Company patents
DISCO CORPORATION
DISCO CORPORATION's patent strategy reveals a strong, albeit fluctuating, commitment to its core "Semiconductor Manufacturing Process" (47.7% of portfolio), which saw a significant 25.8% YoY growth in 2025 before a partial year decline in 2026. Surprisingly, while its traditional manufacturing categories like "Welding & Soldering" and "Grinding & Polishing" remain substantial, the company is showing an emerging focus on "Semiconductor Testing" and "Semiconductor Packaging & Encapsulation," which experienced rapid growth of 112.5% and 100.0% respectively in 2025, indicating a strategic pivot towards advanced semiconductor backend processes.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
908 US filings (since 2023) · 12 categories · 22 themes
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Methods and apparatus for cleaning polishing pads, dressers, chamber components, or finished substrates to remove residues, debris, or contaminants, often involving specialized nozzles, fluids, or mechanical actions.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.
Specialized cleaning techniques and apparatus designed for removing microscopic contaminants, residues, or films from sensitive substrates, such as semiconductor wafers or flat panel displays, often involving chemical, mechanical, or plasma-based methods.
Techniques and systems utilizing laser beams for precise material modification, including cutting, cladding, ablation, and surface treatment, often for joining, shaping, or removing material.
Integration of robotics, sensors, and control systems to automate the grinding, polishing, or deburring process, including workpiece handling, tool adjustment, and system maintenance for improved efficiency and precision.
Systems and methods for precisely controlling welding parameters such as power, speed, oscillation, and material feed to optimize weld quality, consistency, and efficiency, often involving automated or semi-automated processes.
Specialized welding or bonding techniques and apparatuses tailored for joining small-scale electronic components, integrated circuits, or semiconductor wafers, emphasizing precision, miniaturization, and electrical connectivity.
Design and application of abrasive tools and deburring heads tailored for specific geometries, materials, or access constraints, including flexible, expandable, or multi-component designs for precision finishing.
Techniques and devices for measuring, monitoring, and controlling the surface topography, film thickness, or other characteristics of a workpiece during or after grinding/polishing to achieve specific finish requirements.
Processes involving chemical and mechanical forces to planarize surfaces (CMP) or wet chemical treatments for cleaning, etching, or material removal, often utilizing specialized compositions, nozzles, or fluid management systems.
Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Focuses on the chemical and physical properties of polishing slurries and the design of polishing pads, including their material composition, groove patterns, and thermal characteristics, to optimize chemical-mechanical planarization processes.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.
Systems and methods for accurately measuring and compensating for position, orientation, and movement errors in mechanical systems, often for manufacturing, robotics, or optical alignment.
Techniques and systems for measuring three-dimensional shapes, depths, or surface profiles using optical principles, including diffraction, interferometry, structured light, and imaging.
Patents
Showing 1-10 of 1596