Company patents

Dialog Semiconductor (UK) Limited

Dialog Semiconductor (UK) Limited's patent strategy appears to be undergoing a significant shift, with a surprising and near-complete cessation of new patent filings across almost all categories in 2025, including its dominant area of Power Conversion (DC/AC, DC/DC) which previously constituted 60.9% of its portfolio but saw a -100.0% YoY decline in 2025. This widespread decline, with only Magnets & Inductors maintaining a stable filing rate (0% YoY) and Amplifiers showing a slight resurgence in 2025 after a -100.0% drop in 2024, suggests a dramatic re-evaluation or divestment of its intellectual property strategy.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

64 US filings (since 2023) · 12 categories · 15 themes

Advanced Power Converter Topologies

Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.

Power Conversion (DC/AC, DC/DC)
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34since 2023
n/a
Control & Stability for Power Converters

Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.

Power Conversion (DC/AC, DC/DC)
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18since 2023
n/a
High-Density Magnetic Component Integration

Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.

Power Conversion (DC/AC, DC/DC)Magnets & Inductors
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9since 2023
-50.0%YoY
Power Driver & Reliability

Design of power driver circuits for electric loads (e.g., LEDs, heating elements) focusing on efficiency, stability, noise reduction, and compensation for component degradation.

Electric Heating & Lighting Control
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8since 2023
n/a
Fan-Out & Embedded Die Packaging

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.

Semiconductor Packaging & EncapsulationChip-to-Chip Interconnect (Bonding, Bumps)
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6since 2023
-50.0%YoY
Power Switching & Drivers

Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.

Pulse / Digital Logic Circuits
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6since 2023
n/a
Amplifier Error & Offset Correction

Methods and circuits to detect and compensate for various imperfections in amplifier operation, such as DC offset, gain errors, phase errors, duty-cycle errors, or input error components, to improve accuracy and signal integrity.

Amplifiers
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4since 2023
0.0%YoY
Power Consumption & Current Sensing

Devices and methods for accurately measuring or monitoring electrical current draw and power usage in various systems, often for control, optimization, or safety purposes.

Electrical Measurement
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4since 2023
n/a
3D Die Stacking & Vertical Interconnects

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Semiconductor Packaging & EncapsulationChip-to-Chip Interconnect (Bonding, Bumps)
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3since 2023
n/a
Battery Management Systems

Software, algorithms, and associated hardware for monitoring, controlling, and optimizing battery performance, safety, and lifespan, including charge/discharge cycles, thermal regulation, and system integration.

Power Distribution & StorageElectrical Measurement
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3since 2023
n/a
Electronic System Layout & Integration

Automated methods and tools for generating, optimizing, and verifying the physical layout and interconnections of electronic components, including integrated circuits, printed circuit boards, and system-level interface protection.

Electronic Design Automation (CAD/EDA)
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3since 2023
n/a
High-Efficiency Power Amplifiers

Circuit designs and control techniques focused on maximizing the power conversion efficiency of amplifiers, especially for radio frequency (RF) or audio applications, often involving load modulation, envelope tracking, or specific amplifier classes (e.g., Class-D, Doherty).

Amplifiers
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2since 2023
new
Transimpedance & Transconductance Amplifiers

Specialized amplifier types designed for converting current to voltage (transimpedance) or voltage to current (transconductance), often featuring virtual ground configurations, precise gain setting, and compensation for input/output characteristics.

Amplifiers
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2since 2023
new
High-Speed Clock & Data

Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.

Pulse / Digital Logic Circuits
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1since 2023
n/a
EV Charging Systems & Control

Technologies for efficiently delivering power to electric vehicles, encompassing fast charging, wireless charging, and smart grid integration, alongside vehicle-side control and management of the charging process.

Power Distribution & Storage
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1since 2023
n/a

Patents

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