
478 US filings (since 2023) · 12 categories · 42 themes
Polymer compositions incorporating inorganic or organic filler materials to impart specific functional properties such as thermal conductivity, flame retardancy, electrical conductivity, or enhanced mechanical strength and dimensional stability.
Polymer compositions engineered for enhanced heat resistance, thermal stability in molten states, or improved processability at high temperatures, often involving specific copolymers, blends, or stabilizing additives for applications in electronics or automotive.
Materials added to polymers to modify their thermal transfer properties, typically increasing conductivity for heat dissipation in applications like electronics or battery packs.
Methods and compositions for identifying, quantifying, or characterizing specific biological molecules (e.g., nucleic acids, proteins, metabolites, antibodies) or microbial species, often for diagnostic, prognostic, or quality control applications.
Development of adhesive compositions that are applied in a molten state and solidify upon cooling, focusing on specific polymer blends, additives, and their resulting mechanical or optical properties.
Development and application of polymer compositions designed for reprocessability, recyclability, or incorporating sustainable additives, often featuring reversible bonds or bio-based components.
Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.
Development of rubber and elastomer compositions, often involving specific polymer blends, additives (e.g., process oils, reinforcing agents), and cure packages, to achieve desired mechanical properties like abrasion resistance, wet grip, shear durability, or flexibility for demanding applications.
Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.
Polymer compositions tailored for medical and biological applications, including implantable devices, drug delivery systems, and diagnostic tools, emphasizing properties like biocompatibility, hydrolysis resistance, optical clarity, and specific mechanical characteristics.
Methods for synthesizing high-purity lithium compounds, such as lithium carbonate, lithium sulfide, or composite salts, specifically optimized for use in battery electrodes or electrolytes.
Novel formulations and mechanisms for initiating or controlling the polymerization and cross-linking of adhesives, including dual-curing systems, radical polymerization, and partial curing for tailored material properties.
Synthesis and processing of silicon and silicon carbide materials in various forms (e.g., particles, nanowires, films) for applications beyond traditional semiconductors, such as battery components, refractories, or advanced electronics.
Methods and processes for fabricating ceramic matrix composites (CMCs), including preform creation, infiltration techniques, and densification to form complex shapes with enhanced properties.
Development and optimization of organic chemical compounds and their structures, including guest-host systems and metal complexes, used within the emission layer to achieve specific light emission characteristics such as color, efficiency, and operational lifetime.
Polymers incorporating reversible bonds or crosslinks that enable reprocessing, self-healing, or tunable mechanical properties, often responding to stimuli like heat, light, or pH for de-crosslinking and re-crosslinking.
Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.
Ceramic materials and components engineered for specific functional applications, such as electronics, energy storage, wear resistance, or high-temperature heating elements.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Multi-layer polymer films engineered to provide superior barrier properties against gases (e.g., oxygen), moisture, or aromas, often incorporating heat-sealing or resealing mechanisms for food and product preservation.
Substances incorporated into polymer systems to control or enhance adhesive properties, cross-linking reactions, or processing characteristics such as mold release and flow.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Adhesive compositions specifically formulated to bind active materials within battery electrodes, emphasizing properties like electrolyte resistance, adhesion to current collectors, and processability for manufacturing.
Mixtures of liquid crystal compounds and other additives, such as monomers or carbon black, designed to achieve specific optical, electrical, or physical properties for use in liquid crystal displays (LCDs) or other electro-optical devices.
Adhesive technologies focused on environmental benefits such as biodegradability, natural origin, or designed for easy debonding and re-bonding to facilitate recycling, reuse, or specific application needs.
Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.
Methods for layer-by-layer deposition or 3D printing of concrete and cement-based materials, often employing rapidly hydrating binders or specialized compositions for rapid setting.
Concrete compositions and structures enhanced with reinforcing elements or functional additives to achieve improved mechanical properties, durability, or specific functionalities beyond basic structural support.
Development of concrete and cement compositions utilizing waste products, alternative binders, or eco-friendly additives to reduce environmental impact and resource consumption.
Formulated liquid compositions designed for specific industrial applications, such as non-flammable cleaning, thermal management in electronics, or as low-viscosity, high-flash-point base fluids.
Design and modification of antibodies or antibody-derived fragments for targeted therapeutic intervention, including bispecific formats, Fc region modifications, and activatable constructs.
Specialized design and fabrication of light-emitting diodes specifically engineered to produce light in the deep ultraviolet (DUV) spectrum, often for applications like sterilization or curing.
Abrasive slurry compositions used in semiconductor manufacturing for planarizing wafer surfaces, typically containing abrasive particles and chemical additives to achieve specific material removal rates and selectivity.
Novel methods and reactor designs for polymer synthesis, focusing on improving efficiency, achieving continuous production, or controlling specific polymer architectures and product morphologies like particle size or sheet formation.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Adhesive systems designed to lose their adhesive properties or debond upon exposure to specific wavelengths of light, often utilized for temporary bonding in sensitive manufacturing processes like semiconductor fabrication.
Chemical additives or surface treatment methods aimed at improving the bonding strength of adhesives to various substrates, including those with challenging surface chemistries or contaminants.
Light-initiated polymerization processes used to create structures, coatings, or components, particularly for electronic devices, displays, or additive manufacturing, often involving photoinitiators and specific monomer/oligomer compositions.
Adhesive formulations designed for high transparency and minimal light distortion, primarily used in optical components, display devices, and protective films where visual clarity is paramount.
Layered glass or film structures designed to optimize optical (e.g., light transmission, reflection, diffusion) and/or thermal (e.g., insulation, heat reflection/absorption) performance in windows, displays, and lighting applications.
Multi-layered materials incorporating fiber layers (e.g., carbon, non-carbon, fabric, mesh) within a polymer or ceramic matrix to achieve enhanced mechanical properties such as strength, stiffness, impact resistance, or tailored hardness for demanding structural applications.
Protective layers applied to ceramic or composite substrates to enhance resistance against extreme temperatures, corrosion, or erosion in harsh operating environments.
Patents
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