Company patents
DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD's patent strategy is heavily concentrated in Electrical Connectors, representing 87.4% of its portfolio, yet this core area saw a significant decline of 43.2% so far in 2026, following a 66.7% rebound in 2025. Surprisingly, despite its small share, Printed Circuits & Electronic Assemblies, which had been declining, shows an emerging focus with a 100.0% growth so far in 2026, indicating a potential shift in R&D priorities.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
350 US filings (since 2023) · 4 categories · 12 themes
Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Design techniques and components within connectors to minimize signal degradation, crosstalk, and impedance mismatches for high-frequency data transmission.
Structural design and manufacturing techniques for bundling multiple wires into harnesses, including protective layers like braiding and interlocking armor, and methods for assembly and termination.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.
Development of polymer compositions and material structures for electrical insulation and protective sheathing of cables, focusing on properties like flame retardancy, flexibility, and semiconductivity.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Development of new conductive materials, including powders, composites, and alloys, designed for specific electrical performance, manufacturing processes, or applications beyond basic copper wires.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Patents
Showing 1-8 of 8
Device Enclosure & Material Engineering