Company patents
Diodes Incorporated
Diodes Incorporated's patent strategy shows a surprising shift, with its largest category, Semiconductor Diodes & Transistors (24.1% of portfolio), experiencing a significant decline of -78.8% in 2026 so far, after a strong showing in 2025. Concurrently, the company had an emerging focus in Semiconductor Manufacturing Process, which saw a remarkable +325.0% growth in 2025, indicating a potential pivot towards foundational process innovation, although patenting in this area has also declined so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
166 US filings (since 2023) · 12 categories · 23 themes
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Focuses on the design and manufacturing of transistors where the gate material fully encircles the channel, often using nanosheets or fins, to improve electrostatic control and reduce short-channel effects.
Development and manufacturing of semiconductor devices using wide bandgap materials like Silicon Carbide (SiC) or Gallium Nitride (GaN) for high-power, high-frequency, or high-temperature applications.
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Structural innovations in individual transistors, such as fin-based field-effect transistors (FinFETs), 3D gate structures, or multi-layer active regions, aimed at improving performance or density.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Design of power driver circuits for electric loads (e.g., LEDs, heating elements) focusing on efficiency, stability, noise reduction, and compensation for component degradation.
Systems and methods for dynamically adjusting light output, distribution, color, or intensity based on environmental conditions, user presence, content, or specific application needs.
Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Specialized digital and mixed-signal circuits for controlling and reading out quantum bits (qubits), including generating precise modulated RF signals and integrating with photonic components for quantum operations.
Development and optimization of organic chemical compounds and their structures, including guest-host systems and metal complexes, used within the emission layer to achieve specific light emission characteristics such as color, efficiency, and operational lifetime.
Devices and methods for accurately measuring or monitoring electrical current draw and power usage in various systems, often for control, optimization, or safety purposes.
Methods for designing, transmitting, and utilizing specific reference signals (e.g., DMRS, SRS, PT-RS) to enable accurate channel estimation, interference measurement, synchronization, or sensing in wireless communication systems.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Methods and systems for identifying anomalies, failures, or impending issues within electric motors or their associated drive and power management circuits, often by monitoring electrical or operational parameters.
Techniques and circuits designed to detect, estimate, and mitigate various physical layer signal impairments such as frequency spurs, phase noise, or non-linear distortions, thereby improving overall signal quality and system performance.
Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.
Patents
Showing 1-10 of 30
Advanced Metallization & Contacts