DEXERIALS CORPORATION

Innovations in backlight units, optical films, and light management structures to enhance display performance, uniformity, viewing experience, or specific functionalities like touch.

Devices and systems designed to protect electrical circuits from overcurrents, short circuits, and other faults, often involving rapid response, high voltage/current handling, and sophisticated interruption mechanisms.

Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.

Layered glass or film structures designed to optimize optical (e.g., light transmission, reflection, diffusion) and/or thermal (e.g., insulation, heat reflection/absorption) performance in windows, displays, and lighting applications.

Mixtures of liquid crystal compounds and other additives, such as monomers or carbon black, designed to achieve specific optical, electrical, or physical properties for use in liquid crystal displays (LCDs) or other electro-optical devices.

Polymer compositions incorporating inorganic or organic filler materials to impart specific functional properties such as thermal conductivity, flame retardancy, electrical conductivity, or enhanced mechanical strength and dimensional stability.

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.

Methods and structures employed within switches and circuit breakers to safely and efficiently quench electrical arcs generated during contact separation, preventing damage and ensuring reliable interruption.

Materials added to polymers to modify their thermal transfer properties, typically increasing conductivity for heat dissipation in applications like electronics or battery packs.

Light-initiated polymerization processes used to create structures, coatings, or components, particularly for electronic devices, displays, or additive manufacturing, often involving photoinitiators and specific monomer/oligomer compositions.

Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.

Polymer compositions engineered for enhanced heat resistance, thermal stability in molten states, or improved processability at high temperatures, often involving specific copolymers, blends, or stabilizing additives for applications in electronics or automotive.

Substances incorporated into polymer systems to control or enhance adhesive properties, cross-linking reactions, or processing characteristics such as mold release and flow.

Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.

Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.

Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.

Development of adhesive compositions that are applied in a molten state and solidify upon cooling, focusing on specific polymer blends, additives, and their resulting mechanical or optical properties.

Adhesive compositions specifically formulated to bind active materials within battery electrodes, emphasizing properties like electrolyte resistance, adhesion to current collectors, and processability for manufacturing.

Optical and pixel-defining materials for display panels, including black matrix compositions, color filter pigments, optical alignment films, and pixel-define layers.

Systems that combine light sources, waveguides, and display elements into unified products for backlighting, automotive applications, general lighting, or color-corrected displays.

Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.

Development and optimization of organic chemical compounds and their structures, including guest-host systems and metal complexes, used within the emission layer to achieve specific light emission characteristics such as color, efficiency, and operational lifetime.

Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.

Optical systems and components specifically designed for head-mounted displays, augmented reality (AR) glasses, and virtual reality (VR) headsets, focusing on image projection, waveguide integration, and display durability.

Techniques for driving electrophoretic displays, including managing remnant voltage, optimizing particle movement, and specific addressing pulse schemes to improve optical quality and update speed.

Multi-layer polymer films engineered to provide superior barrier properties against gases (e.g., oxygen), moisture, or aromas, often incorporating heat-sealing or resealing mechanisms for food and product preservation.

Techniques for building three-dimensional metal objects layer-by-layer using metal powders, including powder bed fusion, binder jetting, and directed energy deposition. This theme encompasses process mechanics, equipment design, and operational control for AM systems.

Adhesive technologies focused on environmental benefits such as biodegradability, natural origin, or designed for easy debonding and re-bonding to facilitate recycling, reuse, or specific application needs.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.